SIST EN 16602-60-05:2014

Space product assurance - Generic procurement requirements for hybrids

The objective of this Standard is to define the requirements for the procurement of hybrid microcircuits for use in space systems. This Standard covers the following requirement domains: - Validation procedure for a hybrid microcircuit manufacturer. - Design of hybrid microcircuits. - Procurement of active and passive chips. - Procurement of materials and piece parts. - Screening of hybrid microcircuit lots. - Lot acceptance tests for hybrid microcircuits. - Customer involvement, key inspection points. - Repair provisions. - Hybrids and data package delivery.

Raumfahrtproduktsicherung - Allgemeine Beschaffungsanforderungen an Hbyride

Assurance produit des projets spatiaux - exigences génériques d'approvisionement des composants hybrides

Zagotavljanje varnih proizvodov v vesoljski tehniki - Osnovne zahteve za naročanje hibridnih vezij

Cilj tega standarda je opredeliti zahteve za naročanje hibridnih mikrovezij za uporabo v vesoljskih sistemih. Ta standard obravnava naslednja področja zahtev: – Postopek potrditve za proizvajalca hibridnih mikrovezij. – Projektiranje hibridnih mikrovezij. – Naročanje aktivnih in pasivnih vezij. – Naročanje materialov in delov za kose. – Pregled serij hibridnih mikrovezij. – Preskusi sprejemljivosti serij hibridnih mikrovezij. – Sodelovanje strank, ključne točke za pregled. – Določila glede popravil. – Dobava hibridnih vezij in paketov podatkov.

General Information

• Status: Published
• Publication Date: 15-Oct-2014
• ICS: 49.140 - Space systems and operations
• Technical Committee: I13 - Imaginarni 13
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 24-Sep-2014
• Due Date: 29-Nov-2014
• Completion Date: 16-Oct-2014
• Mandate: M/496 - Mandate addressed to CEN, CENELEC and ETSI to develop standardisation regarding space industry (Phase 3 of the process)
• Ref Project: EN 16602-60-05:2014 - Space product assurance - Generic procurement requirements for hybrids

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 16602-60-05:2014
01-november-2014
=DJRWDYOMDQMHYDUQLKSURL]YRGRYYYHVROMVNLWHKQLNL2VQRYQH]DKWHYH]D
QDURþDQMHKLEULGQLKYH]LM
Space product assurance - Generic procurement requirements for hybrids
Raumfahrtproduktsicherung - Allgemeine Beschaffungsanforderungen an Hbyride
Assurance produit des projets spatiaux - exigences génériques d'approvisionement des
composants hybrides
Ta slovenski standard je istoveten z: EN 16602-60-05:2014
ICS:
49.140 Vesoljski sistemi in operacije Space systems and
operations
SIST EN 16602-60-05:2014 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 16602-60-05:2014

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SIST EN 16602-60-05:2014


EUROPEAN STANDARD
EN 16602-60-05

NORME EUROPÉENNE

EUROPÄISCHE NORM
September 2014
ICS 49.140

English version
Space product assurance - Generic procurement requirements
for hybrids
Assurance produit des projets spatiaux - exigences Raumfahrtproduktsicherung - Allgemeine
génériques d'approvisionement des composants hybrides Beschaffungsanforderungen an Hybride
This European Standard was approved by CEN on 13 March 2014.

CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC
member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.






CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. EN 16602-60-05:2014 E
worldwide for CEN national Members and for CENELEC
Members.

