SIST EN 16602-70-10:2015

Space product assurance - Qualification of printed circuit boards

This Standard defines the requirements for evaluation, qualification and maintenance of qualification of PCB manufacturers for different types of PCBs. This Standard is applicable to the following type of PCBs: - Rigid PCBs (single-sided, double-sided, multilayer, sequential-laminated multilayer, metal core) - Flexible PCB (single-sided and double-sided) - Rigid-flex PCBs (multilayer and sequential-laminated multilayer) - High frequency PCBs - Special PCBs. PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermal and mechanical shocks during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions, and in addition the complex PCB assembly are subjected to the environment imposed by launch and space flights. This standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00.

Raumfahrtproduktsicherung - Qualifizierung von Leiterplatten

Assurance produit des projets spatiaux - Qualification des circuits imprimés

Zagotavljanje varnih proizvodov v vesoljski tehniki - Kvalifikacija plošč tiskanih vezij

Ta standard določa zahteve za vrednotenje, kvalifikacijo in vzdrževanje kvalifikacije proizvajalcev plošč tiskanih vezij za različne vrste plošč tiskanih vezij (PCB). Ta standard se uporablja za naslednje vrste plošč tiskanih vezij: – toge plošče tiskanih vezij (enostranske, dvostranske, večslojne, zaporedno laminirane večslojne, s kovinsko sredico); – gibljive plošče tiskanih vezij (enostranske in dvostranske); – toge-gibljive plošče tiskanih vezij (večslojne in zaporedno laminirane večslojne); – visokofrekvenčne plošče tiskanih vezij; – posebne plošče tiskanih vezij. Plošče tiskanih vezij se uporabljajo za nameščanje komponent za izdelavo sestavov plošč tiskanih vezij, ki izvajajo kompleksne električne funkcije. Plošče tiskanih vezij so med sestavljanjem podvržene toplotnim in mehanskim šokom, kot je nameščanje komponent s spajkanjem, predelavo in popravilom pod normalnimi zemeljskimi pogoji, poleg tega pa so kompleksni sestavi plošč tiskanih vezij podvrženi okolju, ki ga povzročijo izstrelitev in vesoljski poleti. Ta standard se lahko prilagodi posameznim lastnostim in omejitvam vesoljskega projekta v skladu s standardom ECSS-S-ST-00.

General Information

• Status: Withdrawn
• Public Enquiry End Date: 30-Jul-2014
• Publication Date: 04-Mar-2015
• Withdrawal Date: 06-Aug-2019
• ICS: 31.180 - Printed circuits and boards
• ICS: 49.140 - Space systems and operations
• Technical Committee: I13 - Imaginarni 13
• Current Stage: 9900 - Withdrawal (Adopted Project)
• Start Date: 25-Jul-2019
• Due Date: 17-Aug-2019
• Completion Date: 07-Aug-2019
• Mandate: M/496 - Mandate addressed to CEN, CENELEC and ETSI to develop standardisation regarding space industry (Phase 3 of the process)
• Ref Project: EN 16602-70-10:2015 - Space product assurance - Qualification of printed circuit boards

Relations

• Replaced By: SIST EN 16602-70-60:2019 - Space product assurance - Qualification and Procurement of printed circuit boards
• Effective Date: 17-Jul-2019
• Revised: SIST EN 16602-70-60:2019 - Space product assurance - Qualification and Procurement of printed circuit boards
• Effective Date: 16-Nov-2016

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 16602-70-10:2015
01-april-2015
=DJRWDYOMDQMHYDUQLKSURL]YRGRYYYHVROMVNLWHKQLNL.YDOLILNDFLMDSORãþWLVNDQLK
YH]LM
Space product assurance - Qualification of printed circuit boards
Raumfahrtproduktsicherung - Qualifizierung von Leiterplatten
Assurance produit des projets spatiaux - Qualification des circuits imprimés
Ta slovenski standard je istoveten z: EN 16602-70-10:2015
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
49.140 Vesoljski sistemi in operacije Space systems and
operations
SIST EN 16602-70-10:2015 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

SIST EN 16602-70-10:2015

---------------------- Page: 2 ----------------------

SIST EN 16602-70-10:2015


EUROPEAN STANDARD
EN 16602-70-10

NORME EUROPÉENNE

EUROPÄISCHE NORM
January 2015
ICS 31.180; 49.140

English version
Space product assurance - Qualification of printed circuit boards
Assurance produit des projets spatiaux - Qualification des Raumfahrtproduktsicherung - Qualifizierung von
circuits imprimés Leiterplatten
This European Standard was approved by CEN on 11 October 2014.

CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC
member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.






CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2015 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. EN 16602-70-10:2015 E
worldwide for CEN national Members and for CENELEC
Members.

---------------------- Page: 3 ----------------------

SIST EN 16602-70-10:2015
EN 16602-70-10:2015 (E)
Table of contents
Foreword . 7
1 Scope . 8
2 Normative references . 9
3 Terms, definitions and abbreviated terms . 11
3.1 Terms from other standards . 11
3.2 Terms specific to the present standard . 11
3.3 Abbreviated terms. 14
4 Principles . 16
4.1 General . 16
4.2 Roles . 16
4.3 Specification of test requirements . 17
5 Evaluation . 18
5.1 General . 18
5.2 Request for evaluation . 18
5.3 Evaluation PCBs . 18
5.4 Line audit . 19
6 Qualification . 20
6.1 General . 20
6.2 Qualification programme definition and approval . 20
6.3 Nonconformance criteria . 21
6.4 Qualification programme implementation . 21
6.5 Qualification PCBs . 25
6.5.1 General . 25
6.5.2 Test pattern A: Electrical test . 27
6.5.3 Test pattern B: Mechanical test . 27
6.5.4 Test pattern C: Electrical test . 28
6.5.5 Test pattern D: Electrical test and visual aspect . 28
6.5.6 Test pattern E: Electrical test . 29
6.5.7 Test pattern F: Metal-plating test . 30
2

---------------------- Page: 4 ----------------------

SIST EN 16602-70-10:2015
EN 16602-70-10:2015 (E)
6.5.8 Test pattern G: Metal-plating/coating test . 30
6.5.9 Test pattern H: Electrical test . 31
6.5.10 Test pattern J: Solderability test . 31
6.5.11 Test pattern K: Physical test . 32
6.5.12 Test pattern L: Demonstration of technological capability . 32
6.5.13 Test pattern M: CAD/CAM criteria (on request by the qualification
authority) . 33
6.5.14 Test pattern X: Resistance to bending cycles (for flexible parts only) . 34
6.5.15 Test pattern Y: Electrical test (on request by the supplier). 34
6.5.16 Test pattern W: Electrical test for high frequency circuits (on request
by the supplier) . 35
6.6 Qualification approval . 35
6.7 Maintenance of qualification . 35
7 Tests . 37
7.1 General . 37
7.2 Group 1 — Visual inspection and non-destructive test . 37
7.2.1 General . 37
7.2.2 Verification of marking . 37
7.2.3 Visual aspects . 38
7.2.4 External dimensions . 41
7.2.5 Warp . 41
7.2.6 Twist . 42
7.2.7 Subgroup 1.1 — Specific dimensional check. 42
7.2.8 Subgroup 1.2 — Electrical measurements . 44
7.3 Group 2 — Miscellaneous tests . 46
7.3.1 General . 46
7.3.2 Subgroup 2.1 — Solderability test — Wettability on test pattern J . 46
7.3.3 Subgroup 2.2 — Mechanical tests . 47
7.3.4 Subgroup 2.3 — Coatings tests. 49
7.3.5 Subgroup 2.4 — Electrical tests . 56
7.3.6 Subgroup 2.5 — Physical tests on test pattern K . 58
7.4 Group 3 — Thermal stress and thermal shock (on PCB) . 59
7.4.1 General . 59
7.4.2 Solder bath float and vapour phase reflow simulation (on board
without test pattern F) . 59
7.4.3 Rework simulation (thermal shock, hand soldering) on test pattern F . 60
7.5 Group 4 — Thermal cycling (on PCB) . 61
7.6 Group 5 — Damp heat — Steam ageing (on PCB) . 62
3

