SIST EN 16602-60:2023
(Main)Space product assurance - Electrical, electronic and electromechanical (EEE) components
Space product assurance - Electrical, electronic and electromechanical (EEE) components
The Scope of the Standard remains unchanged.
This standard defines the requirements for selection, control, procurement and usage of EEE components for space projects.
This standard differentiates between three classes of components through three different sets of standardization requirements (clauses) to be met.
The three classes provide for three levels of trade-off between assurance and risk. The highest assurance and lowest risk is provided by class 1 and the lowest assurance and highest risk by class 3. Procurement costs are typically highest for class 1 and lowest for class 3. Mitigation and other engineering measures may decrease the total cost of ownership differences between the three classes. The project objectives, definition and constraints determine which class or classes of components are appropriate to be utilised within the system and subsystems.
a. Class 1 components are described in Clause 4.
b. Class 2 components are described in Clause 5
c. Class 3 components are described in Clause 6.
The requirements of this document apply to all parties involved at all levels in the integration of EEE components into space segment hardware and launchers.
Space product assurance - Electrical, electronic and electromechanical (EEE) components
Assurance produit des projets spatiaux - Composants électriques, électroniques et électromécaniques (EEE)
La présente norme définit les exigences relatives à la sélection, au contrôle à l'approvisionnement et à l'utilisation des composants EEE dans le cadre des projets spatiaux.
La présente norme distingue trois classes de composants au moyen de trois ensembles différents d'exigences de normalisation (articles) à satisfaire.
Ces trois classes prévoient trois niveaux de compromis entre assurance et risque. L'assurance la plus élevée et le risque le plus bas sont fournis par la classe 1, et l'assurance la plus basse et le risque le plus élevé par la classe 3. Les coûts d'approvisionnement sont généralement les plus élevés pour la classe 1 et les plus bas pour la classe 3. La réduction et autres mesures d'ingénierie peuvent réduire les différences de coût global de possession entre les trois classes. Les objectifs, la définition et les contraintes du projet déterminent quelles classes de composants sont adaptées à une utilisation dans le système et les sous-systèmes.
a. Les composants de classe 1 sont décrits à l'Article 4.
b. Les composants de classe 2 sont décrits à l'Article 5.
c. Les composants de classe 3 sont décrits à l'Article 6.
Les exigences du présent document s'appliquent à toutes les parties impliquées à tous les niveaux de l'intégration des composants EEE dans le matériel de segment spatial et les lanceurs.
La présente norme peut être adaptée aux caractéristiques et contraintes spécifiques d'un projet spatial, conformément à l'ECSS-S-ST-00.
Zagotavljanje varnih proizvodov v vesoljski tehniki - Električne, elektronske in elektromehanske komponente
Ta standard določa zahteve za izbiro, nadzor, nabavo in uporabo električnih, elektronskih in elektromehanskih komponent (EEE) v vesoljski tehniki.
Ta standard razlikuje med tremi razredi komponent s pomočjo treh različnih naborov standardizacijskih zahtev (določil), ki morajo biti izpolnjene.
Ti trije razredi določajo tri ravni kompromisov med zagotovili in tveganjem. Največje zagotovilo in najmanjše tveganje zagotavlja razred 1, najmanjše zagotovilo in največje tveganje pa razred 3. Stroški nabave so običajno najvišji za razred 1 in najnižji za razred 3. Ukrepi za blažitev in drugi inženirski ukrepi lahko zmanjšajo skupne stroške lastniških razlik med temi tremi razredi. Cilji projekta, njegova opredelitev in omejitve določajo, kateri razred ali razredi komponent so ustrezni za uporabo v sistemu in podsistemih.
a. Komponente razreda 1 so opisane v točki 4.
b. Komponente razreda 2 so opisane v točki 5.
c. Komponente razreda 3 so opisane v točki 6.
Zahteve tega dokumenta veljajo za vse vpletene strani na vseh ravneh integracije električnih, elektronskih in elektromehanskih komponent v vesoljski strojni opremi in lansirnikih.
