SIST EN ISO 11553-1:2005

Safety of machinery - Laser processing machines - Part 1: General safety requirements (ISO 11553-1:2005)

This Standard describes hazards generated by laser processing machines and specifies the safety requirements relating to radiation hazards and hazards generated by materials and substances. It also specifies the information to be supplied by the manufacturer of such equipment.

Sicherheit von Maschinen - Laserbearbeitungsmaschinen - Teil 1: Allgemeine Sicherheitsanforderungen (ISO 11553-1:2005)

Dieser Teil von ISO 11553 beschreibt Gefährdungen, die durch Laserbearbeitungsmaschinen nach 3.2 hervorgerufen werden, und legt nur die Sicherheitsanforderungen hinsichtlich elektro-magnetischer Strahlungsgefährdungen und durch Materialien und Substanzen erzeugter Gefährdungen fest. Er legt auch die Informationen fest, die von den Herstellern solcher Anlagen mitgeliefert werden müssen.
Anforderungen an die Beseitigung oder Verminderung von Risiken durch Lärm sind nicht in dieser Norm enthalten. Diese Anforderungen sollen in einer späteren Änderung eingeführt werden.
Er ist nicht anwendbar auf Laserprodukte oder Einrichtungen, die solche Produkte beinhalten, die alleinig und ausdrücklich für die folgenden Anwendungen hergestellt werden:
-   Photolithographie;
-   Stereolithographie;
-               Holographie;
-   Medizinische Anwendungen (nach IEC 60601 2 22);
-   Datenspeicherung.

Sécurité des machines - Machines a laser - Partie 1: Prescriptions générales de sécurité (ISO 11553-1:2005)

Varnost strojev - Laserski obdelovalni stroji - 1. del: Splošne varnostne zahteve (ISO 11553-1:2005)

General Information

• Status: Withdrawn
• Publication Date: 31-May-2005
• Withdrawal Date: 11-Jan-2009
• ICS: 13.110 - Safety of machinery
• ICS: 31.260 - Optoelectronics. Laser equipment
• Technical Committee: VAZ - Healthcare
• Current Stage: 9900 - Withdrawal (Adopted Project)
• Start Date: 09-Jan-2009
• Due Date: 01-Feb-2009
• Completion Date: 12-Jan-2009
• Directive: 98/37/EC - Machinery
• Mandate: M/BC/CEN/88/13 - Standardization request to CEN/CENELEC relating to machinery
• Ref Project: EN ISO 11553-1:2005 - Safety of machinery - Laser processing machines - Part 1: General safety requirements (ISO 11553-1:2005)

Relations

• Replaces: SIST EN 12626:1998 - Safety of machinery - Laser processing machines - Safety requirements (ISO 11553:1996 modified)
• Effective Date: 01-Jun-2005
• Replaced By: SIST EN ISO 11553-1:2009 - Safety of machinery - Laser processing machines - Part 1: General safety requirements (ISO 11553-1:2005)
• Effective Date: 01-Mar-2009

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN ISO 11553-1:2005
01-junij-2005
1DGRPHãþD
SIST EN 12626:1998
Varnost strojev - Laserski obdelovalni stroji - 1. del: Splošne varnostne zahteve
(ISO 11553-1:2005)
Safety of machinery - Laser processing machines - Part 1: General safety requirements
(ISO 11553-1:2005)
Sicherheit von Maschinen - Laserbearbeitungsmaschinen - Teil 1: Allgemeine
Sicherheitsanforderungen (ISO 11553-1:2005)
Sécurité des machines - Machines a laser - Partie 1: Prescriptions générales de sécurité
(ISO 11553-1:2005)
Ta slovenski standard je istoveten z: EN ISO 11553-1:2005
ICS:
13.110 Varnost strojev Safety of machinery
31.260 Optoelektronika, laserska Optoelectronics. Laser
oprema equipment
SIST EN ISO 11553-1:2005 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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EUROPEAN STANDARD
EN ISO 11553-1

