SIST EN 16602-60-13:2015
(Main)Space product assurance - Requirements for the use of COTS components
Space product assurance - Requirements for the use of COTS components
This standard defines the requirements for selection, control, procurement and usage of EEE commercial components for space projects.
This standard is applicable to commercial encapsulated active monolithic parts (integrated circuits and discrete):
• diodes
• microwave diodes
• integrated circuits
• microwave integrated circuits (MMIC)
• transistors
• microwave transistors
This standard is not applicable to the commercial parts from the following families:
• capacitors
• connectors
• crystals
• filters
• fuses
• heaters
• inductors
• microwave passive parts
• oscillators
• relays
• resistors
• switches
• thermistors
• transformers
• cables & wires
• hybrids
• surface acoustic waves (SAW)
• charge coupled devices (CCD)
• active pixel sensors (APS)
In addition, the following families of EEE components are not addressed by the present ECSS standard but it can be used as guideline and revisited on case/case basis:
• photodiodes
• light emitting diodes (LED)
• phototransistors
• opto-couplers
• laser diodes
In line with ECSS-Q-ST-60, this standard differentiates between three classes of components through three different sets of standardization requirements (clauses) to be met.
The three classes provide for three levels of trade-off between assurance and risk. The highest assurance and lowest risk is provided by class 1 and the lowest assurance and highest risk by class 3. Procurement costs are typically highest for class 1 and lowest for class 3. Mitigation and other engineering measures can decrease the total cost of ownership differences between the three classes. The project objectives, definition and constraints determine which class or classes of components are appropriate to be utilised within the system and subsystems.
a. Class 1 components are described in Clause 4
b. Class 2 components are described in Clause 5
c. Class 3 components are described in Clause 6
Annex G includes a diagram that summarizes the difference between these three classes for evaluation, screening and lot acceptance.
The requirements of this document are applicable to all parties involved at all levels in the integration of EEE commercial components into space segment hardware and launchers.
For easy tailoring and implementation of the requirements into a Requirement Management Tool, and for direct traceability to ECSS-Q-ST-60, requirements in this standards have been written in the way of a ECSS Applicability Requirement Matrix (EARM), as defined in Annex A of ECSS-S-ST-00 “ECSS system – Description, implementation and general requirements”.
This standard may be tailored for the specific characteristics and constrains of a space project in conformance with ECSS-S-ST-00.
Raumfahrtproduktsicherung - Anforderungen für die Nutzung von COTS-Komponenten
Assurance produit des projets spatiaux - Exigences pour l'utilisation de composants commerciaux sur étagère
Zagotavljanje varnih proizvodov v vesoljski tehniki - Zahteve za uporabo COST-komponent
Ta standard določa zahteve za izbiro, nadzor, nabavo in uporabo komercialnih električnih, elektronskih in elektromehanskih komponent (EEE) za vesoljske projekte. Ta standard se uporablja za komercialne vdelane aktivne monolitne dele (integrirana vezja in diskretne elemente): •diode •mikrovalovne diode •integrirana vezja •mikrovalovna integrirana vezja (MMIC) •tranzistorji •mikrovalovni tranzistorji Ta standard se ne uporablja za komercialne dele iz naslednjih družin: •kondenzatorji •priključki •kristali •filtri •varovalke •grelniki •induktorji •mikrovalovni pasivni deli •oscilatorji •releji •upori •stikala •termistorji •transformatorji •kabli in žice •hibridi •površinski zvočni valovi (SAW) •naprava za pretok električnega naboja (CCD) •senzorji za aktivne slikovne pike (APS) Naslednje družine električnih, elektronskih in elektromehanskih komponent tudi niso vključene v trenutni standard ECSS, vendar se standard lahko uporablja kot smernica in obravnava za vsak primer posebej: •fotodiode •svetleče diode (LED) •fototranzistorji •opto-sklopniki •laserske diode V skladu z ECSS-Q-ST-60 ta standard razlikuje med tremi razredi komponent s pomočjo treh različnih naborov standardizacijskih zahtev (določil), ki morajo biti izpolnjene. Ti trije razredi določajo tri ravni kompromisov med zagotovili in tveganjem. Največje zagotovilo in najmanjše tveganje