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
01-september-2023
Nadomešča:
SIST EN 16602-60:2015
Zagotavljanje varnih proizvodov v vesoljski tehniki - Električne, elektronske in
elektromehanske komponente
Space product assurance - Electrical, electronic and electromechanical (EEE)
components
Space product assurance - Electrical, electronic and electromechanical (EEE)
components
Assurance produit des projets spatiaux - Composants électriques, électroniques et
électromécaniques (EEE)
Ta slovenski standard je istoveten z: EN 16602-60:2023
ICS:
49.060 Letalska in vesoljska Aerospace electric
električna oprema in sistemi equipment and systems
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN 16602-60
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2023
ICS 49.140
Supersedes EN 16602-60:2015
English version
Space product assurance - Electrical, electronic and
electromechanical (EEE) components
Assurance produit des projets spatiaux - Composants Raumfahrtproduktsicherung - Elektrische,
électriques, électroniques et électromécaniques (EEE) elektronische und elektromechanische (EEE) Bauteile
This European Standard was approved by CEN on 30 January 2023.
CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for
giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical
references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to
any CEN and CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by
translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC
Management Centre has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Türkiye and United Kingdom.
CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels
© 2023 CEN/CENELEC All rights of exploitation in any form and by any means
Ref. No. EN 16602-60:2023 E
reserved worldwide for CEN national Members and for
CENELEC Members.
Table of contents
European Foreword . 7
Introduction . 7
1 Scope . 9
2 Normative references . 10
3 Terms, definitions and abbreviated terms . 12
3.1 Terms from other standards .12
3.2 Terms specific to the present standard .12
3.3 Abbreviated terms. 13
3.4 Conventions.15
3.5 Nomenclature .16
4 Requirements for Class 1 components . 17
4.1 Component programme management .17
4.1.1 General . 17
4.1.2 Components control programme . 17
4.1.3 Parts control board .17
4.1.4 Declared components list . 18
4.1.5 Electrical and mechanical GSE . 19
4.1.6 EQM components .19
4.2 Component selection, evaluation and approval . 20
4.2.1 General . 20
4.2.2 Manufacturer and component selection . 20
4.2.3 Component evaluation .24
4.2.4 Parts approval .26
4.3 Component procurement .27
4.3.1 General . 27
4.3.2 Procurement specification .27
4.3.3 Screening requirements . 28
4.3.4 Initial customer source inspection (precap) . 28
4.3.5 Lot acceptance .29
4.3.6 Final customer source inspection (buy-off) . 30
4.3.7 Incoming inspections .30
4.3.8 Radiation verification testing .31
4.3.9 Destructive physical analysis .31
4.3.10 Relifing .32
4.3.11 Manufacturer’s data documentation deliveries . 32
4.4 Handling and storage .33
4.5 Component quality assurance .33
4.5.1 General . 33
4.5.2 Nonconformances or failures .33
4.5.3 Alerts.34
4.5.4 Traceability .34
4.5.5 Lot homogeneity for sampling test . 35
4.6 Specific components .35
4.6.1 General . 35
4.6.2 ASICs.35
4.6.3 Hybrids .35
4.6.4 One time programmable devices . 35
4.6.5 Microwave monolithic integrated circuits . 36
4.6.6 Connectors .36
4.7 Documentation . 36
5 Requirements for Class 2 components . 38
5.1 Component programme management .38
5.1.1 General . 38
5.1.2 Components control programme . 38
5.1.3 Parts Control Board .38
5.1.4 Declared Components List .39
5.1.5 Electrical and mechanical GSE . 40
5.1.6 EQM components .40
5.2 Component selection, evaluation and approval . 40
5.2.1 General . 40
5.2.2 Manufacturer and component selection . 41
5.2.3 Component evaluation .44
5.2.4 Parts approval .46
5.3 Component procurement .46
5.3.1 General . 46
5.3.2 Procurement specification .47
5.3.3 Screening requirements . 47
5.3.4 Initial Customer Source Inspection (precap) . 48
5.3.5 Lot acceptance .48
5.3.6 Final customer source inspection (buy-off) . 49
5.3.7 Incoming inspections .49
5.3.8 Radiation verification testing .50
5.3.9 Destructive physical analysis .50
5.3.10 Relifing .51
5.3.11 Manufacturer’s data documentation deliveries . 51
5.4 Handling and storage .52
5.5 Component quality assurance .52
5.5.1 General . 52
5.5.2 Nonconformances or failures .52