NORME EUROPÉENNE

EUROPÄISCHE NORM
February 2005
ICS 31.260; 13.110 Supersedes EN 12626:1997
English version
Safety of machinery - Laser processing machines - Part 1:
General safety requirements (ISO 11553-1:2005)
Sécurité des machines - Machines à laser - Partie 1: Sicherheit von Maschinen - Laserbearbeitungsmaschinen -
Prescriptions générales de sécurité (ISO 11553-1:2005) Teil 1: Allgemeine Sicherheitsanforderungen (ISO 11553-
1:2005)
This European Standard was approved by CEN on 24 December 2004.

CEN members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national
standards may be obtained on application to the Central Secretariat or to any CEN member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN member into its own language and notified to the Central Secretariat has the same status as the official
versions.

CEN members are the national standards bodies of Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France,
Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia,
Slovenia, Spain, Sweden, Switzerland and United Kingdom.




EUROPEAN COMMITTEE FOR STANDARDIZATION
COMITÉ EUROPÉEN DE NORMALISATION

EUROPÄISCHES KOMITEE FÜR NORMUNG

Management Centre: rue de Stassart, 36  B-1050 Brussels
© 2005 CEN All rights of exploitation in any form and by any means reserved Ref. No. EN ISO 11553-1:2005: E
worldwide for CEN national Members.

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EN ISO 11553-1:2005 (E)





Foreword


This document (EN ISO 11553-1:2005) has been prepared by Technical Committee ISO/TC 172
"Optics and optical instruments" in collaboration with Technical Committee CEN/TC 123 "Lasers
and laser-related equipment", the secretariat of which is held by DIN.

This European Standard shall be given the status of a national standard, either by publication of
an identical text or by endorsement, at the latest by August 2005, and conflicting national
standards shall be withdrawn at the latest by August 2005.

This document supersedes EN 12626:1997.

This document has been prepared under a mandate given to CEN by the European Commission
and the European Free Trade Association, and supports essential requirements of EU
Directive(s).

For relationship with EU Directive(s), see informative Annex ZA, which is an integral part of this
document.

According to the CEN/CENELEC Internal Regulations, the national standards organizations of
the following countries are bound to implement this European Standard: Austria, Belgium,
Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary,
Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland,
Portugal, Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom.


Endorsement notice

The text of ISO 11553-1:2005 has been approved by CEN as EN ISO 11553-1:2005 without any
modifications.

2

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EN ISO 11553-1:2005 (E)




ANNEX ZA
(informative)

Relationship between this European Standard and the Essential
Requirements of EU Directive 98/37 EEC


This European Standard has been prepared under a mandate given to CEN by the European

Commission and the European Free Trade Association to provide a means of conforming to
Essential Requirements of the New Approach Directive 98/37 EEC.

Once this standard is cited in the Official Journal of the European Communities under that
Directive and has been implemented as a national standard in at least one Member State,
compliance with the normative clauses of this standard given in Table ZA. confers, within the
limits of the scope of this standard, a presumption of conformity with the corresponding Essential
Requirements of that Directive and associated EFTA regulations.
WARNING: Other requirements and other EU Directives may be applicable to the product(s)
falling within the scope of this standard.



3

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INTERNATIONAL ISO
STANDARD 11553-1
First edition
2005-02-01

Safety of machinery — Laser processing
machines —
Part 1:
General safety requirements
Sécurité des machines — Machines à laser —
Partie 1: Prescriptions générales de sécurité




Reference number
ISO 11553-1:2005(E)
©
ISO 2005

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ISO 11553-1:2005(E)
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ii © ISO 2005 – All rights reserved

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ISO 11553-1:2005(E)
Contents Page
Foreword. iv
Introduction . v
1 Scope. 1
2 Normative references . 1
3 Terms and definitions. 2
4 Hazards . 3
5 Safety requirements and measures . 5
6 Verification of safety requirements and measures . 9
7 Information for user . 10
8 Labelling. 11
Annex A (informative) Potential hazards. 12
Annex B (informative) Protection against other hazards . 15
Bibliography . 16

