oSIST prEN IEC 61967-8:2022
(Main)Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 8: Messung der abgestrahlten Aussendungen - IC-Streifenleiterverfahren
Circuits intégrés - Mesure des émissions électromagnétiques - Partie 8: Mesure des émissions rayonnées - Méthode de la ligne TEM à plaques (stripline) pour CI
Integrirana vezja - Meritve elektromagnetnega sevanja - 8. del: Merjenje sevanega oddajanja - Metoda z IC na tračnem valovodu
General Information
RELATIONS
Standards Content (sample)
SLOVENSKI STANDARD
oSIST prEN IEC 61967-8:2022
01-oktober-2022
Integrirana vezja - Meritve elektromagnetnega sevanja - 8. del: Merjenje sevanega
oddajanja - Metoda z IC na tračnem valovoduIntegrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement
of radiated emissions - IC stripline methodIntegrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 8:
Messung der abgestrahlten Aussendungen - IC-Streifenleiterverfahren
Circuits intégrés - Mesure des émissions électromagnétiques - Partie 8: Mesure des
émissions rayonnées - Méthode de la ligne TEM à plaques (stripline) pour CITa slovenski standard je istoveten z: prEN IEC 61967-8:2022
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
oSIST prEN IEC 61967-8:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------oSIST prEN IEC 61967-8:2022
---------------------- Page: 2 ----------------------
oSIST prEN IEC 61967-8:2022
47A/1141/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61967-8 ED2
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2022-07-29 2022-10-21
SUPERSEDES DOCUMENTS:
47A/1136/CD, 47A/1139A/CC
IEC SC 47A : INTEGRATED CIRCUITS
SECRETARIAT: SECRETARY:
Japan Mr Yoshinori FUKUBA
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel votingThe attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they
are aware and to provide supporting documentation.TITLE:
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated
emissions - IC stripline methodPROPOSED STABILITY DATE: 2028
NOTE FROM TC/SC OFFICERS:
The comments for 47A/1136/CD were reviewed in SC 47A WG 9 meeting which was held in 2022-05-30 and all
technical issues were resolved and addressed in 47A/1139A/CC, so the project will move forward as CDV.
Copyright © 2022 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.---------------------- Page: 3 ----------------------
oSIST prEN IEC 61967-8:2022
61967-8/Ed2/CDV IEC (E) – 2 – 47A/1141/CDV
1 CONTENTS
2 FOREWORD ........................................................................................................................... 4
3 1 Scope ............................................................................................................................... 6
4 2 Normative references ....................................................................................................... 6
5 3 Terms and definitions ....................................................................................................... 6
6 3.1 Transverse electromagnetic (TEM) mode ................................................................ 6
7 TEM waveguide ....................................................................................................... 6
3.28 3.3 IC stripline ............................................................................................................... 6
9 3.4 Two-port TEM waveguide ........................................................................................ 7
10 3.5 Characteristic impedance ........................................................................................ 7
11 3.6 Primary (field) component ....................................................................................... 7
12 4 General ............................................................................................................................ 7
13 5 Test conditions ................................................................................................................. 7
14 5.1 General ................................................................................................................... 7
15 Supply voltage......................................................................................................... 7
5.216 5.3 Frequency range ..................................................................................................... 7
17 6 Test equipment ................................................................................................................. 7
18 6.1 General ................................................................................................................... 7
19 RF measuring instrument ........................................................................................ 7
6.220 6.3 Preamplifier ............................................................................................................. 8
21 6.4 IC stripline ............................................................................................................... 8
22 6.5 50-Ohm termination ................................................................................................. 8
23 6.6 System gain ............................................................................................................ 8
24 7 Test set-up ....................................................................................................................... 8
25 7.1 General ................................................................................................................... 8
26 7.2 Test configuration .................................................................................................... 8
27 7.3 EMC test board (PCB) ............................................................................................. 9
28 8 Test procedure ................................................................................................................. 9
29 8.1 General ................................................................................................................... 9
30 8.2 Ambient conditions .................................................................................................. 9
31 8.3 Operational check ................................................................................................. 10
32 8.4 Verification of IC stripline RF characteristic ........................................................... 10
33 Test technique....................................................................................................... 10
8.534 9 Test report...................................................................................................................... 10