5.5.3 Alerts.53
5.5.4 Traceability .53
5.5.5 Lot homogeneity for sampling test . 53
5.6 Specific components .53
5.6.1 General . 53
5.6.2 ASICs.53
5.6.3 Hybrids .54
5.6.4 One time programmable devices . 54
5.6.5 Microwave monolithic integrated circuits . 55
5.6.6 Connectors .55
5.7 Documentation . 55
6 Requirements for Class 3 components . 57
6.1 Component programme management .57
6.1.1 General . 57
6.1.2 Components control programme . 57
6.1.3 Parts control board .57
6.1.4 Declared components list . 57
6.1.5 Electrical and mechanical GSE . 58
6.1.6 EQM components .58
6.2 Component selection, evaluation and approval . 58
6.2.1 General . 58
6.2.2 Manufacturer and component selection . 59
6.2.3 Component evaluation .62
6.2.4 Parts approval .64
6.3 Component procurement .65
6.3.1 General . 65
6.3.2 Procurement specification .65
6.3.3 Screening requirements .65
6.3.4 Initial customer source inspection (precap) . 66
6.3.5 Lot acceptance .66
6.3.6 Final customer source inspection (buy-off) . 66
6.3.7 Incoming inspections .67
6.3.8 Radiation verification testing .67
6.3.9 Destructive physical analysis .67
6.3.10 Relifing .68
6.3.11 Manufacturer’s data documentation deliveries . 69
6.4 Handling and storage .69
6.5 Component quality assurance .69
6.5.1 General . 69
6.5.2 Nonconformances or failures .70
6.5.3 Alerts.70
6.5.4 Traceability .70
6.5.5 Lot homogeneity for sampling test . 71
6.6 Specific components .71
6.6.1 Overview .71
6.6.2 ASICs.71
6.6.3 Hybrids .71
6.6.4 One time programmable devices . 71
6.6.5 Microwave monolithic integrated circuits . 72
6.6.6 Connectors .72
6.7 Documentation . 72
7 Quality levels . 74
8 Evaluation and lot acceptance for retinned parts . 88
9 Pure tin lead finish – risk analysis . 89
9.1 Overview .89
9.2 Requirements .89
Annex A (normative) Component control plan (CCP) - DRD . 91
A.1.1 Requirement identification and source document . 91
A.1.2 Purpose and objective .91
A.2.1 Scope and content .91
A.2.2 Special remarks .92
Annex B (normative) Declared component list (DCL) - DRD . 93
B.1.1 Requirement identification and source document . 93
B.1.2 Purpose and objective .93
B.2.1 Scope and content .93
B.2.2 Special remarks .94
Annex C (normative) Procurement specification - DRD . 95
C.1.1 Requirement identification and source document . 95
C.1.2 Purpose and objective .95
C.2.1 Scope and content .95
C.2.2 Special remarks .96
Annex D (normative) Part approval document (PAD) - DRD . 97
D.1.1 Requirement identification and source document . 97
D.1.2 Purpose and objective .97
Annex E (informative) EEE documents delivery per review . 100
Bibliography . 103
Tables
Table 4-1: Document requirements list for Class 1 components . 36
Table 5-1: Document requirements list for Class 2 components . 55
Table 6-1:Document requirements list for Class 3 components . 72
Table 7-1: Quality levels for Class 1 components . 74
Table 7-2: Quality levels for Class 2 components . 78
Table 7-3: Quality levels for Class 3 components . 83
Table D-1 : PAD sheet. 98
Table E-1 : EEE delivery documents . 101
European Foreword
This document (EN 16602-60:2023) has been prepared by Technical Committee
CEN-CENELEC/JTC 5 “Space”, the secretariat of which is held by DIN.
This standard (EN 16602-60:2023) originates from ECSS-Q-ST-60C Rev. 3.
This document will supersede EN 16602-60:2015.
The main changes with respect to EN 16602-60:2015 are listed below:
• Implementation of Change Requests
• Topic “EQM components” added for all three classes
• Topic “Pure tin lead finish – risk analysis” moved from ECSS-Q-ST-60-13 to
ECSS-Q-ST-60 as clause 9.Definition of “traceability information (trace
code)” updated”
This document has been prepared under a standardization request given to CEN
by the European Commission and the European Free Trade Association.
This document has been developed to cover specifically space systems and has
therefore precedence over any EN covering the same scope but with a wider
domain of applicability (e.g. : aerospace).
Introduction
The objective of the EEE component selection, control, procurement and use
requirements is to ensure that EEE components used in a space project enables
the project to meet its mission requirements.
Important elements of EEE component requirements include:
component programme management,
component selection, evaluation and approval,
procurement,
handling and storage,
component quality assurance,
specific components, and
documentation.