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SIST EN 16602-60-05:2014
EN 16602-60-05:2014 (E)
Table of contents
Foreword . 6
Introduction . 7
1 Scope . 8
2 Normative references . 9
3 Terms, definitions and abbreviated terms . 10
3.1 Terms from other standards . 10
3.2 Terms specific to the present standard . 10
3.3 Abbreviated terms. 11
4 Sequence of procurement activities . 13
5 Selection of hybrid microcircuit manufacturer . 16
5.1 General . 16
5.2 Hybrid microcircuit manufacturer categories . 16
5.2.1 Category 1 manufacturer (preferred case) . 16
5.2.2 Category 2 manufacturer (non-preferred case) . 16
6 Validation procedure for a hybrid microcircuit manufacturer . 17
6.1 General . 17
6.2 Hybrid circuit technology identification form (HTIF) . 17
6.2.1 General . 17
6.2.2 HTIF for approved manufacturers (category 1) . 17
6.2.3 HTIF for manufacturer pending capability approval by the approving
authority (category 1) . 18
6.2.4 HTIF for manufacturer not approved by the approving authority
(category 2) . 18
6.3 Validation of category 2 manufacturers . 19
6.3.1 General . 19
6.3.2 Construction analysis on representative samples . 19
6.3.3 Quality and technical audit . 19
7 Design requirements . 21
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7.1 General . 21
7.1.1 Overview . 21
7.1.2 Design activities . 21
7.2 Detail specification for hybrid circuits . 22
7.3 Design approval (circuit type approval) . 22
7.3.1 General . 22
7.3.2 Procedure for a new hybrid circuit which is “non similar” to a
reference circuit . 23
7.3.3 Procedure for a new hybrid circuit which is “similar” to a reference
circuit . 24
7.3.4 Procedure for a “recurrent” hybrid circuit . 24
8 Procurement of passive and active chips . 25
8.1 General . 25
8.1.1 Introduction . 25
8.1.2 Selecting chip suppliers . 27
8.1.3 Specifications . 27
8.1.4 Requirements for chip lots . 27
8.2 Procurement of passive chips . 28
8.2.1 General . 28
8.2.2 Bondability test . 28
8.2.3 Lot acceptance test (LAT) . 28
8.3 Procurement of active chips . 29
8.3.1 General . 29
8.3.2 Bondability test . 30
8.3.3 User LAT . 30
8.4 Procurement of hermetically encapsulated chips . 32
9 Procurement of materials and piece parts . 33
9.1 Overview . 33
9.2 Selection of materials and piece parts . 33
9.3 Specifications . 33
9.4 Requirements for materials and piece parts . 34
10 Manufacturing and screening of hybrid circuit lots . 35
10.1 Manufacturing . 35
10.2 Marking . 35
10.2.1 General . 35
10.2.2 Special cases . 36
10.3 Screening . 36
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10.3.1 General . 36
10.3.2 Thermographic test . 39
10.3.3 Pre-seal burn-in . 40
10.3.4 Photograph of circuits . 40
10.3.5 Conditions for constant acceleration and mechanical shock . 40
10.3.6 Test condition for PIND . 40
10.3.7 Leak tests . 41
10.3.8 Physical dimensions . 41
10.3.9 Burn-in test . 41
10.3.10 Radiographic inspection . 41
10.4 Lot rejection . 41
10.4.1 Definition of failure modes . 41
10.4.2 Criteria for lot rejection . 42
10.4.3 Disposition of rejected lots . 43
10.5 Repair provisions . 43
10.5.1 General . 43
10.5.2 Element replacement . 43
10.5.3 Wire re-bonding . 43
10.5.4 Compound bonding . 44
10.5.5 Delidding of hybrid circuits . 44
11 Customer inspection and review . 45
12 Lot acceptance tests for hybrid circuits . 46
12.1 General . 46
12.1.1 Overview . 46
12.1.2 Samples . 46
12.2 Category 1 manufacturer . 47
12.2.1 Option 1: Production lot control . 47
12.2.2 Option 2: Lines under TRB management and statistical process
control . 48
12.3 Category 2 manufacturer (validated for the project) . 49
13 Hybrid delivery and data package . 53
13.1 General . 53
13.2 Data documentation . 53
13.2.1 General . 53
13.2.2 Cover sheets . 54
13.2.3 Certificate of conformity . 54
13.3 Packaging and despatch. 54
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14 DPA test sequence . 55
Bibliography . 76

Figures
Figure 4-1: Sequence of activities in the procurement of hybrid microcircuits . 14
Figure 4-2: Hybrids procurement flow . 15
Figure 8-1: Flow of Procurement of Active and Passive components . 26
Figure 10-1: Screening test sequence . 37
Figure 12-1: Lot acceptance tests for the first production lot manufactured by a
category 2 manufacturer . 51

Tables
Table 8-1: Sample size and acceptance criteria for LAT of passive chips . 29
Table 8-2: Sample size and acceptance criteria for user LAT on active chips . 31
Table 10-1: Test conditions for constant acceleration and mechanical shock . 40
Table 12-1: Sample size for hybrids lot acceptance tests . 47
Table 12-2: Lot acceptance tests and sample size . 47
Table 12-3: Production acceptance tests and sampling . 50
Table 12-4: Definition of tests . 51


5

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Foreword
This document (EN 16602-60-05:2014) has been prepared by Technical
Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN.
This standard (EN 16602-60-05:2014) originates from ECSS-Q-ST-60-05C Rev. 1.
This European Standard shall be given the status of a national standard, either
by publication of an identical text or by endorsement, at the latest by March
2015, and conflicting national standards shall be withdrawn at the latest by
March 2015.
Attention is drawn to the possibility that some of the elements of this document
may be the subject of patent rights. CEN [and/or CENELEC] shall not be held
responsible for identifying any or all such patent rights.
This document has been prepared under a mandate given to CEN by the
European Commission and the European Free Trade Association.
This document has been developed to cover specifically space systems and has
therefore precedence over any EN covering the same scope but with a wider
domain of applicability (e.g. : aerospace).
According to the CEN-CENELEC Internal Regulations, the national standards
organizations of the following countries are bound to implement this European
Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France,
Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania,
Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United
Kingdom.
6

