Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method

Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 8: Messung der abgestrahlten Aussendungen - IC-Streifenleiterverfahren

Circuits intégrés - Mesure des émissions électromagnétiques - Partie 8: Mesure des émissions rayonnées - Méthode de la ligne TEM à plaques (stripline) pour CI

Integrirana vezja - Meritve elektromagnetnega sevanja - 8. del: Merjenje sevanega oddajanja - Metoda z IC na tračnem valovodu

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Status
Not Published
Public Enquiry End Date
20-Oct-2022
Technical Committee
Current Stage
4020 - Public enquire (PE) (Adopted Project)
Start Date
05-Aug-2022
Due Date
23-Dec-2022

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SLOVENSKI STANDARD
oSIST prEN IEC 61967-8:2022
01-oktober-2022

Integrirana vezja - Meritve elektromagnetnega sevanja - 8. del: Merjenje sevanega

oddajanja - Metoda z IC na tračnem valovodu

Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement

of radiated emissions - IC stripline method
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 8:
Messung der abgestrahlten Aussendungen - IC-Streifenleiterverfahren

Circuits intégrés - Mesure des émissions électromagnétiques - Partie 8: Mesure des

émissions rayonnées - Méthode de la ligne TEM à plaques (stripline) pour CI
Ta slovenski standard je istoveten z: prEN IEC 61967-8:2022
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
oSIST prEN IEC 61967-8:2022 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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oSIST prEN IEC 61967-8:2022
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oSIST prEN IEC 61967-8:2022
47A/1141/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61967-8 ED2
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2022-07-29 2022-10-21
SUPERSEDES DOCUMENTS:
47A/1136/CD, 47A/1139A/CC
IEC SC 47A : INTEGRATED CIRCUITS
SECRETARIAT: SECRETARY:
Japan Mr Yoshinori FUKUBA
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY

SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING

Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.

This document is still under study and subject to change. It should not be used for reference purposes.

Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they

are aware and to provide supporting documentation.
TITLE:

Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated

emissions - IC stripline method
PROPOSED STABILITY DATE: 2028
NOTE FROM TC/SC OFFICERS:

The comments for 47A/1136/CD were reviewed in SC 47A WG 9 meeting which was held in 2022-05-30 and all

technical issues were resolved and addressed in 47A/1139A/CC, so the project will move forward as CDV.

Copyright © 2022 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this

electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.

You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without

permission in writing from IEC.
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oSIST prEN IEC 61967-8:2022
61967-8/Ed2/CDV  IEC (E) – 2 – 47A/1141/CDV
1 CONTENTS

2 FOREWORD ........................................................................................................................... 4

3 1 Scope ............................................................................................................................... 6

4 2 Normative references ....................................................................................................... 6

5 3 Terms and definitions ....................................................................................................... 6

6 3.1 Transverse electromagnetic (TEM) mode ................................................................ 6

7 TEM waveguide ....................................................................................................... 6

3.2

8 3.3 IC stripline ............................................................................................................... 6

9 3.4 Two-port TEM waveguide ........................................................................................ 7

10 3.5 Characteristic impedance ........................................................................................ 7

11 3.6 Primary (field) component ....................................................................................... 7

12 4 General ............................................................................................................................ 7

13 5 Test conditions ................................................................................................................. 7

14 5.1 General ................................................................................................................... 7

15 Supply voltage......................................................................................................... 7

5.2

16 5.3 Frequency range ..................................................................................................... 7

17 6 Test equipment ................................................................................................................. 7

18 6.1 General ................................................................................................................... 7

19 RF measuring instrument ........................................................................................ 7

6.2

20 6.3 Preamplifier ............................................................................................................. 8

21 6.4 IC stripline ............................................................................................................... 8

22 6.5 50-Ohm termination ................................................................................................. 8

23 6.6 System gain ............................................................................................................ 8

24 7 Test set-up ....................................................................................................................... 8

25 7.1 General ................................................................................................................... 8

26 7.2 Test configuration .................................................................................................... 8

27 7.3 EMC test board (PCB) ............................................................................................. 9

28 8 Test procedure ................................................................................................................. 9

29 8.1 General ................................................................................................................... 9

