SIST EN 61967-2:2006

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz -- Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method

This test procedure defines a method for measuring the electromagnetic radiation from an integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a transverse electromagnetic (TEM) or wideband gigahertz TEM (GTEM) cell. The test board is not inside the cell, as in the conventional usage, but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured radio frequency (RF) voltage will be affected by many factors. The primary factor affecting the measured RF voltage is the septum to IC test board (cell wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to floor spacing of 45 mm and a GTEM cell with average septum to floor spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations. A conversion factor may allow comparisons between data measured on TEM or GTEM cells with different septum to floor spacing. The IC test board controls the geometry and orientation of the operating IC relative to the cell and eliminates any connecting leads within the cell (these are on the backside of the board, which is outside the cell). For the TEM cell, one of the 50 Ω ports is terminated with a 50 Ω load. The other 50 Ω port for a TEM cell, or the single 50 Ω port for a GTEM cell, is connected to the input of a spectrum analyser or receiver that measures the RF emissions emanating from the integrated circuit and impressed onto the septum of the cell.

Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen im Frequenzbereich von 150 kHz bis 1 GHz -- Teil 2: Messung der abgestrahlten Aussendungen - TEM-Zellen- und Breitband-TEM-Zellenverfahren

Circuits intégrés - Mesure des émissions électromagnétiques, 150 kHz à 1 GHz -- Partie 2: Mesure des émissions rayonnées - Méthode de cellule TEM et cellule TEM à large bande

La présente procédure de mesure définit une méthode de mesure du rayonnement électromagnétique provenant d'un circuit intégré (CI). Le CI évalué est monté sur une carte de circuit imprimé (PCB) d'essai de CI qui est fixée sur un accès d'accouplement (désigné comme accès à la paroi) découpé au sommet ou au fond d'une cellule électromagnétique transverse (TEM, transverse electromagnetic) ou d'une cellule TEM en gigahertz (GTEM) à large bande. La carte d'essai n'est pas à l'intérieur de la cellule, comme dans l'usage conventionnel, mais devient une partie de la paroi de la cellule. Cette méthode est applicable à toute cellule TEM ou GTEM modifiée pour incorporer l'accès à la paroi; cependant, la tension RF mesurée sera affectée par de nombreux facteurs. Le facteur principal affectant la tension RF mesurée est l'espacement entre le diaphragme et la carte d'essai du CI (paroi de la cellule). Cette procédure a été élaborée à l'aide d'une cellule TEM de 1 GHz avec un espacement entre le diaphragme et le sol de 45 mm et d'une cellule GTEM avec un espacement moyen entre le diaphragme et le sol de 45 mm au-dessus de la zone de l'accès. D'autres cellules peuvent ne pas produire de sortie spectrale identique, mais peuvent être utilisées pour des mesures comparatives, soumises à leurs limites en fréquence et en sensibilité. Un facteur de conversion peut permettre des comparaisons entre les données mesurées sur les cellules TEM ou GTEM avec un espacement différent entre le diaphragme et le sol. La carte d'essai du CI contrôle la géométrie et l'orientation du CI en fonctionnement par rapport à la cellule et élimine tous les conducteurs de connexion à l'intérieur de la cellule (ceux-ci se situent sur la face arrière de la carte, qui est à l'extérieur de la cellule). Pour la cellule TEM, l'un des accès de 50 est terminé par une charge de 50 . L'autre accès de 50 pour une cellule TEM, ou le seul accès de 50 pour une cellule GTEM, est connecté à l'entrée d'un analyseur de sp

Integrirana vezja – Meritve elektromagnetnega oddajanja v območju od 150 kHz do 1 GHz – 2. del: Meritve sevanih oddajanj – Metoda s celico TEM in s širokopasovno celico TEM (IEC 61967-2:2005)