---------------------- Page: 5 ----------------------

SIST EN 16602-70-10:2015
EN 16602-70-10:2015 (E)
7.6.1 General . 62
7.6.2 Damp heat (on entire PCB excluding test pattern F) . 62
7.6.3 Steam ageing on test pattern F . 62
8 Quality assurance for manufacturing . 64
8.1 General . 64
8.2 Data . 64
8.3 Incoming inspection of raw materials . 64
8.4 Traceability . 64
8.5 Calibration . 65
8.6 Workmanship standards . 65
8.7 Inspection . 65
8.8 Operator and inspector training. 65
8.9 Quality test specimen . 65
8.10 Microsection . 66
8.11 Final inspection and tests . 66
8.12 Delivery . 66
9 Requirements for PCBs . 67
9.1 Rigid single-sided and double-sided PCBs . 67
9.2 Rigid single-sided and double-sided PCBs for high frequency application . 69
9.3 Flexible PCBs . 72
9.4 Rigid-flex PCBs . 74
9.5 Rigid multilayer PCBs . 74
9.6 Sequential rigid multilayer PCBs . 77
Annex A (normative) Evaluation test report – DRD . 80
Annex B (normative) Qualification test report – DRD . 82
Annex C (normative) PCB manufacturing/assembly process identification
document (PID) – DRD . 83
Annex D (normative) Qualification status report – DRD . 84
Annex E (informative) Example of check-list . 85
Annex F (informative) Example of plated-through hole microsection . 88
Bibliography . 89

Figures
Figure 6-1: Test sequence . 22
4

---------------------- Page: 6 ----------------------

SIST EN 16602-70-10:2015
EN 16602-70-10:2015 (E)
Figure 6-2: Example of a qualification PCB layout with patterns for testing and a pattern
for demonstration of the technological capability . 26
Figure 6-3: Example of test pattern for intralayer insulation resistance and dielectric
withstanding voltage testing . 27
Figure 6-4: Example of test pattern for testing peel strength of conductors and pull-off
strength of pads . 28
Figure 6-5: Example of test pattern for internal short circuit testing. 28
Figure 6-6: Example of test pattern for etching definition evaluation and continuity
testing . 29
Figure 6-7: Example of test pattern for interconnection resistance and current overload
testing . 29
Figure 6-8: Example of test pattern for microsectioning and metal plating evaluation . 30
Figure 6-9: Example of test pattern for plating adhesion testing and analysis of SnPb
coating composition after reflow . 30
Figure 6-10: Example of test pattern for interlayer insulation resistance and dielectric
withstanding voltage testing . 31
Figure 6-11: Example of test pattern for solder wettability and rework simulation testing . 31
Figure 6-12: Example of test pattern for water absorption and outgassing testing . 32
Figure 6-13: Example of test pattern for evaluation of the technological capability . 33
Figure 6-14: Example of test pattern for evaluation of CAD/CAM capability. 34
Figure 6-15: Example of test pattern for testing resistance to bending cycles . 34
Figure 6-16: Example of test pattern for controlled impedance testing . 34
Figure 7-1: Arbitrary defects on conductors . 40
Figure 7-2: Arbitrary defects on spacing between conductors. 40
Figure 7-3 Misalignment of cover layer (for flexible PCBs) . 41
Figure 7-4: Warp . 42
Figure 7-5: Twist. 42
Figure 7-6 Example of a presentation of measurements in tabular form . 43
Figure 7-7: Wettability of terminal pads and plated-through holes . 47
Figure 7-8: Dimensional parameters to be measured . 51
Figure 7-9: Microsection of a PTH . 53
Figure 7-10: Undercut for PCBs with fused SnPb finish . 53
Figure 7-11: Undercut for PCBs with Au/Ni or Au finish . 54
Figure 7-12: Overhang for PCBs with Au/Ni or Au finish . 54
Figure 7-13: Microsection in PTH: Possible defects . 55
Figure 7-14: Microsection of PTH: Possible defects . 55
Figure 7-15: Voids in resin inside buried vias . 56
Figure 7-16: Test for internal short circuit . 57

Figure A-1 : Example of a test report . 81
5

---------------------- Page: 7 ----------------------

SIST EN 16602-70-10:2015
EN 16602-70-10:2015 (E)
Figure E-1 : Example of Check-list for double sided and multilayer PCBs . 85
Figure F-1 : Example of plated-through hole microsection . 88

Tables
Table 6-1: Test specification . 23


6

---------------------- Page: 8 ----------------------

SIST EN 16602-70-10:2015
EN 16602-70-10:2015 (E)
Foreword
This document (EN 16602-70-10:2015) has been prepared by Technical
Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN.
This standard (EN 16602-70-10:2015) originates from ECSS-Q-ST-70-10C.
This European Standard shall be given the status of a national standard, either
by publication of an identical text or by endorsement, at the latest by July 2015,
and conflicting national standards shall be withdrawn at the latest by July 2015.
Attention is drawn to the possibility that some of the elements of this document
may be the subject of patent rights. CEN [and/or CENELEC] shall not be held
responsible for identifying any or all such patent rights.
This document has been prepared under a mandate given to CEN by the
European Commission and the European Free Trade Association.
This document has been developed to cover specifically space systems and has
therefore precedence over any EN covering the same scope but with a wider
domain of applicability (e.g. : aerospace).
According to the CEN-CENELEC Internal Regulations, the national standards
organizations of the following countries are bound to implement this European
Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France,
Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania,
Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United
Kingdom.