The main tools which can be used to reach the objective are:
concurrent engineering,
standardization of component types,
characterization of components,
assessment of component manufacturers including declared competencies
and processes,
testing, screening, lot acceptance and periodic testing,
procurement specifications,
control and inspection,
control of nonconforming materials,
assessment and use of existing component data,
application of specific control to mitigate risk for components with limited
data or confidence, and
information management.
The basic approach is as follows:
• The customer of a given space project defines the EEE component
requirements within the boundaries of this standard. They appear in the
appropriate clauses of the project requirements as defined in ECSS-M-ST-10.
• The supplier defines a component control plan to implement those
requirements into a system which enables, for instance, to control the
selection, approval, procurement, handling in a schedule compatible with his
requirements, and in a cost-efficient way.
• The supplier ensures that the applicable parts requirements are passed
down to lower level suppliers and ensure that they are compliant to these
parts requirements.
Scope
This standard defines the requirements for selection, control, procurement and
usage of EEE components for space projects.
This standard differentiates between three classes of components through three
different sets of standardization requirements (clauses) to be met.
The three classes provide for three levels of trade-off between assurance and risk.
The highest assurance and lowest risk is provided by class 1 and the lowest
assurance and highest risk by class 3. Procurement costs are typically highest for
class 1 and lowest for class 3. Mitigation and other engineering measures may
decrease the total cost of ownership differences between the three classes. The
project objectives, definition and constraints determine which class or classes of
components are appropriate to be utilised within the system and subsystems.
Class 1 components are described in Clause 4.
Class 2 components are described in Clause 5
Class 3 components are described in Clause 6.
The requirements of this document apply to all parties involved at all levels in
the integration of EEE components into space segment hardware and launchers.
This standard may be tailored for the specific characteristics and constraints of a
space project in conformance with ECSS-S-ST-00.
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references, subsequent amendments to, or revision of any of these publications
do not apply, However, parties to agreements based on this ECSS Standard are
encouraged to investigate the possibility of applying the more recent editions of
the normative documents indicated below. For undated references, the latest
edition of the publication referred to applies.
EN reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS system — Glossary of terms
EN 16601-10 ECSS-M-ST-10 Space project management — Project planning and
implementation
EN 16602-10-09 ECSS-Q-ST-10-09 Space product assurance — Nonconformance control
system
EN 16602-20 ECSS-Q-ST-20 Space product assurance — Quality assurance
EN 16602-30-11 ECSS-Q-ST-30-11 Space product assurance — Derating — EEE
components
EN 16602-60-02 ECSS-Q-ST-60-02 Space product assurance — ASIC and FPGA
development
EN 16602-60-05 ECSS-Q-ST-60-05 Space product assurance — Generic procurement
requirements for hybrids
EN 16602-60-12 ECSS-Q-ST-60-12 Space product assurance — Design, selection,
procurement and use of die form monolithic microwave
integrated circuits (MMICs)
EN 16602-60-13 ECSS-Q-ST-60-13 Space product assurance — Commercial electrical,
electronic and electromechanical (EEE) components
EN 16602-60-14 ECSS-Q-ST-60-14 Space product assurance – Relifing procedure – EEE
components
EN 16602-60-15 ECSS-Q-ST-60-15 Radiation hardness assurance – EEE components
EN 16602-70 ECSS-Q-ST-70 Space product assurance — Materials, mechanical parts
and processes
ESCC 20200 ESCC Basic Specification: Component Manufacturer
Evaluation
ESCC 21004 ESCC Basic Specification: Guidelines for incoming
inspection of EEE components
ESCC 22500 ESCC Basic Specification: Guidelines for displacement
damage irradiation testing
ESCC 22800 ESCC Basic Specification: ESA/SCC Non conformance
Control System
ESCC 22900 ESCC Basic Specification: Total Dose Steady-State
Irradiation Test Method
ESCC 24900 ESCC Basic Specification: Minimum requirements for
controlling environmental contamination of
components
ESCC 25500 ESCC Basic Specification: Methodology for the
detection of pure tin in the external surface finish of
case and leads of EEE components
ESCC QPL ESCC qualified part list (https://escies.org)
ESCC EPPL ESCC European preferred parts list (https://escies.org)
ESCC QML ESCC qualified manufacturers list (https://escies.org)
GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin Whiskers in
Aerospace and High Performance Electronic Systems.