General Information

• Status: Published
• Publication Date: 31-Jan-2006
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Feb-2006
• Due Date: 01-Feb-2006
• Completion Date: 01-Feb-2006
• Ref Project: EN 61967-2:2005 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61967-2:2006
01-februar-2006
,QWHJULUDQDYH]MD±0HULWYHHOHNWURPDJQHWQHJDRGGDMDQMDYREPRþMXRGN+]GR
*+]±GHO0HULWYHVHYDQLKRGGDMDQM±0HWRGDVFHOLFR7(0LQVãLURNRSDVRYQR
FHOLFR7(0,(&
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz --
Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen im
Frequenzbereich von 150 kHz bis 1 GHz -- Teil 2: Messung der abgestrahlten
Aussendungen - TEM-Zellen- und Breitband-TEM-Zellenverfahren
Circuits intégrés - Mesure des émissions électromagnétiques, 150 kHz à 1 GHz -- Partie
2: Mesure des émissions rayonnées - Méthode de cellule TEM et cellule TEM à large
bande
Ta slovenski standard je istoveten z: EN 61967-2:2005
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST EN 61967-2:2006 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61967-2:2006

---------------------- Page: 2 ----------------------

SIST EN 61967-2:2006
EUROPEAN STANDARD EN 61967-2
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2005

ICS 31.080.99


English version


Integrated circuits -
Measurement of electromagnetic emissions, 150 kHz to 1 GHz
Part 2: Measurement of radiated emissions -
TEM cell and wideband TEM cell method
(IEC 61967-2:2005)


Circuits intégrés -  Integrierte Schaltungen -
Mesure des émissions Messung von elektromagnetischen
électromagnétiques, 150 kHz à 1 GHz Aussendungen im Frequenzbereich
Partie 2: Mesure des émissions von 150 kHz bis 1 GHz
rayonnées - Teil 2: Messung der abgestrahlten
Méthode de cellule TEM et Aussendungen -
cellule TEM à large bande TEM-Zellen- und Breitband-TEM-
(CEI 61967-2:2005) Zellenverfahren
(IEC 61967-2:2005)



This European Standard was approved by CENELEC on 2005-09-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 61967-2:2005 E

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SIST EN 61967-2:2006
EN 61967-2:2005 - 2 -
Foreword
The text of document 47A/722/FDIS, future edition 1 of IEC 61967-2, prepared by SC 47A, Integrated
circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and
was approved by CENELEC as EN 61967-2 on 2005-09-01.
This part of EN 61967 is to be read in conjunction with EN 61967-1.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2006-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2008-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61967-2:2005 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61000-4-3 NOTE Harmonized as EN 61000-4-3:1996 (modified).
IEC 61000-4-20 NOTE Harmonized as EN 61000-4-20:2003 (not modified).
CISPR 16-1-1 NOTE Harmonized as EN 55016-1-1:2004 (not modified).
CISPR 16-1-2 NOTE Harmonized as EN 55016-1-2:2004 (not modified).
CISPR 16-1-4 NOTE Harmonized as EN 55016-1-4:2004 (not modified).
CISPR 16-1-5 NOTE Harmonized as EN 55016-1-5:2004 (not modified).
CISPR 16-2-1 NOTE Harmonized as EN 55016-2-1:2004 (not modified).
CISPR 16-2-2 NOTE Harmonized as EN 55016-2-2:2004 (not modified).
CISPR 16-2-3 NOTE Harmonized as EN 55016-2-3:2004 (not modified).
CISPR 16-2-4 NOTE Harmonized as EN 55016-2-4:2004 (not modified).
__________

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SIST EN 61967-2:2006
- 3 - EN 61967-2:2005
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60050-131 2002 International Electrotechnical Vocabulary- -
Part 131: Circuit theory

IEC 60050-161 1990 Chapter 161: Electromagnetic - -
compatibility

1) 2)
IEC 61967-1 - Integrated circuits - Measurement of EN 61967-1 2002
electromagnetic emissions, 150 kHz to
1 GHz
Part 1: General conditions and definitions




1)
Undated reference.
2)
Valid edition at date of issue.