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ISO 11553-1:2005(E)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards bodies
(ISO member bodies). The work of preparing International Standards is normally carried out through ISO
technical committees. Each member body interested in a subject for which a technical committee has been
established has the right to be represented on that committee. International organizations, governmental and
non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely with the
International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization.
International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2.
The main task of technical committees is to prepare International Standards. Draft International Standards
adopted by the technical committees are circulated to the member bodies for voting. Publication as an
International Standard requires approval by at least 75 % of the member bodies casting a vote.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. ISO shall not be held responsible for identifying any or all such patent rights.
ISO 11553-1 was prepared by Technical Committee ISO/TC 172, Optics and photonics, Subcommittee SC 9,
Electro-optical systems, in collaboration with IEC/TC 76, Optical radiation safety and laser equipment.
This first edition of ISO 11553-1 cancels and replaces ISO 11553:1996, which has been technically revised.
ISO 11553 consists of the following parts, under the general title Safety of machinery — Laser processing
machines:
 Part 1: General safety requirements
 Part 2: Safety requirements for hand-held laser processing devices
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ISO 11553-1:2005(E)
Introduction
The Machinery Safety Directive issued by the Council of the EEC outlines essential and mandatory
requirements that must be met in order to ensure that machinery is safe. In response, CEN/CENELEC
initiated a programme to produce safety standards for machines and their applications. This part of ISO 11553
is one in that series.
It has been prepared as a harmonized standard to provide a means of conforming with the essential safety
requirements of the Machinery Directive and associated EFTA Regulations.
This document is a type B standard as stated in ISO 12100-1. The provisions of this document may be
supplemented or modified by a type C standard.
For machines which are covered by the scope of a type C standard and which have been designed and built
according to the provision of that standard, the provisions of that type C standard take precedence over the
provisions of this type B standard.
It is applicable to machines using laser radiation to process materials. The purpose of this part of ISO 11553 is
to prevent injuries to persons by
 listing potential hazards generated by machines containing lasers,
 specifying safety measures and verifications necessary for reducing the risk caused by specific
hazardous conditions,
 providing references to pertinent standards, and
 specifying the information which is to be supplied to the users so that they can establish proper
procedures and precautions.

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INTERNATIONAL STANDARD ISO 11553-1:2005(E)

