SIST EN 61189-3-719:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during thermal cycling

This part of IEC 61189 specifies a test method to monitor the resistance of single platedthrough
holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under
thermo-mechanical stress induced by temperature cycling.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3-719: Prüfverfahren für Verbindungsstrukturen (Leiterplatten) – Überwachung des Widerstands von Einzeldurchkontaktierungen (PTH – plated-through hole) bei Temperaturwechselbeanspruchung

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et les autres structures et assemblages d'interconnexion - Partie 3-719: Méthodes d'essai pour les structures d'interconnexion (cartes imprimées) - Contrôles de la variation de résistance des trous métallisés uniques (PTH) au cours des cycles thermiques

L'IEC 61189-3-719:2016 spécifie une méthode d'essai pour contrôler la résistance des trous métallisés uniques (PTH) dans les cartes de circuits imprimés (PCB), afin de déterminer la durabilité des PTH sous contrainte thermomécanique induite par les cycles de températures.

Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne strukture in sestave - 3-719. del: Preskusne metode za povezovalne strukture (tiskana vezja) - Nadzorovanje spreminjanja upornosti enojno pokovinjenih lukenj med toplotnimi cikli

Ta del standarda IEC 61189 določa preskusno metodo za nadzorovanje spreminjanja upornosti enojno pokovinjenih lukenj (PTH) v tiskanih vezjih (PCB) za določanje trajnosti pod toplotno-mehansko obremenitvijo zaradi temperaturnih ciklov.

General Information

• Status: Published
• Publication Date: 23-May-2016
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 11-May-2016
• Due Date: 16-Jul-2016
• Completion Date: 24-May-2016
• Ref Project: EN 61189-3-719:2016 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61189-3-719:2016
01-junij-2016
3UHVNXVQHPHWRGH]DHOHNWULþQHPDWHULDOHWLVNDQDYH]MDWHUGUXJHSRYH]RYDOQH
VWUXNWXUHLQVHVWDYHGHO3UHVNXVQHPHWRGH]DSRYH]RYDOQHVWUXNWXUH
WLVNDQDYH]MD1DG]RURYDQMHVSUHPLQMDQMDXSRUQRVWLHQRMQRSRNRYLQMHQLKOXNHQM
PHGWRSORWQLPLFLNOL
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies - Part 3-719: Test methods for interconnection structures (printed
boards) - Monitoring of single plated-through hole (PTH) resistance change during
thermal cycling
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et les autres
structures et assemblages d'interconnexion - Partie 3-719: Méthodes d'essai pour les
structures d'interconnexion (cartes imprimées) - Contrôles de la variation de résistance
des trous métallisés uniques (PTH) au cours des cycles thermiques
Ta slovenski standard je istoveten z: EN 61189-3-719:2016
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61189-3-719:2016 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61189-3-719:2016

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SIST EN 61189-3-719:2016


EUROPEAN STANDARD EN 61189-3-719

NORME EUROPÉENNE

EUROPÄISCHE NORM
April 2016
ICS 31.180

English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 3-719: Test
methods for interconnection structures (printed boards) -
Monitoring of single plated-through hole (PTH) resistance
change during temperature cycling
(IEC 61189-3-719:2016)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 3-
ensembles - Partie 3-719: Méthodes d'essai pour les 719: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)
structures d'interconnexion (cartes imprimées) - Contrôles - Überwachung des Widerstands von
de la variation de résistance des trous métallisés uniques Einzeldurchkontaktierungen (PTH - plated-through hole) bei
(PTH) au cours des cycles thermiques Temperaturwechselbeanspruchung
(IEC 61189-3-719:2016) (IEC 61189-3-719:2016)
This European Standard was approved by CENELEC on 2016-02-09. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.



European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 61189-3-719:2016 E

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SIST EN 61189-3-719:2016
EN 61189-3-719:2016
European foreword
The text of document 91/1303/FDIS, future edition 1 of IEC 61189-3-719, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 61189-3-719:2016.

The following dates are fixed:
(dop) 2016-11-09
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2019-02-09
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 61189-3-719:2016 was approved by CENELEC as a
European Standard without any modification.

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SIST EN 61189-3-719:2016
 EN 61189-3-719:2016

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-14 -  Environmental testing -- Part 2-14: Tests - EN 60068-2-14 -
Test N: Change of temperature
IEC 60068-2-58 2015 Environmental testing - Part 2-58: Tests - EN 60068-2-58 2015
Test Td: Test methods for solderability,
resistance to dissolution of metallization
and to soldering heat of surface mounting
devices (SMD)
IEC 60194 -  Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions
IPC-2221 -  Generic Standard on Printed Board Design - -

3

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SIST EN 61189-3-719:2016

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SIST EN 61189-3-719:2016



IEC 61189-3-719

®


Edition 1.0 2016-01




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE











Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –

Part 3-719: Test methods for interconnection structures (printed boards) –


Monitoring of single plated-through hole (PTH) resistance change during

temperature cycling




Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 3-719: Méthodes d'essai pour les structures d'interconnexion (cartes

imprimées) – Contrôles de la variation de résistance des trous métallisés

uniques (PTH) au cours des cycles de températures








INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.180 ISBN 978-2-8322-3095-4



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 61189-3-719:2016
– 2 – IEC 61189-3-719:2016 © IEC 2016
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test specimens . 5
5 Test apparatus . 6
5.1 Reflow equipment . 6
5.2 Temperature cycling chamber . 6
5.3 Electrical resistance recording . 6
6 Procedure . 7
6.1 Preconditioning . 7
6.2 Temperature cycling test . 8
7 Report . 9
8 Additional information . 10
Bibliography . 11

Figure 1 – Example photograph of a section of a test coupon for a six-layer PCB . 6
Figure 2 – Principle of online resistance measurement with high currents . 7
Figure 3 – Reflow temperature profile for PCB preconditioning . 8

Table 1 – Details of the reflow temperature profile for PCB preconditioning . 8

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SIST EN 61189-3-719:2016
IEC 61189-3-719:2016 © IEC 2016 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 3-719: Test methods for interconnection structures
(printed boards) – Monitoring of single plated-through hole (PTH)
resistance change during temperature cycling

FOREWORD
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...