EN 16602-70-10:2015

Space product assurance - Qualification of printed circuit boards

This Standard defines the requirements for evaluation, qualification and maintenance of qualification of PCB manufacturers for different types of PCBs. This Standard is applicable to the following type of PCBs: - Rigid PCBs (single-sided, double-sided, multilayer, sequential-laminated multilayer, metal core) - Flexible PCB (single-sided and double-sided) - Rigid-flex PCBs (multilayer and sequential-laminated multilayer) - High frequency PCBs - Special PCBs. PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermal and mechanical shocks during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions, and in addition the complex PCB assembly are subjected to the environment imposed by launch and space flights. This standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00.

Raumfahrtproduktsicherung - Qualifizierung von Leiterplatten

Assurance produit des projets spatiaux - Qualification des circuits imprimés

Zagotavljanje varnih proizvodov v vesoljski tehniki - Kvalifikacija plošč tiskanih vezij

Ta standard določa zahteve za vrednotenje, kvalifikacijo in vzdrževanje kvalifikacije proizvajalcev plošč tiskanih vezij za različne vrste plošč tiskanih vezij (PCB). Ta standard se uporablja za naslednje vrste plošč tiskanih vezij: – toge plošče tiskanih vezij (enostranske, dvostranske, večslojne, zaporedno laminirane večslojne, s kovinsko sredico); – gibljive plošče tiskanih vezij (enostranske in dvostranske); – toge-gibljive plošče tiskanih vezij (večslojne in zaporedno laminirane večslojne); – visokofrekvenčne plošče tiskanih vezij; – posebne plošče tiskanih vezij. Plošče tiskanih vezij se uporabljajo za nameščanje komponent za izdelavo sestavov plošč tiskanih vezij, ki izvajajo kompleksne električne funkcije. Plošče tiskanih vezij so med sestavljanjem podvržene toplotnim in mehanskim šokom, kot je nameščanje komponent s spajkanjem, predelavo in popravilom pod normalnimi zemeljskimi pogoji, poleg tega pa so kompleksni sestavi plošč tiskanih vezij podvrženi okolju, ki ga povzročijo izstrelitev in vesoljski poleti. Ta standard se lahko prilagodi posameznim lastnostim in omejitvam vesoljskega projekta v skladu s standardom ECSS-S-ST-00.

General Information

• Status: Withdrawn
• Publication Date: 27-Jan-2015
• Withdrawal Date: 09-Jul-2019
• ICS: 31.180 - Printed circuits and boards
• ICS: 49.140 - Space systems and operations
• Technical Committee: CEN/CLC/TC 5 - Space
• Drafting Committee: CEN/CLC/TC 5 - Space
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Completion Date: 10-Jul-2019
• Mandate: M/496 - Mandate addressed to CEN, CENELEC and ETSI to develop standardisation regarding space industry (Phase 3 of the process)
• Ref Project: SIST EN 16602-70-10:2015 - Space product assurance - Qualification of printed circuit boards

Relations

• Replaced By: EN 16602-70-60:2019 - Space product assurance - Qualification and Procurement of printed circuit boards
• Effective Date: 17-Jul-2019

Standards Content (Sample)

SLOVENSKI STANDARD
01-april-2015
=DJRWDYOMDQMHYDUQLKSURL]YRGRYYYHVROMVNLWHKQLNL.YDOLILNDFLMDSORãþWLVNDQLK
YH]LM
Space product assurance - Qualification of printed circuit boards
Raumfahrtproduktsicherung - Qualifizierung von Leiterplatten
Assurance produit des projets spatiaux - Qualification des circuits imprimés
Ta slovenski standard je istoveten z: EN 16602-70-10:2015
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 16602-70-10
NORME EUROPÉENNE
EUROPÄISCHE NORM
January 2015
ICS 31.180; 49.140
English version
Space product assurance - Qualification of printed circuit boards
Assurance produit des projets spatiaux - Qualification des Raumfahrtproduktsicherung - Qualifizierung von
circuits imprimés Leiterplatten
This European Standard was approved by CEN on 11 October 2014.

CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC
member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.

CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2015 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. EN 16602-70-10:2015 E
worldwide for CEN national Members and for CENELEC
Members.
Table of contents
Foreword . 7
1 Scope . 8
2 Normative references . 9
3 Terms, definitions and abbreviated terms . 11
3.1 Terms from other standards . 11
3.2 Terms specific to the present standard . 11
3.3 Abbreviated terms. 14
4 Principles . 16
4.1 General . 16
4.2 Roles . 16
4.3 Specification of test requirements . 17
5 Evaluation . 18
5.1 General . 18
5.2 Request for evaluation . 18
5.3 Evaluation PCBs . 18
5.4 Line audit . 19
6 Qualification . 20
6.1 General . 20
6.2 Qualification programme definition and approval . 20
6.3 Nonconformance criteria . 21
6.4 Qualification programme implementation . 21
6.5 Qualification PCBs . 25
6.5.1 General . 25
6.5.2 Test pattern A: Electrical test . 27
6.5.3 Test pattern B: Mechanical test . 27
6.5.4 Test pattern C: Electrical test . 28
6.5.5 Test pattern D: Electrical test and visual aspect . 28
6.5.6 Test pattern E: Electrical test . 29
6.5.7 Test pattern F: Metal-plating test . 30
6.5.8 Test pattern G: Metal-plating/coating test . 30
6.5.9 Test pattern H: Electrical test . 31
6.5.10 Test pattern J: Solderability test . 31
6.5.11 Test pattern K: Physical test . 32
6.5.12 Test pattern L: Demonstration of technological capability . 32
6.5.13 Test pattern M: CAD/CAM criteria (on request by the qualification
authority) . 33
6.5.14 Test pattern X: Resistance to bending cycles (for flexible parts only) . 34
6.5.15 Test pattern Y: Electrical test (on request by the supplier). 34
6.5.16 Test pattern W: Electrical test for high frequency circuits (on request
by the supplier) . 35
6.6 Qualification approval . 35
6.7 Maintenance of qualification . 35
7 Tests . 37
7.1 General . 37
7.2 Group 1 — Visual inspection and non-destructive test . 37
7.2.1 General . 37
7.2.2 Verification of marking . 37
7.2.3 Visual aspects . 38
7.2.4 External dimensions . 41
7.2.5 Warp . 41
7.2.6 Twist . 42
7.2.7 Subgroup 1.1 — Specific dimensional check. 42
7.2.8 Subgroup 1.2 — Electrical measurements . 44
7.3 Group 2 — Miscellaneous tests . 46
7.3.1 General . 46
7.3.2 Subgroup 2.1 — Solderability test — Wettability on test pattern J . 46
7.3.3 Subgroup 2.2 — Mechanical tests . 47
7.3.4 Subgroup 2.3 — Coatings tests. 49
7.3.5 Subgroup 2.4 — Electrical tests . 56
7.3.6 Subgroup 2.5 — Physical tests on test pattern K . 58
7.4 Group 3 — Thermal stress and thermal shock (on PCB) . 59
7.4.1 General . 59
7.4.2 Solder bath float and vapour phase reflow simulation (on board
without test pattern F) . 59
7.4.3 Rework simulation (thermal shock, hand soldering) on test pattern F . 60
7.5 Group 4 — Thermal cycling (on PCB) . 61
7.6 Group 5 — Damp heat — Steam ageing (on PCB) . 62
7.6.1 General . 62
7.6.2 Damp heat (on entire PCB excluding test pattern F) . 62
7.6.3 Steam ageing on test pattern F . 62
8 Quality assurance for manufacturing . 64
8.1 General . 64
8.2 Data . 64
8.3 Incoming inspection of raw materials . 64
8.4 Traceability . 64
8.5 Calibration . 65
8.6 Workmanship standards . 65
8.7 Inspection . 65
8.8 Operator and inspector training. 65
8.9 Quality test specimen . 65
8.10 Microsection . 66
8.11 Final inspection and tests . 66
8.12 Delivery . 66
9 Requirements for PCBs . 67
9.1 Rigid single-sided and double-sided PCBs . 67
9.2 Rigid single-sided and double-sided PCBs for high frequency application . 69
9.3 Flexible PCBs . 72
9.4 Rigid-flex PCBs . 74
9.5 Rigid multilayer PCBs . 74
9.6 Sequential rigid multilayer PCBs . 77
Annex A (normative) Evaluation test report – DRD . 80
Annex B (normative) Qualification test report – DRD . 82
Annex C (normative) PCB manufacturing/assembly process identification
document (PID) – DRD . 83
Annex D (normative) Qualification status report – DRD . 84
Annex E (informative) Example of check-list . 85
Annex F (informative) Example of plated-through hole microsection . 88
Bibliography . 89

Figures
Figure 6-1: Test sequence . 22
Figure 6-2: Example of a qualification PCB layout with patterns for testing and a pattern
for demonstration of the technological capability . 26
Figure 6-3: Example of test pattern for intralayer insulation resistance and dielectric
withstanding voltage testing . 27
Figure 6-4: Example of test pattern for testing peel strength of conductors and pull-off
strength of pads .
...