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SIST EN 61967-2:2006

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SIST EN 61967-2:2006
NORME CEI
INTERNATIONALE
IEC



61967-2
INTERNATIONAL


Première édition
STANDARD

First edition

2005-09


Circuits intégrés –
Mesure des émissions électromagnétiques,
150 kHz à 1 GHz –
Partie 2:
Mesure des émissions rayonnées –
Méthode de cellule TEM et cellule
TEM à large bande

Integrated circuits –
Measurement of electromagnetic emissions,
150 kHz to 1 GHz –
Part 2:
Measurement of radiated emissions –
TEM cell and wideband TEM cell method

 IEC 2005 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
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électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
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International Electrotechnical Commission
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Pour prix, voir catalogue en vigueur
For price, see current catalogue

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SIST EN 61967-2:2006
61967-2  IEC:2005 – 3 –
CONTENTS
FOREWORD.7

1 Scope.11
2 Normative references .11
3 Terms and definitions .13
4 General .13
5 Test conditions .13
5.1 General .13
5.2 Supply voltage.13
5.3 Frequency range .13
6 Test equipment.13
6.1 General .13
6.2 Shielding .13
6.3 RF measuring instrument .13
6.4 Preamplifier.15
6.5 TEM cell.15
6.6 Wideband TEM/GTEM cell.15
6.7 50-Ohm termination.15
6.8 System gain .15
7 Test set-up .15
7.1 General .15
7.2 Test configuration.15
7.3 Test PCB.17
8 Test procedure .23
8.1 General .23
8.2 Ambient measurement.23
8.3 DUT operational check .23
8.4 DUT emissions measurement .23
9 Test report.25
9.1 General .25
9.2 Measurement conditions.25
10 IC emissions reference levels.25

Annex A (informative) Example calibration & set-up verification sheet .27
Annex B (informative) TEM cell and wideband TEM cell descriptions .29
B.1 TEM cell .29
B.2 Wideband GTEM cell.29

Annex C (informative) Calculation of dipole moment from measured data .31
C.1 General .31
C.2 Dipole moment calculation.31

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SIST EN 61967-2:2006
61967-2  IEC:2005 – 5 –
Annex D (informative) Specification of emissions data .35
D.1 General.35
D.2 Specification of emission levels .35
D.3 Presentation of results.35
D.4 Examples.35

Bibliography.41

Figure 1 – TEM cell test set-up .17
Figure 2 – GTEM cell test set-up.17
Figure 3 – IC Test printed circuit board .21
Figure D.1 – Emission characterization levels .37
Figure D.2 – Maximum Emission Level G8f.39

Table 1 − Pin loading recommendations.19

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SIST EN 61967-2:2006
61967-2  IEC:2005 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –

Part 2: Measurement of radiated emissions –
TEM cell and wideband TEM cell method

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61967-2 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47A/722/FDIS 47A/729/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

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SIST EN 61967-2:2006
61967-2  IEC:2005 – 9 –
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
This part of IEC 61967 is to be read in conjunction with IEC 61967-1.
IEC 61967 consists of the following parts, under the general title Integrated circuits –
Measurement of electromagnetic emissions, 150 kHz to 1 GHz:
Part 1: General conditions and definitions
Part 2: Measurement of radiated emissions – TEM cell and wideband TEM cell method
Part 3: Measurement of radiated emissions – Surface scan method
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
Part 5: Measurement of conducted emissions – Workbench Faraday Cage method
Part 6: Measurement of conducted emissions – Magnetic probe method
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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SIST EN 61967-2:2006
61967-2  IEC:2005 – 11 –
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz to 1 GHz –

Part 2: Measurement of radiated emissions –
TEM cell and wideband TEM cell method