Safety of machinery — Laser processing machines —
Part 1:
General safety requirements
1 Scope
This part of ISO 11553 describes hazards generated by laser processing machines, as defined in 3.2, and
specifies the safety requirements relating to radiation hazards and hazards generated by materials and
substances. It also specifies the information to be supplied by the manufacturers of such equipment.
Requirements dealing with noise as a hazard from laser processing machines are not included in this part of
ISO 11553. They will be included in a subsequent amendment.
This part of ISO 11553 is not applicable to laser products, or equipment containing such products, which are
manufactured solely and expressly for the following applications:
 photolithography;
 stereolithography;
 holography;
 medical applications (per IEC 60601-2-22);
 data storage.
2 Normative references
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
ISO 3864:1984, Safety colours and safety signs
ISO 11252:2004, Lasers and laser-related equipment — Laser device — Minimum requirements for
documentation
ISO 12100-1:2003, Safety of machinery — Basic concepts, general principles for design — Part 1: Basic
terminology, methodology
ISO 12100-2:2003, Safety of machinery — Basic concepts, general principles for design — Part 2: Technical
principles
ISO 13849-1:1999, Safety of machinery — Safety-related parts of control systems — Part 1: General
principles for design
ISO 14118:2000, Safety of machinery — Prevention of unexpected start-up
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ISO 11553-1:2005(E)
ISO 14119:1998, Safety of machinery — Interlocking devices associated with guards — Principles for design
and selection
IEC 60204-1:1997, Safety of machinery — Electrical equipment of machines — Part 1: General requirements
IEC 60825-1:2001, Safety of laser products — Part 1: Equipment classification, requirements and user's guide
IEC 60825-4:1997, Safety of laser products — Part 4: Laser guards
3 Terms and definitions
For the purposes of this document, the terms and definitions given in ISO 12100-1 and IEC 60825-1 and the
following apply.
3.1
machine
assembly of linked parts or components, at least one of which moves, with the appropriate actuators, control
and power circuits, joined together for a specific application, in particular for the processing, treatment, moving
or packaging of a material
[ISO 12100-1]
3.2
laser processing machine
machine in which (an) embedded laser(s) provide(s) sufficient energy/power to melt, evaporate, or cause a
phase transition in at least a part of the workpiece, and which has the functional and safety completeness to
be ready-to-use
3.3
location with controlled access
location where the hazard is inaccessible except to authorized persons who have received adequate training
in laser safety and servicing of the system involved
NOTE See Table 1.
3.4
location with restricted access
location where the hazard is inaccessible to the public but may be accessible to other observers or other
untrained personnel who are kept from being exposed to the hazards of laser processing by barriers or other
methods
NOTE See Table 1.
3.5
location with unrestricted and uncontrolled access
location where access is not limited or controlled
NOTE See Table 1.
Table 1 — Description of locations
Location
Controlled Restricted Unrestricted and uncontrolled
Authorized and trained in laser Personnel untrained in laser safety
People All, including the public
safety but not the public
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ISO 11553-1:2005(E)
3.6
(preventive) maintenance
performance of those adjustments or procedures specified in user information, which are intended to be
performed by the user for the purpose of assuring the intended performance of the product
EXAMPLES Replenishment of consumables and cleaning.
3.7
manufacturer
individual or organization that assembles the laser processing machine
NOTE 1 Where a laser processing machine is imported, the importer assumes the responsibilities of the manufacturer.
NOTE 2 An individual or organization that is responsible for modification of a machine is regarded as a manufacturer.
3.8
modification
change to the machine which makes it capable of processing materials in a manner which differs from the
original design, or which makes it capable of processing materials different from what was envisaged in the
original design, or which affects the safety characteristics of a machine
3.9
process zone
area where the laser beam interacts with the material of the workpiece
3.10
production
phase during which the machine is used as intended, including the following operations:
 loading and unloading of parts and/or materials to be processed;
 processing during which the laser beam works alone or in conjunction with other tools
NOTE The loading/unloading can be fully or partly automated or manual.
3.11
service
corrective maintenance
performance of those procedures or adjustments described in the manufacturer's service instructions which
may affect any aspect of a product's performance
EXAMPLES Fault diagnosis, equipment strip-down and repairing.
3.12
subassembly
constituent part needed for proper performance of the laser processing machine
NOTE A laser processing subassembly can be of any laser class in accordance with IEC 60825-1.
3.13
workpiece