35 9.1 General ................................................................................................................. 10
36 9.2 Measurement conditions ........................................................................................ 11
37 IC Emissions reference levels......................................................................................... 11
38 Annex A (Normative) IC stripline description ........................................................................ 12
39 General .......................................................................................................................... 12
A.140 A.2 Characteristic impedance of stripline arrangements ........................................................ 13
41 Conversion for different active conductor heights ........................................................... 13
A.342 A.4 Example for IC stripline arrangement .............................................................................. 14
43 Annex B (informative) Specification of emission levels ......................................................... 15
44 B.1 Scope ............................................................................................................................. 15
45 B.2 General .......................................................................................................................... 15
46 B.3 Specification of emission levels ...................................................................................... 15
---------------------- Page: 4 ----------------------oSIST prEN IEC 61967-8:2022
61967-8/Ed2/CDV IEC (E) – 3 – 47A/1141/CDV
47 B.4 Presentation of results .................................................................................................... 16
50 FIGURES52 Figure 1 – IC stripline test set-up ............................................................................................ 9
53 Figure A.1 – Cross section view of an example of an unshielded IC stripline ......................... 12
54 Figure A.2 – Cross section view of an example of an IC stripline with housing ...................... 12
55 Figure A.3 – Example of IC stripline with housing ................................................................. 14
56 Figure B.1 – Emission characterization levels ....................................................................... 16
58 TABLES59 Table A.1 – Maximum DUT dimensions for 6,7 mm IC stripline open version ........................ 13
60 Table A.2 – Maximum DUT dimensions for 6,7 mm IC stripline closed version ...................... 13
---------------------- Page: 5 ----------------------oSIST prEN IEC 61967-8:2022
61967-8/Ed2/CDV IEC (E) – 4 – 47A/1141/CDV
62 INTERNATIONAL ELECTROTECHNICAL COMMISSION
63 ____________
65 INTEGRATED CIRCUITS −
66 MEASUREMENT OF ELECTROMAGNETIC EMISSIONS
68 Part 8: Measurement of radiated emissions –
69 IC stripline method
72 FOREWORD
73 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
74 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
75 co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
76 in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
77 Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
78 preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
79 may participate in this preparatory work. International, governmental and non-governmental organizations liaising
80 with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
81 Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
82 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
83 consensus of opinion on the relevant subjects since each technical committee has representation from all
84 interested IEC National Committees.85 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
86 Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
87 Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
88 misinterpretation by any end user.89 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
90 transparently to the maximum extent possible in their national and regional publications. Any divergence between
91 any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
92 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment
93 declared to be in conformity with an IEC Publication.94 6) All users should ensure that they have the latest edition of this publication.
95 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
96 members of its technical committees and IEC National Committees for any personal injury, property damage or
97 other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
98 expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
99 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
100 indispensable for the correct application of this publication.101 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
102 rights. IEC shall not be held responsible for identifying any or all such patent rights.
103 International Standard IEC 61967-8 has been prepared by subcommittee 47A: Integrated
104 circuits, of IEC technical committee 47: Semiconductor devices.105 This second edition cancels and replaces the first edition published in 2011. This edition
106 constitutes a technical revision.107 This edition includes the following significant technical changes with respect to the previous
108 edition:109 a) frequency range of 150 kHz to 3 GHz was deleted from the scope;
110 b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements
111 are fulfilled112 It bears the edition number 2.
113 The text of this standard is based on the following documents:
---------------------- Page: 6 ----------------------
oSIST prEN IEC 61967-8:2022
61967-8/Ed2/CDV IEC (E) – 5 – 47A/1141/CDV
FDIS Report on voting
47A/XXX/FDIS 47A/XXX/RVD
114
115 Full information on the voting for the approval of this standard can be found in the report on
116 voting indicated in the above table.117 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
118 A list of all parts of the IEC 61967 series, under the general title Integrated circuits –
119 Measurement of electromagnetic emissions can be found on the IEC website.120 Future standards in this series will carry the new general title as cited above. Titles of existing
121 standards in this series will be updated at the time of the next edition.122 The committee has decided that the contents of this publication will remain unchanged until the
123 stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to
124 the specific publication. At this date, the publication will be125 • reconfirmed,
126 • withdrawn,
127 • replaced by a revised edition, or
128 • amended.
