Integrated circuits - EMC evaluation of transceivers - Part 7: CXPI transceivers (IEC 62228-7:2022)

This part of IEC 62228 specifies test and measurement methods for the EMC evaluation of CXPI transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. This specification is applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and covers
- the emission of RF disturbances,
- the immunity against RF disturbances,
- the immunity against impulses and
- the immunity against electrostatic discharges (ESD).

Integrierte Schaltungen - Bewertung der elektromagnetischen Verträglichkeit von Sende-Empfangsgeräten – Teil 7: CXPI-Sende-Empfangsgeräte (IEC 62228-7:2022)

Circuits intégrés - Évaluation de la CEM des émetteurs-récepteurs - Partie 7: Émetteurs-récepteurs CXPI (IEC 62228-7:2022)

L’IEC 62228-7:2022 spécifie les méthodes d’essai et de mesure pour l’évaluation de la compatibilité électromagnétique (CEM) des circuits intégrés émetteurs-récepteurs CXPI placés en réseau. Elle définit les configurations d’essai, les conditions d’essai, les signaux d’essai, les critères de défaillance, les modes opératoires d’essai, les montages d’essai et les cartes d’essai. La présente spécification s’applique aux circuits intégrés émetteurs-récepteurs CXPI standard et aux circuits intégrés avec émetteur-récepteur CXPI intégré, et couvre:  l’émission de perturbations radioélectriques; l’immunité aux perturbations radioélectriques; l’immunité aux transitoires électriques; l’immunité aux décharges électrostatiques (DES).

Integrirana vezja - Vrednotenje elektromagnetne združljivosti (EMC) oddajnikov-sprejemnikov - 7. del: Oddajniki-sprejemniki CXPI (IEC 62228-7:2022)

General Information

Status
Published
Publication Date
04-May-2022
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
22-Apr-2022
Due Date
27-Jun-2022
Completion Date
05-May-2022

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SLOVENSKI STANDARD
SIST EN IEC 62228-7:2022
01-junij-2022
Integrirana vezja - Vrednotenje elektromagnetne združljivosti (EMC) oddajnikov-
sprejemnikov - 7. del: Oddajniki-sprejemniki CXPI (IEC 62228-7:2022)

Integrated circuits - EMC evaluation of transceivers - Part 7: CXPI transceivers (IEC

62228-7:2022)

Integrierte Schaltungen - Bewertung der elektromagnetischen Verträglichkeit von Sende-

Empfangsgeräten – Teil 7: CXPI-Sende-Empfangsgeräte (IEC 62228-7:2022)

Circuits intégrés - Évaluation de la CEM des émetteurs-récepteurs - Partie 7: Émetteurs-

récepteurs CXPI (IEC 62228-7:2022)
Ta slovenski standard je istoveten z: EN IEC 62228-7:2022
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST EN IEC 62228-7:2022 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 62228-7:2022
---------------------- Page: 2 ----------------------
SIST EN IEC 62228-7:2022
EUROPEAN STANDARD EN IEC 62228-7
NORME EUROPÉENNE
EUROPÄISCHE NORM April 2022
ICS 31.200
English Version
Integrated circuits - EMC evaluation of transceivers - Part 7:
CXPI transceivers
(IEC 62228-7:2022)

Circuits intégrés - Évaluation de la CEM des émetteurs- Integrierte Schaltungen - Bewertung der

récepteurs - Partie 7: Émetteurs-récepteurs CXPI elektromagnetischen Verträglichkeit von Sende-

(IEC 62228-7:2022) Empfangsgeräten - Teil 7: CXPI-Sende-Empfangsgeräte
(IEC 62228-7:2022)

This European Standard was approved by CENELEC on 2022-03-29. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 62228-7:2022 E
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SIST EN IEC 62228-7:2022
EN IEC 62228-7:2022 (E)
European foreword

The text of document 47A/1130/FDIS, future edition 1 of IEC 62228-7, prepared by SC 47A

"Integrated circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC

parallel vote and approved by CENELEC as EN IEC 62228-7:2022.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2022-12-29

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2025-03-29

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Any feedback and questions on this document should be directed to the users’ national committee. A

complete listing of these bodies can be found on the CENELEC website.
Endorsement notice

The text of the International Standard IEC 62228-7:2022 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following note has to be added for the standard indicated:

CISPR 16-1-1 NOTE Harmonized as EN IEC 55016-1-1
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SIST EN IEC 62228-7:2022
EN IEC 62228-7:2022 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),

the relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available

here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61967-1 - Integrated circuits - Measurement of EN IEC 61967-1 -
electromagnetic emissions - Part 1: General
conditions and definitions
IEC 61967-4 - Integrated circuits - Measurement of EN IEC 61967-4 -
electromagnetic emissions - Part 4:
Measurement of conducted emissions - 1
ohm/150 ohm direct coupling method
IEC 62132-1 - Integrated circuits - Measurement of EN 62132-1 -
electromagnetic immunity - Part 1: General
conditions and definitions
IEC 62132-4 2006 Integrated circuits - Measurement of EN 62132-4 2006
electromagnetic immunity 150 kHz to 1 GHz
- Part 4: Direct RF power injection method
IEC 62215-3 - Integrated circuits - Measurement of impulse EN 62215-3 -
immunity - Part 3: Non-synchronous
transient injection method
IEC 62228-1 - Integrated circuits - EMC evaluation of EN IEC 62228-1 -
transceivers - Part 1: General conditions and
definitions
ISO 7637-2 - Road vehicles - Electrical disturbances from - -
conduction and coupling - Part 2: Electrical
transient conduction along supply lines only
ISO 10605 - Road vehicles - Test methods for electrical - -
disturbances from electrostatic discharge
ISO 20794-4 - Road vehicles - Clock extension peripheral - -
interface (CXPI) - Part 4: Data link layer and
physical layer
---------------------- Page: 5 ----------------------
SIST EN IEC 62228-7:2022
---------------------- Page: 6 ----------------------
SIST EN IEC 62228-7:2022
IEC 62228-7
Edition 1.0 2022-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – EMC evaluation of transceivers –
Part 7: CXPI transceivers
Circuits intégrés – Évaluation de la CEM des émetteurs-récepteurs –
Partie 7: Émetteurs-récepteurs CXPI
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-1083-2

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN IEC 62228-7:2022
– 2 – IEC 62228-7:2022 © IEC 2022
CONTENTS

FOREWORD ........................................................................................................................... 5

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms, definitions and abbreviated terms ........................................................................ 8

3.1 Terms and definitions .............................................................................................. 8

3.2 Abbreviated terms ................................................................................................... 8

4 General ........................................................................................................................... 9

5 Test and operating conditions ........................................................................................ 11

5.1 Supply and ambient conditions.............................................................................. 11

5.2 Test operation modes ........................................................................................... 11

5.3 Test configuration ................................................................................................. 12

5.3.1 General test configuration for functional test .................................................. 12

5.3.2 General test configuration for unpowered ESD test ........................................ 13

5.3.3 Coupling ports and coupling networks for functional tests .............................. 13

5.3.4 Coupling ports and coupling networks for unpowered ESD tests .................... 14

5.3.5 Power supply with decoupling network ........................................................... 15

5.4 Test signals .......................................................................................................... 15

5.4.1 General ......................................................................................................... 15

5.4.2 Test signals for normal operation mode ......................................................... 15

5.4.3 Test signal for wake-up from sleep mode ....................................................... 17

5.5 Evaluation criteria ................................................................................................. 18

5.5.1 General ......................................................................................................... 18

5.5.2 Evaluation criteria in functional operation modes during exposure to

disturbances .................................................................................................. 18

5.5.3 Evaluation criteria in unpowered condition after exposure to

disturbances .................................................................................................. 20

5.5.4 Status classes ............................................................................................... 21

6 Test and measurement .................................................................................................. 21

6.1 Emission of RF disturbances ................................................................................. 21

6.1.1 Test method .................................................................................................. 21

6.1.2 Test setup ..................................................................................................... 21

6.1.3 Test procedure and parameters ..................................................................... 22

6.2 Immunity to RF disturbances ................................................................................. 22

6.2.1 Test method .................................................................................................. 22

6.2.2 Test setup ..................................................................................................... 23

6.2.3 Test procedure and parameters ..................................................................... 24

6.3 Immunity to impulses ............................................................................................ 26

6.3.1 Test method .................................................................................................. 26

6.3.2 Test setup ..................................................................................................... 26