30 8.2 Ambient conditions .................................................................................................. 9

31 8.3 Operational check ................................................................................................. 10

32 8.4 Verification of IC stripline RF characteristic ........................................................... 10

33 Test technique....................................................................................................... 10

8.5

34 9 Test report...................................................................................................................... 10

35 9.1 General ................................................................................................................. 10

36 9.2 Measurement conditions ........................................................................................ 11

37 IC Emissions reference levels......................................................................................... 11

38 Annex A (Normative) IC stripline description ........................................................................ 12

39 General .......................................................................................................................... 12

A.1

40 A.2 Characteristic impedance of stripline arrangements ........................................................ 13

41 Conversion for different active conductor heights ........................................................... 13

A.3

42 A.4 Example for IC stripline arrangement .............................................................................. 14

43 Annex B (informative) Specification of emission levels ......................................................... 15

44 B.1 Scope ............................................................................................................................. 15

45 B.2 General .......................................................................................................................... 15

46 B.3 Specification of emission levels ...................................................................................... 15

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oSIST prEN IEC 61967-8:2022
61967-8/Ed2/CDV  IEC (E) – 3 – 47A/1141/CDV

47 B.4 Presentation of results .................................................................................................... 16

50 FIGURES

52 Figure 1 – IC stripline test set-up ............................................................................................ 9

53 Figure A.1 – Cross section view of an example of an unshielded IC stripline ......................... 12

54 Figure A.2 – Cross section view of an example of an IC stripline with housing ...................... 12

55 Figure A.3 – Example of IC stripline with housing ................................................................. 14

56 Figure B.1 – Emission characterization levels ....................................................................... 16

58 TABLES

59 Table A.1 – Maximum DUT dimensions for 6,7 mm IC stripline open version ........................ 13

60 Table A.2 – Maximum DUT dimensions for 6,7 mm IC stripline closed version ...................... 13

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oSIST prEN IEC 61967-8:2022
61967-8/Ed2/CDV  IEC (E) – 4 – 47A/1141/CDV
62 INTERNATIONAL ELECTROTECHNICAL COMMISSION
63 ____________
65 INTEGRATED CIRCUITS −
66 MEASUREMENT OF ELECTROMAGNETIC EMISSIONS
68 Part 8: Measurement of radiated emissions –
69 IC stripline method
72 FOREWORD

73 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

74 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

75 co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

76 in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

77 Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their

78 preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

79 may participate in this preparatory work. International, governmental and non-governmental organizations liaising

80 with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

81 Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

82 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

83 consensus of opinion on the relevant subjects since each technical committee has representation from all

84 interested IEC National Committees.

85 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

86 Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

87 Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

88 misinterpretation by any end user.

89 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

90 transparently to the maximum extent possible in their national and regional publications. Any divergence between

91 any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.

92 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment

93 declared to be in conformity with an IEC Publication.

94 6) All users should ensure that they have the latest edition of this publication.

95 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

96 members of its technical committees and IEC National Committees for any personal injury, property damage or

97 other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

98 expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.

99 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

100 indispensable for the correct application of this publication.

101 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

102 rights. IEC shall not be held responsible for identifying any or all such patent rights.

103 International Standard IEC 61967-8 has been prepared by subcommittee 47A: Integrated

104 circuits, of IEC technical committee 47: Semiconductor devices.

105 This second edition cancels and replaces the first edition published in 2011. This edition

106 constitutes a technical revision.

107 This edition includes the following significant technical changes with respect to the previous

108 edition:
109 a) frequency range of 150 kHz to 3 GHz was deleted from the scope;

110 b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements

111 are fulfilled
112 It bears the edition number 2.
113 The text of this standard is based on the following documents:
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oSIST prEN IEC 61967-8:2022
61967-8/Ed2/CDV  IEC (E) – 5 – 47A/1141/CDV
FDIS Report on voting
47A/XXX/FDIS 47A/XXX/RVD
114

115 Full information on the voting for the approval of this standard can be found in the report on

116 voting indicated in the above table.

117 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

118 A list of all parts of the IEC 61967 series, under the general title Integrated circuits –

119 Measurement of electromagnetic emissions can be found on the IEC website.

120 Future standards in this series will carry the new general title as cited above. Titles of existing

121 standards in this series will be updated at the time of the next edition.