material intended to be processed, i.e. the target of the laser beam
4 Hazards
4.1 General
The following subclauses outline areas of concern associated with materials processing with lasers.
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ISO 11553-1:2005(E)
4.2 Inherent hazards
The following hazards (see ISO 12100-1 and ISO 12100-2) may be generated by a laser processing machine:
 mechanical hazards;
 electrical hazards;
 thermal hazards;
 vibration hazards;
 radiation hazards, such as
 hazards generated by direct or reflected laser beam,
 hazards generated by ionizing radiation,
 hazards generated by collateral (UV, microwave, etc.) radiation produced, for example, by flash
lamps, discharge tubes or RF-power sources, and
 hazards generated by secondary radiation due to beam effect (the wavelength of the secondary
radiation may be different from that of the beam);
 hazards generated by materials and substances, such as
 hazards due to products which are used in the machine (e.g. laser gases, laser dyes, lasing gases,
solvents),
 hazards resulting from interaction between the beam and the material (e.g. fumes, particles, vapours,
debris), fire or explosion,
 hazards from associated gases (see for example 5.3.4) used to assist laser target interactions and
from any fumes that are produced; these hazards include explosion, fire, toxic effects and oxygen
depletion;
 hazards generated by neglecting ergonomic principles in machine design.
4.3 Hazards created by external effects (interferences)
Power conditions and the environment in which the machine operates may cause the machine to malfunction,
thus giving rise to hazardous conditions and/or making it necessary for someone to intervene within hazard
zones.
Additional environmental interferences include
 temperature,
 humidity,
 external shock/vibration,
 vapours, dust or gases from the environment,
 electromagnetic/radio frequency interference,
 source voltage interruption/fluctuation, and
 insufficient hardware/software compatibility and integrity.
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ISO 11553-1:2005(E)
4.4 Hazards covered by this part of ISO 11553
Only radiation hazards and hazards generated by the laser interaction with materials and substances are dealt
with in this part of ISO 11553. Other potential hazards are listed in Annex A.
5 Safety requirements and measures
5.1 General requirements
The extent to which hazards are covered is indicated in the Scope. Machinery shall comply as appropriate
with ISO 12100-1 and ISO 12100-2 for hazards which are not covered by this part of ISO 11553.
Manufacturers shall ensure the safety of laser processing machines by
 hazard identification and analysis,
 implementation of safety measures,
 certification and verification of the safety measures, and
 provision of appropriate information for the user.
Based on the hazard identification (see 5.2), appropriate safety measures shall be incorporated into the laser
processing machine by design and manufacture.
The following requirements shall be satisfied:
 each manufacturer shall comply with the safety requirements and measures stipulated in this clause;
 the manufacturer of an installed machine shall be responsible for the compliance of the whole machine,
including subassemblies.
NOTE These requirements apply even if the manufacturer and the customer/user are the same legal entity.
These measures shall take into account each hazard listed in Clause 4, and the results of the hazard analysis,
and should take into account information in Annexes A and B.
5.2 Risk assessment
A risk assessment shall be performed
 for all phases of machine “life” (as applicable); for examples see ISO 12100-1;
 after each modification of the machine by the person or organization responsible for the modification.
A risk assessment includes but is not limited to
a) hazards listed in 4.2 and 4.3;
b) danger zones, particularly those associated with
 the laser system,
 the laser beam path/beam delivery system, and
 the process zone;
c) "interferences” listed in 4.3.
The results of the risk assessment shall be duly documented. Concerning principles for risk assessment, see
also EN 1050.
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ISO 11553-1:2005(E)
5.3 Implementation of corrective measures
5.3.1 General
Safety measures shall be incorporated in the machine by design and manufacture as specified in 5.3.2 to
5.3.4.
5.3.2 Protection against laser radiation hazards
5.3.2.1 General
5.3.2.1.1 For laser processing machines operating in locations with unrestricted and uncontrolled access,
the possibility that people be exposed to levels of laser radiation exceeding the accessible emission limit
(AEL) for Class 1 shall be eliminated during production. Access to radiation in excess of the AEL for which
direct viewing is not permitted shall be eliminated for maintenance.
To satisfy these requirements, the following conditions shall be met.
 Unauthorized human access to a danger zone shall be prevented by engineering measures as stipulated
in IEC 60825-1 and ISO 12100-1 and ISO 12100-2.
5.3.2.1.2 For laser processing machines operating in locations with restricted or controlled access, the
possibility that people be exposed to levels of laser radiation exceeding the maximum permissible exposure
4
(MPE) at the ocular exposure limits for 3 × 10 seconds exposure shall be eliminated during production