zagotavlja razred 1, najmanjše zagotovilo in največje tveganje pa razred 3. Stroški nabave so običajno najvišji za razred 1 in najnižji za razred 3. Ukrepi za blažitev in drugi inženirski ukrepi lahko zmanjšajo skupne stroške lastniških razlik med temi tremi razredi. Cilji projekta, njegova opredelitev in omejitve določajo, kateri razred ali razredi komponent so ustrezni za uporabo v sistemu in podsistemih. a. Komponente razreda 1 so opisane v točki 4. b. Komponente razreda 2 so opisane v točki 5 c. Komponente razreda 3 so opisane v točki 6. Dodatek G vključuje shemo, ki povzema razlike med temi tremi razredi za ovrednotenje, presejanje in sprejemljivost serije. Zahteve tega dokumenta veljajo za vse vpletene strani na vseh ravneh integracije komercialnih električnih, elektronskih in elektromehanskih komponent v vesoljski strojni opremi in lansirnikih. Za lažje prilagajanje in uvajanje zahtev v orodje za upravljanje zahtev ter za neposredno sledljivost do ECSS-Q-ST-60 so zahteve v tem standardu napisane na način ECSS EARM (Applicability Requirement Matrix), kot je določeno v dodatku A k standardu ECSS-S-ST-00 »ECSS system – Description, implementation and general requirements« (Sistem ECSS – Opis, izvajanje in splošne zahteve). Ta standard se lahko prilagodi posameznim lastnostim in omejitvam vesoljskega projekta v skladu s standardom ECSS-S-ST-00.
General Information
Relations
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Zagotavljanje varnih proizvodov v vesoljski tehniki - Zahteve za uporabo COST-komponentRaumfahrtproduktsicherung - Anforderungen für die Nutzung von COTS-KomponentenAssurance produit des projets spatiaux - Exigences pour l'utilisation de composants commerciaux sur étagèreSpace product assurance - Requirements for the use of COTS components49.140Vesoljski sistemi in operacijeSpace systems and operationsICS:Ta slovenski standard je istoveten z:EN 16602-60-13:2015SIST EN 16602-60-13:2015en,fr,de01-oktober-2015SIST EN 16602-60-13:2015SLOVENSKI
STANDARD
SIST EN 16602-60-13:2015
EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN 16602-60-13
August 2015 ICS 49.140
English version
Space product assurance - Requirements for the use of COTS components
Assurance produit des projets spatiaux - Exigences pour l'utilisation de composants commerciaux sur étagère
Raumfahrtproduktsicherung - Anforderungen für die Nutzung von COTS-Komponenten This European Standard was approved by CEN on 16 November 2014.
CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels © 2015 CEN/CENELEC All rights of exploitation in any form and by any means reserved worldwide for CEN national Members and for CENELEC Members. Ref. No. EN 16602-60-13:2015 E SIST EN 16602-60-13:2015
EN 16602-60-13:2015 (E) 2 Table of contents European foreword . 4 Introduction . 4 1 Scope . 7 2 Normative references . 9 3 Terms, definitions and abbreviated terms . 11 3.1 Terms from other standards . 11 3.2 Terms specific to the present standard . 11 3.3 Abbreviated terms. 12 3.4 Conventions. 13 3.5 Nomenclature . 14 4 Requirements for class 1 components . 15 5 Requirements for class 2 components . 36 6 Requirements for class 3 components . 59 7 Quality levels . 74 8 Evaluation and lot acceptance for retinned parts . 75 9 Pure tin lead finish – risk analysis . 83 Annex A (normative) Component control plan (CCP) - DRD . 84 Annex B (normative) Declared components list (DCL) - DRD . 85 Annex C (normative) Internal Supplier’s specification - DRD . 86 Annex D (normative) Parts approval document - DRD . 88 Annex E (informative) EEE documents delivery per review . 89 Annex F (normative) Justification document - DRD . 90 Annex G (informative) Difference between the three classes . 93 Annex H (informative) Flow chart for construction analysis and destructive physical analysis . 94 SIST EN 16602-60-13:2015
EN 16602-60-13:2015 (E) 3 Bibliography . 98
Figures Figure 4-1: Evaluation tests flow chart for Class 1 components . 21 Figure 4-2: Lot acceptance tests flow chart for Class 1 components . 28 Figure 5-1: Evaluation Tests flow charts for Class 2 components . 42 Figure 5-2: Lot acceptance tests flow chart for Class 2 components . 51 Figure 6-1: Lot acceptance test flow chart for Class 3 components . 67 Figure 8-1: Evaluation flow chart for retinned parts – class 1 programmes . 76 Figure 8-2: Lot acceptance flow chart for retinned parts – class 1 programmes . 77 Figure 8-3: Evaluation flow chart for retinned parts – class 2 programmes . 79 Figure 8-4: Lot acceptance fl
...