129
130
131
132
---------------------- Page: 7 ----------------------
oSIST prEN IEC 61967-8:2022
61967-8/Ed2/CDV IEC (E) – 6 – 47A/1141/CDV
133 INTEGRATED CIRCUITS −
134 MEASUREMENT OF ELECTROMAGNETIC EMISSIONS
135
136 Part 8: Measurement of radiated emissions –
137 IC stripline method
138
139
140
141 1 Scope
142 This measurement procedure defines a method for measuring the electromagnetic radiated
143 emission from an integrated circuit (IC) using an IC stripline. The IC being evaluated is mounted
144 on an EMC test board (PCB) between the active conductor and the ground plane of the IC
145 stripline arrangement.146 2 Normative references
147 The following referenced documents are indispensable for the application of this document. For
148 dated references, only the edition cited applies. For undated references, the latest edition of
149 the referenced document (including any amendments) applies.150 IEC 60050(131), International Electrotechnical Vocabulary (IEV) – Part 131: Circuit theory
151 IEC 60050(161), International Electrotechnical Vocabulary (IEV) – Chapter 161: Electro-
152 magnetic compatibility153 IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions – Part 1: General
154 conditions and definitions155 IEC 61000-4-20, Electromagnetic compatibility (EMC) - Part 4-20: Testing and measurement
156 techniques - Emission and immunity testing in transverse electromagnetic (TEM) waveguides
157 3 Terms and definitions158 For the purposes of this document, the definitions in IEC 61967-1, IEC 60050(131) and IEC
159 60050(161), as well as the following, apply.160 3.1 Transverse electromagnetic (TEM) mode
161 waveguide mode in which the components of the electric and magnetic fields in the propagation
162 direction are much less than the primary field components across any transverse cross-section.
163 3.2 TEM waveguide164 open or closed transmission line system, in which a wave is propagating in the transverse
165 electromagnetic mode to produce a specified field for testing purposes.166 3.3 IC stripline
167 TEM waveguide, consisting of an active conductor placed on a defined spacing over an enlarged
168 ground plane, connected to a port structure on either end and an optional shielded enclosure.
169 NOTE: This arrangement guides a wave propagation in the transverse electromagnetic mode to produce a specific
170 field for testing purposes between the active conductor and the enlarged ground plane. As enlarged ground plane
171 the ground plane of the standard EMC test board according to IEC 61967-1 should be used. An optional shielding
172 enclosure may be used for fixing the IC stripline configuration and for shielding purposes. This leads to a closed
173 version of the IC stripline in opposite to the open version without shielding enclosure. For further information see
174 Annex A.---------------------- Page: 8 ----------------------
oSIST prEN IEC 61967-8:2022
61967-8/Ed2/CDV IEC (E) – 7 – 47A/1141/CDV
175 3.4 Two-port TEM waveguide
176 TEM waveguide with input/output measurement ports at both ends.
177 3.5 Characteristic impedance
178 magnitude of the ratio of the voltage between the active conductor and the corresponding
179 ground plane to the current on either conductor for any constant phase wave-front.
180 NOTE: The characteristic impedance is independent of the voltage/current magnitudes and depends only on the
181 cross sectional geometry of the transmission line. TEM waveguides are typically designed to have a 50 Ω
182 characteristic impedance. For further information and equation to stripline arrangements see Annex A.
183 3.6 Primary (field) component184 electric field component aligned with the intended test polarization.
185 NOTE: For example, in IC stripline, the active conductor is parallel to the horizontal floor, and the primary mode
186 electric field vector is vertical at the transverse centre of the IC stripline.
187 4 General188 This test method is based on the TEM wave guide measurement principle according to
189 IEC 61000-4-20. A stripline set-up is used to measure the RF emission of ICs. The RF voltage
190 at the stripline port is related to the electromagnetic radiation potential of the IC and will be
191 measured using a spectrum analyzer or measuring receiver. The intent of...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.