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EN 16602-60-05:2014 (E)
Introduction
The objective of this Standard is to define the requirements for the procurement
of hybrid microcircuits for use in space systems.
This Standard covers the following requirement domains:
• Validation procedure for a hybrid microcircuit manufacturer.
• Design of hybrid microcircuits.
• Procurement of active and passive chips.
• Procurement of materials and piece parts.
• Screening of hybrid microcircuit lots.
• Lot acceptance tests for hybrid microcircuits.
• Customer involvement, key inspection points.
• Repair provisions.
• Hybrids and data package delivery.
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1
Scope
The procurement requirements for hermetic hybrid microcircuits for use in
space projects are defined in this Standard.
This Standard also provides details concerning the documentation
requirements and the procedures relevant to obtain approval for the use of
hybrid microcircuits in the fabrication of space systems and associated
equipment.
The provisions of this Standard apply to all participants in the production of
space systems, at all levels and are applicable to manned and unmanned
spacecraft, launchers, satellites, payloads, experiments, and their corresponding
organizations.
This standard may be tailored for the specific characteristic and constraints of a
space project in conformance with ECSS-S-ST-00.
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2
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references subsequent amendments to, or revisions of any of these publications
do not apply. However, parties to agreements based on this ECSS Standard are
encouraged to investigate the possibility of applying the most recent editions of
the normative documents indicated below. For undated references the latest
edition of the publication referred to applies.

EN reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS system — Glossary of terms
EN 16602-60 ECSS-Q-ST-60 Space product assurance — Electrical, electronic and
electromechanical (EEE) components
EN 16602-60-12 ECSS-Q-ST-60-12 Space product assurance - Design, selection,
procurement and use of die form monolithic
microwave integrated circuits (MMICs)
EN 16602-30-11 ECSS-Q-ST-30-11 Space product assurance — Derating - EEE
components
EN 16602-70 ECSS-Q-ST-70 Space product assurance — Materials, mechanical
parts and processes
MIL-STD-883G Tests methods and procedures for microelectronics
MIL-STD-750D Test method standard for semiconductor devices
ESCC 20600 Preservation, packaging and despatch of ESCC
components
ESCC 2043000 Internal visual inspection of capacitors
ESCC 2044000 Internal visual inspection of resistors
ESCC 2045010 Internal visual inspection of microwave devices
ESCC 2049010 Internal visual inspection of monolithic microwave
devices
ESCC 2053000 External visual inspection of capacitors
ESCC 2054000 External visual inspection of resistors
ESCC 2093000 Radiographic inspection of capacitors
ESCC 2094000 Radiographic inspection of resistors
9