MIL QPLs MIL qualified parts lists
MIL QMLs MIL qualified manufacturers lists
NPSL NASA Parts Selection List
JAXA QPL JAXA qualified parts list
ESCC, MIL & JAXA specifications and standards called in the document
Terms, definitions and abbreviated terms
3.1 Terms from other standards
For the purpose of this Standard, the terms and definitions from ECSS-S-ST-00-01
apply.
3.2 Terms specific to the present standard
3.2.1 agent
organization contracted to perform the procurement of EEE components
including related engineering and quality assurance tasks
3.2.2 characterization
determination of the attributes of an EEE component, in sufficient detail to allow
assessment of its suitability for a particular use or application
3.2.3 commercial component
part neither designed, nor manufactured with reference to military or space
standards
3.2.4 concurrent engineering
engineering activity taking place in the context of simultaneous design of the
product, the production process and all associated product usages, in an
integrated, multifunctional team, with external organizational constraints
minimized
3.2.5 destructive physical analysis
series of inspections, tests and analyses performed on a sample of components to
verify that the material, design and workmanship used for its construction, as
well as the construction itself, meet the requirements of the relevant specification
and are suitable for the intended application
3.2.6 franchised distributor
distributor officially and contractually authorised by the manufacturer
3.2.7 parts engineer
professional engineer with demonstratable specialisation in EEE components
3.2.8 parts procurer
supplier who procures components by himself or a parts procurement agent who
procures parts for the supplier
3.2.9 qualified parts
parts belonging to QPLs or QMLs from the following normative systems: ESCC,
MIL, JAXA, CECC
3.2.10 screening
tests, inspections or combination thereof, imposed on 100% of parts, to remove
unsatisfactory items or those likely to exhibit early failures
3.2.11 space qualified parts
parts belonging to QPLs or QMLs from the following normative systems (ESCC,
MIL) according to quality levels listed in Table 7-1
NOTE 1 Space qualified parts are a subset of the qualified
parts defined in clause 3.2.9.
NOTE 2 Parts belonging to JAXA QPL are considered as
space qualified provided the equivalence of the
generic JAXA specification with the ESCC or
MIL generic specifications has been established.
3.3 Abbreviated terms
For the purpose of this Standard, the abbreviated terms from ECSS-S-ST-00-01
and the following apply:
Abbreviation Meaning
ASIC Application specific integrated circuit
CCD charge coupled device
CCP Component control plan
CDR critical design review
CECC CENELEC electronic components committee
CENELEC Comité Européen de Normalisation Electrotechnique
CI conformance inspection
CN change notice
CoC certificate of conformance
CPPA centralized parts procurement agent
CR change request
CSI customer source inspection
CSV comma-separated values
DCL declared components list
DPA destructive physical analysis
DRD document requirement definition
EEE electrical, electronic, electromechanical
EFR established failure rate
EPPL European preferred parts list
ESCC European space components coordination
ESR equivalent serial resistance
FPGA field programmable gate arrays
GSE ground support equipment
GSFC Goddard space flight center
JAXA Japanese aerospace exploration agency
JD justification document
LAT lot acceptance test
LED light emitting diode
LVT lot validation testing
MMIC microwave monolithic integrated circuit
NASA national aeronautics and space administration
NCR nonconformance report
NPSL NASA parts selection list
PA product assurance
PAD part approval document
PCB Parts Control Board
PCN process change notice
PDR preliminary design review
PIND particle impact noise detection
QCI quality conformance inspection
QML qualified manufacturers list
QPL qualified parts list
RFD request for deviation
RFW request for waiver
RVT radiation verification testing
SCSB Space Components Steering Board
SEB single event burn-out
SEE single event effect
SEFI single event functional interrupt
SEGR single event gate rupture
SEL single event latch-up
SET single event transient
SEU single event upset
TCI technology conformance inspection
TRR test readiness review
WFR Weibull failure rate
3.4 Conventions
The term “EEE component“ is synonymous with the terms "EEE Part",
"Component" or just "Part".
The term “for approval” means that a decision of the approval authority is
necessary for continuing the process.
The term “for review” means that raised reviewers comments are
considered and dispositioned.
The term “for information” means that no comments are expected about
the delivered item.