7

---------------------- Page: 9 ----------------------

SIST EN 16602-70-10:2015
EN 16602-70-10:2015 (E)
1
Scope
This Standard defines the requirements for evaluation, qualification and
maintenance of qualification of PCB manufacturers for different types of PCBs.
This Standard is applicable to the following type of PCBs:
• Rigid PCBs (single-sided, double-sided, multilayer, sequential-laminated
multilayer, metal core)
• Flexible PCB (single-sided and double-sided)
• Rigid-flex PCBs (multilayer and sequential-laminated multilayer)
• High frequency PCBs
• Special PCBs.
PCBs are used for the mounting of components in order to produce PCB
assemblies performing complex electrical functions. The PCBs are subjected to
thermal and mechanical shocks during their assembly such as mounting of
components by soldering, rework and repair under normal terrestrial
conditions, and in addition the complex PCB assembly are subjected to the
environment imposed by launch and space flights.
This standard may be tailored for the specific characteristics and constraints of a
space project in conformance with ECSS-S-ST-00.
8

---------------------- Page: 10 ----------------------

SIST EN 16602-70-10:2015
EN 16602-70-10:2015 (E)
2
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references, subsequent amendments to, or revision of any of these publications
do not apply. However, parties to agreements based on this ECSS Standard are
encouraged to investigate the possibility of applying the more recent editions of
the normative documents indicated below. For undated references, the latest
edition of the publication referred to applies.

EN reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS system — Glossary of terms
EN 16602-10-09 ECSS-Q-ST-10-09 Space product assurance — Nonconformance
control system
EN 16602-20 ECSS-Q-ST-20 Space product assurance — Quality assurance
EN 16602-70 ECSS-Q-ST-70 Space product assurance — Material, mechanical
parts and processes
EN 16602-70-02 ECSS-Q-ST-70-02 Space product assurance — Thermal vacuum
outgassing test for the screening of space
materials
EN 16602-70-08 ECSS-Q-ST-70-08 Space product assurance — Manual soldering of
high-reliability electrical connections
EN 16602-70-11 ECSS-Q-ST-70-11 Space product assurance — Procurement of
printed circuit boards
EN 16602-70-21 ECSS-Q-ST-70-21 Space product assurance — Flammability testing
for the screening of space materials
EN 16602-70-22 ECSS-Q-ST-70-22 Space product assurance — Control of limited
shelf-life materials
EN 16602-70-29 ECSS-Q-ST-70-29 Space product assurance — Determination of
offgassing products from materials and
assembled articles to be used in a manned space
vehicle crew compartment
IEC 60068-2-3 (1969-01) Environmental testing. Part 2: Tests. Test Ca:
Damp heat, steady state
IEC 60068-2-14-am 1 (1986- Environmental testing. Part 2: Tests. Test N:
01) Change of temperature
9

---------------------- Page: 11 ----------------------

SIST EN 16602-70-10:2015
EN 16602-70-10:2015 (E)
IEC 60068-2-20-am 2 (1987- Environmental testing. Part 2: Tests. Test T:
01) Soldering
IEC 60249-1-am 4 (1993-05) Base materials for printed circuits. Part 1: Test
methods
IEC 60326-2-am 1 (1992-06) Printed boards. Part 2: Test methods
IEC 60326-5-am 1 (1989-10) Printed boards. Part 5: Specification for single and
double sided printed boards with plated-through
holes
IEC 60326-8 (1981-01) Printed boards. Part 8: Specification for single and
double sided flexible printed boards with through
connections
IEC 60326-11 (1991-03) Printed boards. Part 11: Specification for flex-rigid
multilayer printed boards with through
connections
IEC 62326-4 (1996-12) Printed boards. Part 4: Rigid multilayer printed
boards with interlayer connections - Sectional
specification
IPC-4101 Specification for base materials for rigid and
multilayer printed boards
MIL-P-50884C Printed wiring, flexible and rigid-flex