SLOVENSKI STANDARD
kSIST FprEN 16602-60-13:2014
01-julij-2014
Zagotavljanje varnih proizvodov v vesoljski tehniki - Zahteve za uporabo COST-
komponent
Space product assurance - Requirements for the use of COTS components
Raumfahrtproduktsicherung - Anforderungen für die Nutzung von COTS-Komponenten
Assurance produit des projets spatiaux - Exigences pour l'utilisation de composants
commerciaux sur étagère
Ta slovenski standard je istoveten z: FprEN 16602-60-13
ICS:
49.140 Vesoljski sistemi in operacije Space systems and
operations
kSIST FprEN 16602-60-13:2014 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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kSIST FprEN 16602-60-13:2014
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kSIST FprEN 16602-60-13:2014
EUROPEAN STANDARD
FINAL DRAFT
FprEN 16602-60-13
NORME EUROPÉENNE
EUROPÄISCHE NORM
May 2014
ICS 49.140
English version
Space product assurance - Requirements for the use of COTS
components
Assurance produit des projets spatiaux - Exigences pour Raumfahrtproduktsicherung - Anforderungen für die
l'utilisation de composants commerciaux sur étagère Nutzung von COTS-Komponenten
This draft European Standard is submitted to CEN members for unique acceptance procedure. It has been drawn up by the Technical
Committee CEN/CLC/TC 5.
If this draft becomes a European Standard, CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal
Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
This draft European Standard was established by CEN and CENELEC in three official versions (English, French, German). A version in any
other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the
CEN-CENELEC Management Centre has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
Recipients of this draft are invited to submit, with their comments, notification of any relevant patent rights of which they are aware and to
provide supporting documentation.
Warning : This document is not a European Standard. It is distributed for review and comments. It is subject to change without notice and
shall not be referred to as a European Standard.
CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. FprEN 16602-60-13:2014 E
worldwide for CEN national Members and for CENELEC
Members.
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Table of contents
Foreword . 4
Introduction . 5
1 Scope . 7
2 Normative references . 9
3 Terms, definitions and abbreviated terms . 11
3.1 Terms from other standards . 11
3.2 Terms specific to the present standard . 11
3.3 Abbreviated terms. 12
3.4 Conventions. 13
3.5 Nomenclature . 14
4 Requirements for class 1 components . 15
5 Requirements for class 2 components . 36
6 Requirements for class 3 components . 59
7 Quality levels . 74
8 Evaluation and lot acceptance for retinned parts . 75
9 Pure tin lead finish – risk analysis . 83
Annex A (normative) Component control plan (CCP) - DRD . 84
Annex B (normative) Declared components list (DCL) - DRD . 85
Annex C (normative) Internal Supplier’s specification - DRD . 86
Annex D (normative) Parts approval document - DRD . 88
Annex E (informative) EEE documents delivery per review . 89
Annex F (normative) Justification document - DRD . 90
Annex G (informative) Difference between the three classes . 93
Annex H (informative) Flow chart for construction analysis and destructive
physical analysis . 94
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Bibliography . 98
Figures
Figure 4-1: Evaluation tests flow chart for Class 1 components . 21
Figure 4-2: Lot acceptance tests flow chart for Class 1 components . 28
Figure 5-1: Evaluation Tests flow charts for Class 2 components . 42
Figure 5-2: Lot acceptance tests flow chart for Class 2 components . 51
Figure 6-1: Lot acceptance test flow chart for Class 3 components . 67
Figure 8-1: Evaluation flow chart for retinned parts – class 1 programmes . 76
Figure 8-2: Lot acceptance flow chart for retinned parts – class 1 programmes . 77
Figure 8-3: Evaluation flow chart for retinned parts – class 2 programmes . 79
Figure 8-4: Lot acceptance flow chart for retinned parts – class 2 programmes . 80
Figure 8-5: Evaluation flow chart for retinned parts – class 3 programmes . 81
Figure 8-6: Lot acceptance flow chart for retinned parts – class 3 programmes . 82
Tables
Table 4-1: Evaluation Tests for Class 1 components . 21
Table 4-2: Screening tests for Class 1 components . 25
Table 4-3: Lot acceptance tests for Class 1 components . 29
Table 4-4: Documentation for Class 1 components . 35
Table 5-1: Evaluation Tests for Class 2 components . 43
Table 5-2: Screening tests for the Class 2 components . 48
Table 5-3: Lot acceptance tests for Class 2 components . 52
Table 5-4: Documentation for Class 2 components . 58
Table 6-1: Evaluation tests for Class 3 components . 63
Table 6-2: Screening tests for Class 3 components . 65
Table 6-3: Lot acceptance tests for Class 3 components . 68
Table 6-4: Documentation for Class 3 components . 73
Table H-1 : Construction analysis and DPA . 94
Table H-2 : Construction analysis sequence . 95
Table H-3 : Destructive physical analysis sequence . 97
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Foreword
This document (FprEN 16602-60-13:2014) has been prepared by Technical
Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN
(Germany).