6.3.3 Test procedure and parameters ..................................................................... 27

6.4 Electrostatic discharge (ESD) ............................................................................... 30

6.4.1 Test method .................................................................................................. 30

6.4.2 Test setup ..................................................................................................... 30

6.4.3 Test procedure and parameters ..................................................................... 32

7 Test report ..................................................................................................................... 32

Annex A (normative) CXPI test circuits ................................................................................ 33

A.1 General ................................................................................................................. 33

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SIST EN IEC 62228-7:2022
IEC 62228-7:2022 © IEC 2022 – 3 –

A.2 CXPI test circuit for functional tests on standard type-A CXPI transceiver ICs ....... 33

A.3 CXPI test circuit for functional tests on standard type-B CXPI transceiver ICs ....... 36

A.4 CXPI test circuit for functional tests on ICs with embedded CXPI transceiver ........ 38

A.5 CXPI test circuit for unpowered ESD test on a standard type-A CXPI

transceiver IC ....................................................................................................... 39

A.6 CXPI test circuit for unpowered ESD test on a standard type-B CXPI

transceiver IC ....................................................................................................... 40

Annex B (normative) Test circuit boards............................................................................... 42

B.1 Test circuit board for functional tests .................................................................... 42

B.2 ESD test ............................................................................................................... 43

Annex C (informative) Examples for test limits for CXPI transceiver in automotive

application ............................................................................................................................ 44

C.1 General ................................................................................................................. 44

C.2 Emission of RF disturbances ................................................................................. 44

C.3 Immunity to RF disturbances ................................................................................. 44

C.4 Immunity to impulse .............................................................................................. 44

C.5 Electrostatic discharge (ESD) ............................................................................... 44

Annex D (informative) Example of setting for test signals ..................................................... 45

Annex E (informative) Points to note for impulse immunity measurement for functional

status class A .................................................................................................................... 47

E.1 General ................................................................................................................. 47

E.2 Points to note when testing Pulse 1 ...................................................................... 47

Bibliography .......................................................................................................................... 49

Figure 1 – PHY sub-layers overview and CXPI transceiver types .......................................... 10

Figure 2 – General test configuration for tests in functional operation modes ........................ 12

Figure 3 – General test configuration for unpowered ESD test .............................................. 13

Figure 4 – Coupling ports and networks for functional tests .................................................. 13

Figure 5 – Coupling ports and networks for unpowered ESD tests ........................................ 14

Figure 6 – Principal drawing of the maximum deviation in the I-V characteristic .................... 20

Figure 7 – Test setup for measurement of RF disturbances .................................................. 21

Figure 8 – Test setup for DPI tests........................................................................................ 23

Figure 9 – Test setup for impulse immunity tests .................................................................. 27

Figure 10 – Test setup for direct ESD tests ........................................................................... 31

Figure A.1 – General drawing of the circuit diagram of the test network for standard

type-A CXPI transceiver ICs for functional tests .................................................................... 35

Figure A.2 – General drawing of the circuit diagram of the test network for standard

type-B CXPI transceiver ICs for functional tests .................................................................... 37

Figure A.3 – General drawing of the circuit diagram of the test network for ICs with

embedded CXPI transceiver for functional tests .................................................................... 39

Figure A.4 – A general drawing of the test circuit diagram for testing direct ESD of

CXPI transceiver in unpowered mode ................................................................................... 40

Figure A.5 – A general drawing of the test circuit diagram for testing direct ESD of

CXPI standard Type-B transceiver in unpowered mode ......................................................... 41

Figure B.1 – Example of IC interconnections of CXPI signal ................................................. 42

Figure B.2 – Example of ESD test board for CXPI transceiver ICs ........................................ 43

Figure D.1 – Example of signal setting for standard type-A in 2 transceiver

configuration ......................................................................................................................... 45

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SIST EN IEC 62228-7:2022
– 4 – IEC 62228-7:2022 © IEC 2022
Figure D.2 – Example of signal setting for standard type-B in 2 transceiver

configuration ......................................................................................................................... 46

Figure E.1 – Relationship between ISO 7637-2 Pulse 1 and transceiver VBAT supply .......... 47

Figure E.2 – Transceiver VBAT supply image when t time is shortened ............................... 48

Table 1 – Types for CXPI transceiver ...................................................................................... 9