1 Scope
This test procedure defines a method for measuring the electromagnetic radiation from an
integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board
(PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a
transverse electromagnetic (TEM) or wideband gigahertz TEM (GTEM) cell. The test board is
not inside the cell, as in the conventional usage, but becomes a part of the cell wall. This
method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however,
the measured radio frequency (RF) voltage will be affected by many factors. The primary
factor affecting the measured RF voltage is the septum to IC test board (cell wall) spacing.
This procedure was developed using a 1 GHz TEM cell with a septum to floor spacing of
45 mm and a GTEM cell with average septum to floor spacing of 45 mm over the port area.
Other cells may not produce identical spectral output but may be used for comparative
measurements, subject to their frequency and sensitivity limitations. A conversion factor may
allow comparisons between data measured on TEM or GTEM cells with different septum to
floor spacing.
The IC test board controls the geometry and orientation of the operating IC relative to the cell
and eliminates any connecting leads within the cell (these are on the backside of the board,
which is outside the cell). For the TEM cell, one of the 50 Ω ports is terminated with a 50 Ω
load. The other 50 Ω port for a TEM cell, or the single 50 Ω port for a GTEM cell, is connected
to the input of a spectrum analyser or receiver that measures the RF emissions emanating
from the integrated circuit and impressed onto the septum of the cell.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60050-131:2002, International Electrotechnical Vocabulary (IEV) – Part 131: Circuit
theory
IEC 60050-161:1990, International Electrotechnical Vocabulary (IEV) – Chapter 161: Electro-
magnetic compatibility
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 1: General conditions and definitions

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SIST EN 61967-2:2006
61967-2  IEC:2005 – 13 –
3 Terms and definitions
For the purposes of this document, the definitions in IEC 61967-1, IEC 60050-131 and
IEC 60050-161 apply.
4 General
The RF voltage appearing at the input to the spectrum analyser is related to the
electromagnetic radiation potential of the IC and of the electronic module of which it would be
a part. The intent is to provide a quantitative measure of the RF emissions from ICs for
comparison or other purposes.
5 Test conditions
5.1 General
The test conditions shall meet the requirements as described in IEC 61967-1. In addition, the
following test conditions shall apply.
5.2 Supply voltage
The supply voltage shall be as specified by the IC manufacturer. If the users of this procedure
agree to other values, they shall be documented in the test report.
5.3 Frequency range
The effective frequency range of this radiated emissions procedure is affected by the test cell
used. For a 1 GHz TEM cell, the range is 150 kHz to 1 GHz. For a wideband TEM cell (GTEM),
the range is 150 kHz to 1 GHz, or as limited by the GTEM and test PCB characteristics.
6 Test equipment
6.1 General
The test equipment shall meet the requirements as described in IEC 61967-1. In addition, the
following test equipment requirements shall apply.
6.2 Shielding
Double shielded or semi-rigid coaxial cable may be required depending on the local ambient
conditions. For extreme ambient environments, operation in a shielded room may be required.
6.3 RF measuring instrument
A spectrum analyser or EMI receiver shall be used. The spectrum analyser or receiver
resolution bandwidth shall be 9 kHz or 10 kHz and the video bandwidth shall not be less than
three times the resolution bandwidth. Measurements shall be made with a peak detector and
presented in units of dBµV [for 50 Ω system: (dBm readings) + 107 = dBµV]. For spectrum
analysers, the frequency band of interest shall be swept in calibrated or coupled mode (auto
sweep).

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SIST EN 61967-2:2006
61967-2  IEC:2005 – 15 –
6.4 Preamplifier
Typically, a 20 dB to 30 dB gain, low noise preamplifier is required to meet the ambient
requirements in 8.2. If used, the preamplifier shall be connected directly to the measurement
port of the TEM cell using the appropriate 50 Ω coaxial adapter; no cable shall be used.
6.5 TEM cell
The TEM cell used for this test procedure shall be fitted with a wall port sized to mate with the
IC test board. The TEM cell shall not exhibit higher order modes over the frequency range
being measured. For this procedure, the recommended TEM cell frequency range is 150 kHz
to the frequency of the first resonance of the lowest higher order mode (typically < 2 GHz).
The frequency range being evaluated shall be covered using a single cell. The voltage
standing wave ratio (VSWR) over the frequency range being measured shall be less than 1,5.
6.6 Wideband TEM/GTEM cell
The wideband TEM (GTEM) cell used for this test procedure shall be fitted with a wall port
sized to mate with the IC test board. The GTEM cell shall not exhibit higher order modes over
the frequency range being measured. For this procedure, the recommended GTEM cell
frequency range is from 150 kHz to the frequency of the first resonance of the lowest higher
order mode (typically > 2 GHz). The frequency range being evaluated shall be covered using
a single cell. The VSWR over the frequency range being measured shall be less than 1,5.
6.7 50-Ω termination
A 50 Ω termination with a VSWR less than 1,1 over the frequency range of measurement is
required for the TEM cell 50 Ω port not connected to the RF measuring instrument.
6.8 System gain
The gain (or attenuation) of the measuring equipment, without the TEM or GTEM cell, shall be
known with an accuracy ± 0,5 dB. The gain of the equipment shall remain within a 6 dB
envelope for each frequency band.
7 Test set-up
7.1 General
The test set-up shall meet the requirements as described in IEC 61967-1. In addition, the
following test set-up requirements shall apply.
7.2 Test configuration
See Figure 1 and Figure 2 for TEM cell and GTEM cell test configurations, respectively. One
of the TEM cell 50 Ω ports is terminated with a 50 Ω load. The remaining TEM cell or GTEM
50 Ω port is connected to the spectrum analyser through the optional preamplifier.