This document (FprEN 16602-60-13:2014) originates from ECSS-Q-ST-60-13C.
This document is currently submitted to the Unique Acceptance Procedure.
This document has been developed to cover specifically space systems and will
the-refore have precedence over any EN covering the same scope but with a
wider do-main of applicability (e.g. : aerospace).
4
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Introduction
This standard is based on and complementary to ECSS-Q-ST-60C (with upward
revisions). This standard can only be used in conjunction with ECSS-Q-ST-60C
in its current revision. This standard applies only to commercial components -
as defined in its scope - which meet defined technical parameters that are on the
system application level demonstrated to be unachievable with existing space
components or only achievable with qualitative and quantitative penalties. The
standard requires that qualitative and quantitative penalties are specified, as
applicable, as a minimum in terms of quantifiable parameters such as:
functional capability, parts count, power dissipation, frequency of operation,
data/signal processing efficiency, interconnect complexity, mass, volume, …
For traceability to ECSS-Q-ST-60, the modifications or additions are marked in
blue. Text in black colour is unmodified text.
The objective of the EEE component selection, control, procurement and use
requirements is to ensure that EEE components used in a space project enables
the project to meet its mission requirements.
Important elements of EEE component requirements include:
a. component programme management,
b. component selection, evaluation and approval,
c. procurement,
d. handling and storage,
e. component quality assurance,
f. specific components, and
g. documentation.
The main tools which can be used to reach the objective are:
a. concurrent engineering,
b. standardization of component types,
c. characterization of components,
d. assessment of component manufacturers including declared
competencies and processes,
e. testing, screening, lot acceptance and periodic testing,
f. procurement specifications,
g. control and inspection,
h. control of nonconforming materials,
i. assessment and use of existing component data,
j. application of specific control to mitigate risk for components with
limited data or confidence, and
k. information management.
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The basic approach is as follows:
• The customer of a given space project defines the EEE component
requirements within the boundaries of this standard. They appear in the
appropriate clauses of the project requirements as defined in ECSS-M-ST-10.
• The supplier defines a component control plan to implement those
requirements into a system which enables, for instance, to control the
selection, approval, procurement, handling in a schedule compatible with
his requirements, and in a cost-efficient way.
• The supplier ensures that the applicable parts requirements are passed
down to lower level suppliers and ensure that they are compliant to these
parts requirements.
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1
Scope
This standard defines the requirements for selection, control, procurement and
usage of EEE commercial components for space projects.
This standard is applicable to commercial encapsulated active monolithic parts
(integrated circuits and discrete):
• diodes
• microwave diodes
• integrated circuits
• microwave integrated circuits (MMIC)
• transistors
• microwave transistors
This standard is not applicable to the commercial parts from the following
families:
• capacitors
• connectors
• crystals
• filters
• fuses
• heaters
• inductors
• microwave passive parts
• oscillators
• relays
• resistors
• switches
• thermistors
• transformers
• cables & wires
• hybrids
• surface acoustic waves (SAW)
• charge coupled devices (CCD)
• active pixel sensors (APS)
7
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In addition, the following families of EEE components are not addressed by the
present ECSS standard but it can be used as guideline and revisited on
case/case basis:
• photodiodes
• light emitting diodes (LED)
• phototransistors
• opto-couplers
• laser diodes
In line with ECSS-Q-ST-60, this standard differentiates between three classes of
components through three different sets of standardization requirements
(clauses) to be met.
The three classes provide for three levels of trade-off between assurance and
risk. The highest assurance and lowest risk is provided by class 1 and the lowest
assurance and highest risk by class 3. Procurement costs are typically highest
for class 1 and lowest for class 3. Mitigation and other engineering measures
can decrease the total cost of ownership differences between the three classes.
