SIST EN 61189-1:2001/A1:2003

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology

EN following parallel vote

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 1: Allgemeine Prüfverfahren und -methodik

Méthodes d'essais pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 1: Méthodes d'essai générales et méthodologie

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

General Information

• Status: Published
• Publication Date: 31-Mar-2003
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Apr-2003
• Due Date: 01-Apr-2003
• Completion Date: 01-Apr-2003
• Ref Project: EN 61189-1:1997/A1:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology

Relations

• Amends: SIST EN 61189-1:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology
• Effective Date: 01-Apr-2003
• Amends: SIST EN 61189-1:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61189-1:2001/A1:2003
01-april-2003
Test methods for electrical materials, interconnection structures and assemblies -
Part 1: General test methods and methodology
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies - Part 1: General test methods and methodology
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen - Teil 1: Allgemeine Prüfverfahren und -methodik
Méthodes d'essais pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 1: Méthodes d'essai générales et
méthodologie
Ta slovenski standard je istoveten z: EN 61189-1:1997/A1:2001
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61189-1:2001/A1:2003 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61189-1:2001/A1:2003

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SIST EN 61189-1:2001/A1:2003
EUROPEAN STANDARD EN 61189-1/A1
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2001
ICS 31.180
English version
Test methods for electrical materials, printed boards and
other interconnection structures and assemblies
Part 1: General test methods and methodology
(IEC 61189-1:1997/A1:2001)
Méthodes d'essais pour les matériaux Prüfverfahren für Elektromaterialien,
électriques, les cartes imprimées et autres Leiterplatten und andere
structures d'interconnexion et ensembles Verbindungsstrukturen und Baugruppen
Partie 1: Méthodes d'essai générales et Teil 1: Allgemeine Prüfverfahren und
méthodologie Methodik
(CEI 61189-1:1997/A1:2001) (IEC 61189-1:1997/A1:2001)
This amendment A1 modifies the European Standard EN 61189-1:1997; it was approved by CENELEC
on 2001-10-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations
which stipulate the conditions for giving this amendment the status of a national standard without any
alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This amendment exists in three official versions (English, French, German). A version in any other language
made by translation under the responsibility of a CENELEC member into its own language and notified to the
Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands,
Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2001 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61189-1:1997/A1:2001 E

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SIST EN 61189-1:2001/A1:2003
EN 61189-1:1997/A1:2001 - 2 -
Foreword
The text of document 52/887/FDIS, future amendment 1 to IEC 61189-1:1997, prepared by
IEC TC 52, Printed circuits, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as amendment A1 to EN 61189-1:1997 on 2001-10-01.
The following dates were fixed:
– latest date by which the amendment has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2002-07-01
– latest date by which the national standards conflicting
with the amendment have to be withdrawn (dow) 2004-10-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of amendment 1:2001 to the International Standard IEC 61189-1:1997 was approved by
CENELEC as an amendment to the European Standard without any modification.
__________

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SIST EN 61189-1:2001/A1:2003
- 3 - EN 61189-1:1997/A1:2001
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
Add:
Publication Year Title EN/HD Year
1)
IEC 60068-2-3 1969 Basic environmental testing procedures HD 323.2.3 S2 1987
Part 2: Tests - Test Ca: Damp heat,
steady state
2)
IEC 60068-2-30 1980 Part 2: Tests - Test Db and guidance: EN 60068-2-30 1999
Damp heat, cyclic (12 + 12 hour cycle)

1)
HD 323.2.3 S2 includes A1:1984 to IEC 60068-2-3.
2)
EN 60068-2-30 includes A1:1985 to IEC 60068-2-30.

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SIST EN 61189-1:2001/A1:2003

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SIST EN 61189-1:2001/A1:2003
NORME
CEI
INTERNATIONALE IEC
61189-1
INTERNATIONAL
1997
STANDARD
AMENDEMENT 1
AMENDMENT 1
2001-08
Amendement 1
Méthodes d'essais pour les matériaux électriques,
les structures d'interconnexion et les ensembles –
Partie 1:
Méthodes d'essai générales et méthodologie
Amendment 1
Test methods for electrical materials,
interconnection structures and assemblies –
Part 1:
General test methods and methodology
© IEC 2001 Droits de reproduction réservés ⎯ Copyright - all rights reserved
International Electrotechnical Commission 3, rue de Varembé Geneva, Switzerland
Telefax: [phone] e-mail: [e-mail] IEC web site http://www.iec.ch
CODE PRIX
Commission Electrotechnique Internationale
H
PRICE CODE
International Electrotechnical Commission
Pour prix, voir catalogue en vigueur
For price, see current catalogue

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SIST EN 61189-1:2001/A1:2003
61189-1 Amend. 1 © IEC:2001 – 3 –
FOREWORD
This amendment has been prepared by IEC technical committee 52: Printed circuits.
The text of this amendment is based on the following documents:
FDIS Report on voting
52/887/FDIS 52/889/RVD
Full information on the voting for the approval of this amendment can be found in the report on
voting indicated in the above table.
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until 2005. At this date, the publication will be
 reconfirmed;
 withdrawn;
 replaced by a revised edition, or
 amended.
_____________
Page 9
2 Normative references
Add the following new references:
IEC 60068-2-3:1969, Environmental testing – Part 2: Tests – Test Ca: Damp heat, steady state
IEC 60068-2-30:1980, Environmental testing – Part 2: Tests – Test Db and guidance: Damp
heat, cyclic (12 + 12-hour cycle)
Page 19
5 P: Preparation/conditioning test methods
Add, on page 21, after “5.2.6 Additional information”, the following new subclauses:
5.3 Test 1P03: Accelerated ageing, conditioning of printed boards – Method A

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SIST EN 61189-1:2001/A1:2003
61189-1 Amend. 1 © IEC:2001 – 5 –
5.3.1 Object
The object of this procedure is to condition printed boards in a steam/oxygen atmosphere as an
accelerated ageing procedure where a short overall test duration of the procedure is desirable.
The accelerated ageing conditions described in this test method have been demonstrated
to be equivalent to a 10-day damp heat conditioning as detailed in IEC 60068-2-3: Test Ca, or
IEC 60068-2-30: Test Db.
The test is intended to give information about the effect of storage duration on the solderability
of printed boards.
An alternative acceptable conditioning technique is detailed in 5.4 as test method 1P04.
In case of dispute between the two alternative techniques, the referee method shall consist of
exposure to the climatic conditions described in IEC 60068-2-3: Test Ca, or IEC 60068-2-30:
Test Db, for a duration of 10 days.
5.3.2 Test specimen
The test specimen shall be as described in the appropriate sectional specification (SS) or
customer detail specification (CDS) procurement documentation. The physical size of the
conditioning and test apparatus is also a limiting factor.
5.3.3 Test apparatus and materials
The following test apparatus and materials shall be used:
• steam/oxygen ageing test apparatus (see figure 1);
• test c
...