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3
Terms, definitions and abbreviated terms
3.1 Terms from other standards
For the purpose of this standard, the terms and definitions of ECSS-S-ST-00-01
apply.
3.2 Terms specific to the present standard
3.2.1 approving authority
organization supplying approval certificate
NOTE In Europe the approving authority for space
systems components is the ESCC system.
3.2.2 category 1 manufacturer
manufacturer with a technology domain approved or pending approval by the
approving authority
3.2.3 category 2 manufacturer
manufacturer with a technology domain not approved by the approving
authority
3.2.4 EM quality level hybrid
hybrid manufactured with the same parts (types, sources and design),
materials, and processes as flight models but with acceptance of a lower quality
level for visual inspection or screening during procurement or manufacturing
3.2.5 hybrid
see “hybrid microcircuit”
3.2.6 hybrid circuit
see “hybrid microcircuit”
3.2.7 hybrid microcircuit
combination of elements (interconnection substrate, added active or passive
chips) sealed inside a package in order to perform an electronic function
NOTE 1 Interconnection substrate (e.g. thick film, thin film,
co-fired, DBC) can be with or without integrated
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EN 16602-60-05:2014 (E)
passive components (e.g. resistors, inductors,
capacitors).
NOTE 2 Active parts can be monolithic or discrete, chips or
packaged components.
NOTE 3 Electronic functions that are performed by hybrids
include digital or analog, low frequency or
radiofrequency, low power or high power
functions. These functions may be mixed
according to the application.
NOTE 4 The terms “hybrid circuits” and “hybrids” are
synonymous for “Hybrid microcircuits”.
3.2.8 process identification document
document that defines the approved technology domain, the reference of
approval status, and one that freezes the configuration of the manufacturing
line and the approved domain
3.2.9 process performance index
the long-term capability of the process which reflects the process centering and
the variability with respect to specification requirements
3.2.10 production lot
number of units of a single device type manufactured on the same production
line using the same production techniques, in one uninterrupted period,
according to the same component or part design and having the same chips lots
and the same materials
3.2.11 representative production lot
lot that represents several production lots grouping products from the same
family, covered by one SEC type, manufactured on the same production line, in
one uninterrupted period, using the same materials and processes
3.2.12 standard evaluation circuit
device that represents a family of products using the same materials and
processes and which is processed on the same production line with the same
manufacturing equipment and tools
3.2.13 technology review board
formal group at manufacturer level where design, materials and parts
procurement, manufacturing, testing, reliability, and quality assurance
functions are represented
3.3 Abbreviated terms
For the purpose of this Standard, the abbreviated terms from ECSS-S-ST-00-01
and the following apply:
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Abbreviation Meaning
CENELEC Electronic Components Committee
CECC
circuit type approval
CTA
certificate of conformance
COC
declared component list
DCL
document requirements definition
DRD
direct bonded copper
DBC
destructive physical analysis
DPA
engineering model
EM
European Space Agency
ESA
European Space Components Coordination
ESCC
electrostatic discharge
ESD
flight model
FM
failure modes effects and criticality analysis
FMECA
hybrid circuit technology identification form
HTIF
lot acceptance test
LAT
monolithic microwave integrated circuit
MMIC
mandatory inspection points
MIP
nonconformance report
NCR
product assurance
PA
part approval document
PAD
percent defective allowable
PDA
preliminary design review
PDR
process identification document
PID
particle impact noise detection
PIND
process performance index
Ppk
request for deviation
RFD
request for waiver
RFW
scanning acoustic microscope
SAM
standard evaluation circuit
SEC
scanning electronic microscope
SEM
statistical process control
SPC
technological characterization vehicle
TCV
technology review board
TRB
12

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4
Sequence of procurement activities
The sequences of activities involved in the procurement of hybrid microcircuits
are illustrated in Figure 4-1. A more detailed illustration is further provided in
Figure 4-2.
The initial steps in the process are the selection and validation of the
manufacturer and the technology.
The technology of a hybrid circuit is defined as the set of processes and
materials used to manufacture the hybrid, i.e.
• the substrate network and material: thick film or thin film;
• integrated components, i.e. resistors, capacitors and inductors used in the
network;
• processes and materials for the attachment and connection of the
added-on components (active and passive chips);
• packaging type and material.
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Technology
Selection of manufacturer
Clause 5
Validation
Clause 6
Hybrid microcircuits
Design
(Clause 7)
Procurement of active and passive parts
(Clause 8)
Procurement of materials and piece parts
(Clause 9)
Manufacturing
(Clause 10)
Customer inspection and review
(Clause 11)
Screening
Clause 10
Lot acceptance tests
(Clause 12)
Accept or reject lot
Delivery of hybrids and data package
(Clause 13)


Figure 4-1: Sequence of activities in the procurement of hybrid microcircuits
14

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Figure 4-2: Hybrids procurement flow
15

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5
Selection of hybrid microcircuit
manufacturer
5.1 General
a. All manufacturers that are selected for producing hybrids shall be
validated as described in Clause 6.
5.2 Hybrid microcircuit manufacturer categories
5.2.1 Category 1 manufacturer (preferred case)
a. A supplier who wishes to use (or manufacture) hybrid circuits for a space
project shall procure (or produce) them from a production line that has
been approved or is pending approval by the approving authority.
b. All hybrid circuits shall be manufactured using the basic processes and
materials, and in conformance with the manufacturing and inspection
procedures as described in the PID that has been approved by the
approving authority.
c. The PID shall contain as a minimum:
1. the manufacturing and inspection flow chart;
2. the list of applicable documents with approved revision;
3. the general organization of the production line;
4. the approved domain: authorized parts, materials, processes and
reworks;
5. the list of manufacturing, inspection and failure analysis
equipment;
6. the list of hybrids manufactured in conformance with the
approved PID.
5.2.2 Category 2 manufacturer (non-preferred
case)
a. A supplier wishing to use (or manufacture) hybrid circuits from a
production line that has not been approved by the approving authority
shall:
1. justify its requirements to the customer (especially if this involves
developing a new circuit), and
2. satisfy the validation conditions described in Clause 6.
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6
Validation procedure for a hybrid
microcircuit manufacturer
6.1 General
a. Validation of manufacturers and production lines shall be conducted
jointly by the supplier using the hybrid circuit and the customer, and
involving upper level customers where re
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