122 The committee has decided that the contents of this publication will remain unchanged until the

123 stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to

124 the specific publication. At this date, the publication will be
125 • reconfirmed,
126 • withdrawn,
127 • replaced by a revised edition, or
128 • amended.
129
130
131
132
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oSIST prEN IEC 61967-8:2022
61967-8/Ed2/CDV  IEC (E) – 6 – 47A/1141/CDV
133 INTEGRATED CIRCUITS −
134 MEASUREMENT OF ELECTROMAGNETIC EMISSIONS
135
136 Part 8: Measurement of radiated emissions –
137 IC stripline method
138
139
140
141 1 Scope

142 This measurement procedure defines a method for measuring the electromagnetic radiated

143 emission from an integrated circuit (IC) using an IC stripline. The IC being evaluated is mounted

144 on an EMC test board (PCB) between the active conductor and the ground plane of the IC

145 stripline arrangement.
146 2 Normative references

147 The following referenced documents are indispensable for the application of this document. For

148 dated references, only the edition cited applies. For undated references, the latest edition of

149 the referenced document (including any amendments) applies.

150 IEC 60050(131), International Electrotechnical Vocabulary (IEV) – Part 131: Circuit theory

151 IEC 60050(161), International Electrotechnical Vocabulary (IEV) – Chapter 161: Electro-

152 magnetic compatibility

153 IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions – Part 1: General

154 conditions and definitions

155 IEC 61000-4-20, Electromagnetic compatibility (EMC) - Part 4-20: Testing and measurement

156 techniques - Emission and immunity testing in transverse electromagnetic (TEM) waveguides

157 3 Terms and definitions

158 For the purposes of this document, the definitions in IEC 61967-1, IEC 60050(131) and IEC

159 60050(161), as well as the following, apply.
160 3.1 Transverse electromagnetic (TEM) mode

161 waveguide mode in which the components of the electric and magnetic fields in the propagation

162 direction are much less than the primary field components across any transverse cross-section.

163 3.2 TEM waveguide

164 open or closed transmission line system, in which a wave is propagating in the transverse

165 electromagnetic mode to produce a specified field for testing purposes.
166 3.3 IC stripline

167 TEM waveguide, consisting of an active conductor placed on a defined spacing over an enlarged

168 ground plane, connected to a port structure on either end and an optional shielded enclosure.

169 NOTE: This arrangement guides a wave propagation in the transverse electromagnetic mode to produce a specific

170 field for testing purposes between the active conductor and the enlarged ground plane. As enlarged ground plane

171 the ground plane of the standard EMC test board according to IEC 61967-1 should be used. An optional shielding

172 enclosure may be used for fixing the IC stripline configuration and for shielding purposes. This leads to a closed

173 version of the IC stripline in opposite to the open version without shielding enclosure. For further information see

174 Annex A.
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oSIST prEN IEC 61967-8:2022
61967-8/Ed2/CDV  IEC (E) – 7 – 47A/1141/CDV
175 3.4 Two-port TEM waveguide
176 TEM waveguide with input/output measurement ports at both ends.
177 3.5 Characteristic impedance

178 magnitude of the ratio of the voltage between the active conductor and the corresponding

179 ground plane to the current on either conductor for any constant phase wave-front.

180 NOTE: The characteristic impedance is independent of the voltage/current magnitudes and depends only on the

181 cross sectional geometry of the transmission line. TEM waveguides are typically designed to have a 50 Ω

182 characteristic impedance. For further information and equation to stripline arrangements see Annex A.

183 3.6 Primary (field) component
184 electric field component aligned with the intended test polarization.

185 NOTE: For example, in IC stripline, the active conductor is parallel to the horizontal floor, and the primary mode

186 electric field vector is vertical at the transverse centre of the IC stripline.

187 4 General

188 This test method is based on the TEM wave guide measurement principle according to

189 IEC 61000-4-20. A stripline set-up is used to measure the RF emission of ICs. The RF voltage

190 at the stripline port is related to the electromagnetic radiation potential of the IC and will be

191 measured using a spectrum analyzer or measuring receiver. The intent of
...

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