(normal or otherwise).
To satisfy this requirement, the following conditions shall be met.
 A Risk Assessment shall be performed. Unauthorized human access to a danger zone should be
prevented by engineering measures as specified in IEC 60825-1 and ISO 12100-1 and ISO 12100-2.
 If access cannot be prevented, exposure above the ocular MPE shall be eliminated by use of engineering
or administrative controls, including Personal Protective Equipment (PPE).
5.3.2.1.3 For all laser processing machines, without regard to restricted or controlled access, the following
shall apply.
 If human presence in a danger zone is unavoidable while the machine is functioning (e.g. during service),
the machine shall be equipped with means for direct control of machine motion, beam direction and beam
stop (see 5.3.3.5).
 The design of protective devices, such as shutters, guards, beam dissipation devices and
deterring/impeding devices, shall meet the requirements specified in IEC 60825-1 and ISO 12100-1 and
ISO 12100-2. A single protective device may be used to provide simultaneous protection against more
than one hazard.
 Laser guards shall comply with requirements specified in IEC 60825-4.
5.3.2.2 Protection during production
The principal danger zone is usually the process zone but the danger zone shall be defined as a result of the
risk assessment.
The hazard analysis shall indicate which type of guarding (local protection or peripheral protection) is to be
used.
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ISO 11553-1:2005(E)
Local protection is a method of guarding to reduce laser radiation and associated optical radiation to a safe
level based on a risk assessment (e.g. by means of a nozzle or a small guard fitted close to the beam focus at
the workpiece) without totally enclosing the workpiece, the workpiece support and/or machine motion system.
Peripheral protection is a method of guarding to reduce laser radiation and associated optical radiation to a
safe level based on a risk assessment by means of one or more distant guards (e.g. a protective enclosure)
that enclose the workpiece, workpiece support and, usually, most of the machine motion system. The sort of
protection will depend on several factors, for instance:
 the direction (fixed or variable) of beam propagation with regard to the workpiece;
 the type of machining operation to be realized (cutting, welding, etc.);
 the material and shape of the workpiece to be processed;
 the workpiece support;
 the visibility of the process zone.
5.3.2.3 Protection during service
During service procedures, human access to laser radiation exceeding the AEL for Class 1 is sometimes
unavoidable. Machines shall therefore be designed, and appropriate safety measures provided, with respect
to the following four situations (listed in order of preference):
a) servicing takes place outside danger zones;
b) servicing takes place in danger zones to which access is controlled in the same manner as during
production;
c) servicing takes place in a danger zone (e.g. with open guards that are normally closed during production)
but accessible laser radiation does not exceed the AEL for Class 1;
d) servicing takes place in danger zones, for example because opening of guards (normally closed during
production) is necessary. In this case accessible laser radiation exceeds the AEL for Class 1.
The manufacturer shall indicate the class of accessible laser radiation and recommended safety procedures
for each of these situations.
5.3.2.4 Protection during teaching, programming and programme verification
During teaching, path programming and programme verification, human access to laser radiation exceeding
the AEL for Class 1 should be prevented. If this condition cannot be met, the same requirements as for
servicing shall apply. See also 5.3.3.5.
5.3.3 Control means and circuits
Control means and circuits shall comply with IEC 60204-1. The design of control systems shall comply with
ISO 13849-1.
NOTE Typically, this would result in Safety Category 3.
5.3.3.1 Start/stop controls
The machine stop control shall stop the machine (i.e. switch off actuators) and either isolate the laser beam or
deactivate laser beam generation. The laser stop control shall deactivate beam generation.
Separate control devices may be provided for the laser system and the rest of the machine.
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ISO 11553-1:2005(E)
5.3.3.2 Emergency stop control
The emergency stop control shall comply with IEC 60204-1.
The emergency stop control shall
 deactivate laser beam generation and automatically position the laser beam stop,
 deactivate the machine (i.e. actuator power off), and
 switch off the laser power supply and discharge all stored energy.
If a laser device is used for several machines which work separately from one another, the emergency stop
control located on one of the machines shall work as above, or
 deactivate the relevant machine (i.e. actuator power off), and
 isolate the laser beam optical path leading to the relevant machine.
Unexpected start-up shall be prevented by compliance with ISO 14118 and, for the emergency stop
equipment, ISO 13849-1 shall apply.
5.3.3.3 Interlocks and guard control
When guards (per ISO 12100-1 and ISO 12100-2) are opened or displaced, or safety interlocks are defeated,
automatic operation of the machine shall be impossible.
If
...