For the purpose of clear understanding of this document, hereunder is a
listing of component categories which are covered by the term EEE
component, encapsulated or non-encapsulated, irrespective of the quality
level:
1. Capacitors
2. Connectors
3. Crystals
4. Discrete semiconductors (including diodes, transistors)
5. Filters
6. Fuses
7. Magnetic components (e.g. inductors, transformers, including in-
house products)
8. Monolithic Microcircuits (including MMICs)
9. Hybrid circuits
10. Relays
11. Resistors, heaters
12. Surface acoustic wave devices
13. Switches (including mechanical, thermal)
14. Thermistors
15. Wires and Cables
16. Optoelectronic Devices (including opto-couplers, LED, CCDs,
displays, sensors)
17. Passive Microwave Devices (including, for instance, mixers,
couplers, isolators and switches)
NOTE Microwave switches consisting of multiple EEE
components are considered as equipment. The
requirements of this standard are applicable to
the EEE parts they incorporate and to
microwave switches having a simple design
(single EEE part).
3.5 Nomenclature
The following nomenclature applies throughout this document:
The word “shall” is used in this Standard to express requirements. All the
requirements are expressed with the word “shall”.
The word “should” is used in this Standard to express recommendations.
All the recommendations are expressed with the word “should”.
NOTE It is expected that, during tailoring, recommendations
in this document are either converted into
requirements or tailored out.
The words “may” and “need not” are used in this Standard to express
positive and negative permissions, respectively. All the positive
permissions are expressed with the word “may”. All the negative
permissions are expressed with the words “need not”.
The word “can” is used in this Standard to express capabilities or
possibilities, and therefore, if not accompanied by one of the previous
words, it implies descriptive text.
NOTE In ECSS “may” and “can” have completely different
meanings: “may” is normative (permission), and
“can” is descriptive.
The present and past tenses are used in this Standard to express statements
of fact, and therefore they imply descriptive text.
Requirements for Class 1 components
4.1 Component programme management
4.1.1 General
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4.1.2 Components control programme
4.1.2.1 Organization
The supplier shall identify the organization responsible for the
management of the component programme, and describe the
organization’s approaches (including the procurement system and its
rationale) and capability to efficiently implement, manage, and control the
component requirements.
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4.1.2.2 Component control plan
The supplier shall prepare a Component Control Plan (CCP) in
conformance with its DRD in Annex A.
The CCP may be part of the overall project PA plan.
The supplier shall submit the CCP to the customer for approval.
4.1.3 Parts control board
The approval of the selection and usage of EEE parts shall be implemented
through Parts Control Boards (PCBs) held between the customer and the
supplier (or lower tier subcontractor).
At supplier's level, the Parts Control Board (PCB) shall be composed as
follows:
chaired by a member of the supplier’s PA team with designated
responsibility for components management,
include, as a minimum, in addition the suppliers’ parts engineer, the
customer’s representative and the lower tier subcontractor parts
engineers.
Other pertinent experts from the customer or suppliers may also
participate, on request.
Depending on the progress of the program, the main PCB activities shall
be:
Review and approval of the supplier's EEE component control plan
and any associated documents,
Parts type reduction and standardization,
Parts approval including evaluation activities,
Problem assessment (e.g. alerts, nonconformances, RFD, RFW and
delivery delays).
Assessment activities (by sampling) including:
(a) conformity of procurement conditions,
(b) conformity of procurement data,
(c) post-procurement data, and
(d) application of alerts recommendations.
NOTE For (a) to (c), assessment is made by comparison
of procurement documentation versus approval
document.
4.1.4 Declared components list
For each equipment, its supplier shall issue a DCL in an editable and
sortable electronic format, as a minimum compatible with CSV,
identifying all component types needed.
NOTE CSV is a common file format that can be used to
transfer data between database or spreadsheet
tables (a spreadsheet program is for example
Excel®).
The list specified in 4.1.4a shall be kept under configuration control (issue
and identification of changes).
The DCL shall be issued as a minimum at PDR and CDR (as designed) and
before TRR (as built).
After equipment CDR, all modifications affecting the PAD and JD
information shall be implemented, in the "as design" DCL and submitted
to the customer for approval, before assembly.
The “as design” DCL shall be sent to the customer for approval.
Any change of parts during equipment manufacturing (e.g. type and
manufacturer) shall be handled through RFWs submitted to the customer
for approval before mounting.
The “as built” DCL reflecting the actual EEE parts assembled into the flight
hardware and their date code, shall be provided before TRR to the
customer for review.
The content of the DCL shall be in conformance with its DRD in Annex B.
The supplier shall establish and update a consolidated “as design" DCL at
its level and deliver it to the customer.