10

---------------------- Page: 12 ----------------------

SIST EN 16602-70-10:2015
EN 16602-70-10:2015 (E)
3
Terms, definitions and abbreviated terms
3.1 Terms from other standards
For the purpose of this Standard, the terms and definitions from ECSS-S-ST-00-01
apply.
3.2 Terms specific to the present standard
3.2.1 associated test coupon
small piece of PCB designated to have a limited specific set of tests performed
NOTE The associated test coupon is manufactured as
part of a PCB and at the final manufacturing
stage it is separated from it. The associated test
coupon is thus associated with the PCB, with
which it was simultaneously manufactured.
3.2.2 blister
delamination in the form of a localized swelling and separation between any of
the layers of a lamination base material, or between base material and
conductive foil or protective coating
[IEC 60194 (1999-04)]
3.2.3 cover layer (flexible circuit)
layer of insulating material that is applied covering totally or partially over a
conductive pattern on the outer surfaces of a PCB
[IEC 60194 (1999-04)]
3.2.4 crazing
internal condition that occurs in reinforced base material whereby glass fibres
are separated from the resin at the weave intersections
NOTE 1 This condition manifests itself in the form of
connected white spots or crosses that are below
the surface of the base material. It is usually
related to mechanically induced stress.
NOTE 2 See also “measling”.
[IEC 60194 (1999-04)]
11

---------------------- Page: 13 ----------------------

SIST EN 16602-70-10:2015
EN 16602-70-10:2015 (E)
3.2.5 delamination
separation between plies within a base material, between base material and a
conductive foil, or any other planar separation with a PCB
NOTE See also “blister”.
[IEC 60194 (1999-04)]
3.2.6 dewetting
condition that results when molten solder coats a surface and then recedes to
leave irregularly-shaped mounds of solder that are separated by areas that are
covered with a thin film of solder and with the basis metal not exposed
[IEC 60194 (1999-04)]
3.2.7 flexible PCB
PCB either single, double sided or multilayer consisting of a printed circuit or
printed wiring using flexible base materials only
[IEC 60194 (1999-04)]
3.2.8 haloing
mechanically-induced fracturing or delamination, on or below the surface of a
base material, that is usually exhibited by a light area around holes or other
machined features
[IEC 60194 (1999-04)]
3.2.9 high frequency PCB
PCB used for high frequency applications, that has specific requirements to the
dielectric properties of the base laminates as well as special dimensional
requirements to the lay-out for electrical purposes
3.2.10 inclusions
foreign particles, metallic or non-metallic, that may be entrapped in an
insulating material, conductive layer, plating, base material or solder
connection
[IEC 60194 (1999-04)]
3.2.11 key personnel
personnel with specialist knowledge responsible for defined production or
product assurance areas
3.2.12 measling
condition that occurs in laminated base material in which internal glass fibres
are separated from the resin at the weave intersection
NOTE 1 This condition manifests itself in the form of
discrete white spots or “crosses” that are below
the surface of the base material. It is usually
related to thermally-induced stress.
NOTE 2 See also “crazing”.
[IEC 60194 (1999-04)]
12

---------------------- Page: 14 ----------------------

SIST EN 16602-70-10:2015
EN 16602-70-10:2015 (E)
3.2.13 metal core PCB
PCB using a metal core base material
[IEC 60194 (1999-04)]
3.2.14 multilayer PCB
PCB that consist of rigid or flexible insulation materials and three or more
alternate printed wiring and/or printed circuit layers that have been bonded
together and electrically interconnected
[IEC 60194 (1999-04)]
3.2.15 prepreg
sheet of material that has been impregnated with a resin and cured to an
intermediate stage
NOTE B-staged resin.
[IEC 60194 (1999-04)]
3.2.16 printed circuit board (PCB)
printed board that provides both point-to-point connections and printed
components in a predetermined arrangement on a common base
NOTE This includes single-sided, double sided and
multilayer PCBs with rigid, flexible, and
rigid-flex base materials.
[IEC 60194 (1999-04)]
3.2.17 rigid double-sided PCB
double-sided PCB, either printed circuit or printed wiring, using rigid base
materials only
[IEC 60194 (1999-04)]
3.2.18 rigid-flex PCB
PCB with both rigid and flexible base materials
[IEC 60194 (1999-04)]
3.2.19 rigid-flex double-sided PCB
double-sided PCB, either printed circuit or printed wiring, using combinations
of rigid and flexible base materials
[IEC 60194 (1999-04)]
3.2.20 rigid-flex multilayer PCB
multilayer PCB, either printed circuit or printed wiring, using combinations of
rigid multilayer and flexible single and double-sided base materials
3.
...