The project objectives, definition and constraints determine which class or
classes of components are appropriate to be utilised within the system and
subsystems.
a. Class 1 components are described in Clause 4
b. Class 2 components are described in Clause 5
c. Class 3 components are described in Clause 6
Annex G includes a diagram that summarizes the difference between these
three classes for evaluation, screening and lot acceptance.
The requirements of this document are applicable to all parties involved at all
levels in the integration of EEE commercial components into space segment
hardware and launchers.
For easy tailoring and implementation of the requirements into a Requirement
Management Tool, and for direct traceability to ECSS-Q-ST-60, requirements in
this standards have been written in the way of a ECSS Applicability
Requirement Matrix (EARM), as defined in Annex A of ECSS-S-ST-00 “ECSS
system – Description, implementation and general requirements”.
This standard may be tailored for the specific characteristics and constrains of a
space project in conformance with ECSS-S-ST-00.
8
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2
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS standard. For dated
references, subsequent amendments to, or revision of any of these publications
do not apply. However, parties to agreements based on this ECSS Standard are
encouraged to investigate the possibility of applying the more recent editions of
the normative documents indicated below. For undated references, the latest
edition of the publication referred to applies.
EN reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01
ECSS system - Glossary of terms
EN 16602-60 ECSS-Q-ST-60 Space product assurance - Electrical, electronic and
electromechanical (EEE) components
EN 16602-60-14 ECSS-Q-ST-60-14 Space product assurance - Relifing procedure - EEE
components
EN 16602-60-15 ECSS-Q-ST-60-15 Space product assurance – Radiation hardness
assurance – EEE components
ESCC 21300 Terms, definitions, abbreviations, symbols and units
ESCC 24900 Minimum requirements for controlling
environmental contamination of components
ESCC 25500 Methodology for the detection of pure tin in the
external surface finish of case and leads of EEE
components
MIL-STD-750 Test methods for semiconductor devices
MIL-STD-883 Test method standard microcircuits
JESD22-A101 Steady state temperature humidity bias life test
JESD22-A110 Highly accelerated temperature and humidity stress
test
JESD22-A113 Preconditioning of plastic surface mount devices
prior to reliability testing
JESD22-A121 Test Method for Measuring Whisker Growth on Tin
and Tin Alloy Surface Finishes
JESD22-B106 Resistance to soldering temperature for through hole
mounted devices
JESD-201 Environmental Acceptance Requirements for Tin
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Whisker Susceptibility of Tin and Tin Alloy Surface
Finishes
J-STD-020 Moisture/Reflow sensitivity classification for
nonhermetic solid state surface mount devices
J-STD-033 Handling, packing, shipping and use of moisture/
reflow sensitive surface mount devices
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3
Terms, definitions and abbreviated terms
3.1 Terms from other standards
For the purpose of this standard, the terms and definitions from ECSS-S-ST-00-01
apply.
For the purpose of this standard, the following terms and definitions from
ECSS-Q-ST-60 apply:
agent
characterization
commercial component
concurrent engineering
franchised distributor
parts engineer
parts procurer
qualified parts
screening
space qualified parts
3.2 Terms specific to the present standard
3.2.1 traceability information (trace code)
unique identifier used by manufacturers to label and trace a quantity of
components with a common manufacturing history and thereby common
characteristics.
NOTE 1 The notion of "lot of EEE parts" used for the radiation
and lot acceptance tests is defined by the trace code.
NOTE 2 Several trace codes can be part of a same delivery from
the manufacturer or the distributor.
NOTE 3 It is possible to have several diffusion lots (as per ESCC
21300) in the same trace code.