4.1.5 Electrical and mechanical GSE
EEE components used in GSE, which are physically and directly
interfacing to flight hardware, shall be:
Fit Form and Function compatible,
manufactured from materials identical to the flight opposite part,
and
ensured to be visibly clean before each connection to flight
hardware.
Flight hardware connector interfaces to GSE shall interface to a flight
compatible connector, as per 4.1.5a.
NOTE This connector can be installed on the test
harness or can be a saver.
4.1.6 EQM components
EEE components used in Engineering Qualification Model (EQM) shall be
fit, form and function representative of the flight components and be from
the same manufacturers.
If thermal vacuum tests are performed on the EQM, the EEE parts shall be
material representative of the FM parts.
4.2 Component selection, evaluation and approval
4.2.1 General
The supplier shall ensure that the following requirements are met during
his selection process:
Project requirements (e.g. quality levels, component policy,
manufacturing and delivery schedules and budgets, quantities),
Design requirements (e.g. component type, case, dimensions,
materials),
Production requirements (e.g. packaging, thermal and storage
constraints, component mounting process),
Operational requirements (e.g. electrical, mechanical, radiation,
reliability, assembly, and lifetime).
NOTE The supplier of each product is responsible for
the selection of components, which enable the
performance, lifetime, environmental, material,
safety, quality and reliability requirements of the
product of which they form a part, to be satisfied
in all respects.
The selection, evaluation and approval of commercial EEE components for
class 1 programmes shall be performed in conformance with clause 4.2
from ECSS-Q-ST-60-13.
4.2.2 Manufacturer and component selection
4.2.2.1 General rules
The supplier shall establish and maintain in his own facility, and ensure
that his suppliers also establish and maintain, procedures for selecting and
controlling all components intended for use in deliverable products.
Components shall be selected on the basis of proven qualification,
characterization, and previous space experience and data, relevant with
regard to the requirements for the programme, from manufacturers or
sources (preferably European) employing effective Product Assurance
Programmes in manufacturing and test.
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4.2.2.2 Parts and material restriction
The supplier shall ensure that non-hermetically sealed materials of
components meet the requirements of ECSS-Q-ST-70 regarding off-
gassing, out-gassing, flammability, toxicity and any other criteria specified
for the intended use.
The supplier shall evaluate the robustness of selected EEE components
against the stresses induced by the assembly techniques to be employed.
With respect to health and safety, beryllium oxide and lithium (except for
the one which is identified in the procurement specification), cadmium,
magnesium, mercury, zinc, radioactive material and all material which can
cause safety hazards shall not be used.
For limited life duration, known instability, safety hazards or reliability
risk reasons, the EEE components listed below shall not be used:
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Hollow core resistors,
Potentiometers (except for mechanism position monitoring),
Non-metallurgically bonded diodes,
Semiconductor dice with unglassivated active area,
Wet slug tantalum capacitors other than capacitor construction
using double seals and a tantalum case,
Any component whose internal construction uses metallurgic
bonding with a melting temperature not compatible with the end-
application mounting conditions,
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TO5 relays without double welding of the mechanism to the header
or with any type of integrated diodes inside,
Aluminium liquid electrolytic capacitors,
Tin coated wires and cables,
PVC insulated wires and cables,
Electromechanical parts in commercial grade,
Feedthrough filter in commercial grade,
Connectors without gold plating contact in commercial grade.
For limited life duration, known instability, safety hazards or reliability
risk reasons, EEE components listed below shall not be used for new
designs:
RNC90 > 100 kOhm,
TO3 and DO4/DO5 packages,
Wire link fuses.
The use of pure tin in internal cavities may be authorized, on a case-by-
case basis, based on the demonstration that there is no alternative product
and there is no risk (supported by a technical justification).
As per 4.2.2.2f., the justification of the use of pure tin shall be presented
during a PCB for customer’s approval.
The use of pure tin (inside or outside the part) shall be declared in the PAD
or in the JD.
The customer shall specify either requirement 4.2.2.2j, or requirements
4.2.2.2k and 4.2.2.2l to handle risks linked with pure-tin terminations.
The following actions shall be performed by the supplier to control the
pure-tin risk:
Collect and synthesize all information participating to the risk
analysis in conformance with Clause 9.
Based on the risk analysis, elaborate a mitigation plan.
Include in the JD the risk analysis and mitigation plan for customer
approval.
Before retinning of flight parts, document the hot solder
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