Table 2 – Overview of required measurement and tests ........................................................ 10

Table 3 – Supply and ambient conditions for functional operation ......................................... 11

Table 4 – Definition of coupling ports and coupling network components for functional

tests ..................................................................................................................................... 14

Table 5 – Definitions of coupling ports for unpowered ESD tests ........................................... 15

Table 6 – Communication test signal TX1 ............................................................................. 16

Table 7 – Communication test signal TX2 ............................................................................. 17

Table 8 – Communication test signal TX3 ............................................................................. 17

Table 9 – Wake-up test signal TX4 ....................................................................................... 18

Table 10 – Evaluation criteria for standard type-A in functional operation modes .................. 19

Table 11 – Evaluation criteria for standard type-B in functional operation modes .................. 19

Table 12 – Evaluation criteria for ICs with embedded CXPI transceiver in functional

operation modes ................................................................................................................... 20

Table 13 – Parameters for emission measurements .............................................................. 22

Table 14 – Settings for the RF measurement equipment ....................................................... 22

Table 15 – Specifications for DPI tests ................................................................................. 24

Table 16 – Required DPI tests for functional status class AIC evaluation of standard

type-A ................................................................................................................................... 25

Table 17 – Required DPI tests for functional status class AIC evaluation of standard

type-B ................................................................................................................................... 25

Table 18 – Required DPI tests for functional status class AIC evaluation of ICs with

embedded CXPI transceiver.................................................................................................. 25

Table 19 – Required DPI tests for functional status class CIC, D1IC or D2IC evaluation

of standard CXPI transceiver ICs and ICs with embedded CXPI transceiver .......................... 26

Table 20 – Specifications for impulse immunity tests ............................................................ 28

Table 21 – Parameters for impulse immunity tests ................................................................ 28

Table 22 – Required impulse immunity tests for functional status class AIC evaluation

of standard type-A ................................................................................................................ 29

Table 23 – Required impulse immunity tests for functional status class AIC evaluation

of standard type-B ................................................................................................................ 29

Table 24 – Required impulse immunity tests for functional status class AIC evaluation

of ICs with embedded CXPI transceiver ................................................................................ 29

Table 25 – Required impulse immunity tests for functional status class CIC, D1IC or

D2IC evaluation of standard CXPI transceiver ICs and ICs with embedded CXPI

transceiver ............................................................................................................................ 30

Table 26 – Specifications for direct ESD tests ....................................................................... 32

Table B.1 – Parameter ESD test circuit board ....................................................................... 43

Table C.1 – Example of limits for impulse immunity for functional status

class C or D ................................................................................................................... 44

IC IC
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SIST EN IEC 62228-7:2022
IEC 62228-7:2022 © IEC 2022 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
EMC EVALUATION OF TRANSCEIVERS –
Part 7: CXPI transceivers
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

IEC 62228-7 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical

committee 47: Semiconductor devices. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
47A/1130/FDIS 47A/1133/RVD

Full information on the voting for its approval can be found in the report on voting indicated in

the above table.
The language used for the development of this International Standard is English.
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SIST EN IEC 62228-7:2022
– 6 – IEC 62228-7:2022 © IEC 2022

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available

at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are

described in greater detail at www.iec.ch/standardsdev/publications.

A list of all parts in the IEC 62228 series, published under the general title Integrated circuits –

EMC evaluation of transceivers, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under webstore.iec.ch in the data related to the

specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it

contains colours which are considered to be useful for the correct understanding of its

contents. Users should therefore print this document using a colour printer.
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SIST EN IEC 62228-7:2022
IEC 62228-7:2022 © IEC 2022 – 7 –
INTEGRATED CIRCUITS –
EMC EVALUATION OF TRANSCEIVERS –
Part 7: CXPI transceivers
1 Scope

This part of IEC 62228 specifies test and measurement methods for the EMC evaluation of

CXPI transceiver ICs under network condition. It defines test configurations, test conditions,

test signals, failure criteria, test procedures, test setups and test boards. This specification is

applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and

covers
• the emission of RF disturbances,
• the immunity against RF disturbances,
• the immunity against impulses and
• the immunity against electrostatic discharges (ESD).
2 Normative references

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies.

For undated references, the latest edition of the referenced document (including any

amendments) applies.
IEC 61967-1, Integrated circuits – Mea
...

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