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3.3 Abbreviated terms
For the purpose of this Standard, the abbreviated terms from ECSS-S-ST-00-01
and the following apply:
Abbreviation Meaning
AOQ average outgoing quality
ASIC application specific integrated circuit
BGA ball grid array
CA construction analysis
CCD charge coupled device
CCP component control plan
CN change notice
CoC
certificate of conformance
CDR critical design review
CR change request
DCL declared components list
DPA
destructive physical analysis
DRD document requirement definition
DSM
deep Sub-Micron
Ea activation energy
ECSS
European Coordination for Space Standardization
EEE electrical, electronic, electromechanical
EFR
early failure rate
ESCC European space components coordination
GSE ground support equipment
HAST highly accelerated stress test
HTRB
high temperature reverse bias
JD justification document
LAT lot acceptance test
LED light emitting diode
LVT lot validation testing
MMIC microwave monolithic integrated circuit
PAD
parts approval document
PCB parts control board
PCN process change notice
PDA percent defective allowable
PED plastic encapsulated device
PIND particle impact noise detection
QBSD full quadrant back scatter electron detector
QCI quality conformance inspection
RFD request for deviation
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Abbreviation Meaning
RH relative humidity
RoHs restriction of the use of certain hazardous
substances
RVT radiation verification testing
SCSB Space Components Steering Board
SAM scanning accoustic microscopy
SEM scanning electron microscope
SMD surface mount device
TCI technology conformance inspection
Tg glassivation temperature
THB temperature humidity bias
Tj junction temperature
T/C thermal cycling
3.4 Conventions
a. The term “EEE component“ is synonymous with the terms "EEE Part",
"Component" or just "Part".
b. The term “for approval” means that a decision of the approval authority
is necessary for continuing the process.
c. The term “for review” means that raised reviewers comments are
considered and dispositioned.
d. The term “for information” means that no comments are expected about
the delivered item.
e. For the purpose of clear understanding of this document, hereunder is a
listing of component categories which are covered by the term EEE
component, encapsulated or non-encapsulated, irrespective of the quality
level:
1. Capacitors
2. Connectors
3. Crystals
4. Discrete semiconductors (including diodes, transistors)
5. Filters
6. Fuses
7. Magnetic components (e.g. inductors, transformers, including in-
house products)
8. Monolithic Microcircuits (including MMICs)
9. Hybrid circuits
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10. Relays
11. Resistors, heaters
12. Surface acoustic wave devices
13. Switches (including mechanical, thermal)
14. Thermistors
15. Wires and Cables
16. Optoelectronic Devices (including opto-couplers, LED, CCDs,
displays, sensors)
17. Passive Microwave Devices (including, for instance, mixers,
couplers, isolators and switches)
NOTE Microwave switches consisting of multiple EEE
components are considered as equipment. The
requirements of this standard are applicable to the
EEE parts they incorporate and to microwave
switches having a simple design (single EEE part).
3.5 Nomenclature
The following nomenclature applies throughout this document:
a. The word “shall” is used in this Standard to express requirements. All
the requirements are expressed with the word “shall”.
b. The word “should” is used in this Standard to express recommendations.
All the recommendations are expressed with the word “should”.
NOTE It is expected that, during tailoring, recommendations
in this document are either converted into
requirements or tailored out.
c. The words “may” and “need not” are used in this Standard to express
positive and negative permissions, respectively. All the positive
permissions are expressed with the word “may”. All the negative
permissions are expressed with the words “need not”.
d. The word “can” is used in this Standard to express capabilities or
possibilities, and therefore, if not accompanied by one of the previous
words, it implies descriptive text.
NOTE In ECSS “may” and “can” have completely different
meanings: “may” is normative (permission), and
“can” is descriptive.
e. The present and past tenses are used in this Standard to express
statements of fact, and therefore they imply descriptive text.
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4
Requirements for class 1 components
Identifier Requirement Applicability
4.1 Component programme management
4.1.1 General
4.1.1a Applicable
4.1.2 Components control programme
4.1.2.1 Organization
4.1.2.1a Applicable
4.1.2.1b Applicable
4.1.2.2 Component control plan
4.1.2.2a Applicable
4.1.2.2b Applicable
4.1.2.2c Applicable
4.1.3 Parts control board
4.1.3a Applicable
4.1.3b Applicable
4.1.3c Applicable
4.1.3d Applicable
4.1.4 Declared component list
4.1.4a Applicable
4.1.4b Applicable
4.1.4c Applicable
4.1.4d After equipment CDR, all modifications affecting the JD Modified
information shall be implemented, in the "as design" DCL, through
the CN / CR process and submitted to the customer for approval.
NOTE For JD generation, see 4.2.4.d.
4.1.4e Applicable
4.1.4f Applicable
4.1.4g Applicable
4.1.4h Applicable
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4.1.5 Electrical and mechanical GSE
4.1.5a Applicable
4.1.5b Applicable
4.2 Component selection, evaluation and approval
4.2.1 General
4.2.1a Applicable
4.2.1b Applicable
4.2.2 Manufacturer and component selection
4.2.2.1 General rules
4.2.2.1a Applicable
4.2.2.1b Applicable
4.2.2.1c Applicable
4.2.2.1d Applicable
4.2.2.1e Applicable
4.2.2.1f Applicable
4.2.2.1g For the assessment of commercial components, the supplier shall New
collect the available data on the manufacturer and the component
in the JD specified in the requirement 4.2.4d.