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SIST EN 61967-2:2006
61967-2  IEC:2005 – 17 –



IC test board




Preamplifier

(optional)


50 Ω
Spectrum analyzer or

termination
TEM cell EMI receiver

IEC  1305/05

Figure 1 – TEM cell test set-up

IC test board







Preamplifier
(optional)

GTEM cell


Spectrum analyzer or
EMI receiver

IEC  1306/05
Figure 2 – GTEM cell test set-up
7.3 Test PCB
The IC test PCB shall be designed as described in IEC 61967-1 and in this document. In
cases where IEC 61967-1 and this document disagree, the requirements of this document
shall govern.
The minimum requirements for the IC test PCB are shown in Figure 3. Figure 3 describes a
2
100 cm PCB consisting of four metal layers. In theory, any size or shape of PCB may be used
that will mate with the wall port on the test cell used. However, the development of this
2 2
procedure was with a nominal 100 cm PCB and a nominal 100 cm mating wall port (refer to
Figures 1 and 2). The PCB may also contain additional inner layers as required to
accommodate signal and power routing. A description of the test board set-up (photo or
artwork, schematic and parts list) shall be included with the test report.
The DUT side of the printed circuit board (the side that faces in to the test cell) is dedicated to
a ground plane layer that completes the TEM or GTEM cell wall over the port opening. No
other conductors are allowed on this surface because they may act as additional radiators.
The ground plane should extend under the DUT, where practical for the IC package type. If
the ground plane under the DUT is isolated from the rest of the ground plane layer, utilize an
inner PCB ground layer and vias to establish the needed connection. The periphery of this
ground plane layer shall be plated (tin, solder, gold) to facilitate contact to the edge of the
wall port cut in the top or bottom of the test cell.

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SIST EN 61967-2:2006
61967-2  IEC:2005 – 19 –
The access wiring and other required components (such as crystals) shall be on or connected
to the support side of this circuit board (the side that faces out from the TEM or GTEM cell).
Power bypass capacitors for the IC are to be chosen according to manufacturers’
recommendations and located to minimise lead length (refer to Table 1). All wiring should be
as short as possible and have controlled orientation relative to the PCB. The PCB material
shall be compatible with the frequency range being evaluated.
Pins that do not fall into any of the listed categories shall be loaded as functionally required
and stated in the test report. These are recommended default values; if other values are more
appropriate for a particular IC, they may be substituted for the values in Table 1 and shall be
stated in the test report.
Table 1 − Pin loading recommendations
IC Pin Type Pin Loading
Analog
a
- Supply As stated by the manufacturer (or as required)
- Input 10 kΩ to ground (Vss) unless the IC is internally terminated
- Output Signal
10 kΩ to ground (Vss) unless the IC is internally terminated
- Output Power Nominal loading as stated by the manufacturer
Digital
a
- Supply As stated by the manufacturer (or as required)
Ground (Vss) or 10 kΩ to supply (Vdd) if cannot ground, unless the IC is interna
...