NOTE It is important to check the exhaustiveness
of the manufacturer documentation & data
sheet with respect to e.g. the following
items:
• component marking,
• mechanical description,
• electrical and thermal description.
4.2.2.1h For Deep Sub-Micron Technologies (<90nm), the detailed test New
definition shall identify the technology through the construction
analysis and the application.
NOTE 1 It is important to ensure that the test
conditions remain as close as possible to
application.
NOTE 2 This requirement is important due to the
specificities of Deep Sub-Micron
Technologies (<90nm).
4.2.2.2 Parts and material restriction
4.2.2.2a Applicable
4.2.2.2b Applicable
4.2.2.2c Applicable
4.2.2.2d For limited life duration, known instability, safety hazards or Modified
reliability risk reasons, EEE components listed below shall not be
used:
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kSIST FprEN 16602-60-13:2014
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1. EEE components with pure tin (less than 3% Pb in case
of SnPb alloy) used as a finish on the leads, terminations
and external surfaces of components and packages.
NOTE For EEE components with pure tin, see also
requirements 4.2.2.2h and 4.2.2.2i.
2. Hollow core resistors
3. Potentiometers (except for mechanism position
monitoring)
4. Non-metallurgically bonded diodes
5. Semiconductor dice with unglassivated active area
6. Wet slug tantalum capacitors other than capacitor
construction using double seals and a tantalum case
7. Any component whose internal construction uses
metallurgic bonding with a melting temperature not
compatible with the end-application mounting
conditions
8. Wire link fuses < 5A
9. TO5 relays without double welding of the mechanism
to the header or with any type of integrated diodes
inside
4.2.2.2e Applicable
4.2.2.2f Applicable
4.2.2.2g Applicable
4.2.2.2h The use of pure tin (inside or outside the part) shall be declared in Modified
the JD.
4.2.2.2i To assess Pb free with tin finish whisker risk, the following actions New
shall be performed by the supplier:
1. In order to verify information from manufacturer
(included in the JD), as part of the incoming inspection,
check the lead finish of all procured lots as per ESCC
25500 basic specification.
2. When confirmed during incoming, assess individually
each use of pure tin termination through a RFD.
3. Submit each lot confirmed with pure tin terminations to
solder dip with an SnPb solder.
NOTE Solder dip for tin whisker mitigation
differs from solder dip for solderability in
that for tin whisker mitigation it is
required that the termination is coated
over its entire length, right up to the
package surface (no stand off).
4. Perform the retinning operation before screening and
before the lot acceptance test.
5. Before retinning of flight parts, document the hot solder
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kSIST FprEN 16602-60-13:2014
FprEN 16602-60-13:2014 (E)
dip process by a procedure to be submitted to customer
for approval.
6. Perform the evaluation of retinned components in
conformance with Figure 8-1 from the requirement 8.1a.
7. Perform the lot acceptance of retinned components in
conformance with Figure 8-2 from the requirement 8.1a.
4.2.2.3 Preferred sources
4.2.2.3a Not applicable
4.2.2.3b Not applicable
4.2.2.3c Applicable
4.2.2.4 Radiation hardness
4.2.2.4a Applicable
4.2.2.4b Applicable
4.2.2.4c Applicable
4.2.2.4d Applicable
4.2.2.4e Applicable
4.2.2.4f Applicable
4.2.2.4g Applicable
4.2.2.4h Applicable
4.2.2.4i Applicable
4.2.2.5 Derating
4.2.2.5a Applicable
4.2.2.5b Applicable
4.2.2.6 Temperature range
4.2.2.6a Commercial parts shall be selected in the highest available New
temperature range.
4.2.2.6b A minimum 10 °C margin shall be used between the maximum New
manufacturer temperature range and the application temperature
range (including worst cases).
4.2.2.6c In case |(manufacturer max temperature range – used max temp)| New
< 10 °C, an electrical characterisation shall be performed at used
temperature with an additional margin of 10 °C during the
evaluation step.
NOTE 1 Example: for a manufacturer -40°C/+85°C
temperature rang
...
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