SIST EN 61189-5-3:2015

Test methods for electrical materials, interconnection structures and assemblies -- Part 5-3: Test methods for printed board assemblies: Soldering paste

This part of IEC 61189 is a catalogue of test methods representing methodologies and
procedures that can be applied to test printed board assemblies.
This part of IEC 61189 focuses on test methods for soldering paste based on the existing
IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead
free soldering.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-3: Allgemeine Prüfverfahren für Materialien und Baugruppen - Lotpaste für bestückte Leiterplatten

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-3: Méthodes d'essai générales pour les matériaux et les assemblages - Pâte de brasage pour les assemblages de cartes imprimées

L'IEC 61189-5-3:2015 est un catalogue de méthodes d'essai représentant les méthodologies et modes opératoires pouvant être appliqués aux assemblages de cartes imprimées. La présente partie de l'IEC 61189 traite des méthodes d'essai pour la pâte de brasage sur la base des IEC 61189-5 et IEC 61189-6 existantes. De plus, elle inclut les méthodes d'essai pour la pâte de brasage pour le brasage sans plomb.

Preskusne metode za električne materiale, povezovalne strukture in sestave - 5-3. del: Preskusne metode za sestave plošč tiskanih vezij: spajkalne paste

Ta del standarda IEC 61189 je katalog preskusnih metod, ki predstavljajo metodologije in postopke, ki jih je mogoče uporabiti za preskušanje sestavov plošč tiskanih vezij. Ta del standarda IEC 61189 je posvečen preskusnim metodam za spajkalne paste, ki temeljijo na standardih IEC 61189-5 in IEC 61189-6. Zajema tudi preskusne metode za spajkalne paste za spajkanje brez svinca.

General Information

• Status: Published
• Publication Date: 13-Aug-2015
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 03-Apr-2015
• Due Date: 08-Jun-2015
• Completion Date: 14-Aug-2015
• Ref Project: EN 61189-5-3:2015 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61189-5-3:2015
01-september-2015
3UHVNXVQHPHWRGH]DHOHNWULþQHPDWHULDOHSRYH]RYDOQHVWUXNWXUHLQVHVWDYH
GHO3UHVNXVQHPHWRGH]DVHVWDYHSORãþWLVNDQLKYH]LMVSDMNDOQHSDVWH
Test methods for electrical materials, interconnection structures and assemblies -- Part 5
-3: Test methods for printed board assemblies: Soldering paste
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen - Teil 5-3: Allgemeine Prüfverfahren für Materialien und Baugruppen -
Lotpaste für bestückte Leiterplatten
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 5-3: Méthodes d'essai générales pour
les matériaux et les assemblages - Pâte de brasage pour les assemblages de cartes
imprimées
Ta slovenski standard je istoveten z: EN 61189-5-3:2015
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61189-5-3:2015 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61189-5-3:2015

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SIST EN 61189-5-3:2015


EUROPEAN STANDARD EN 61189-5-3

NORME EUROPÉENNE

EUROPÄISCHE NORM
March 2015
ICS 31.180

English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 5-3: General
test methods for materials and assemblies - Soldering paste for
printed board assemblies
(IEC 61189-5-3:2015)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen -
ensembles - Partie 5-3: Méthodes d'essai générales pour Teil 5-3: Allgemeine Prüfverfahren für Materialien und
les matériaux et les assemblages - Pâte de brasage pour Baugruppen - Lotpaste für bestückte Leiterplatten
les assemblages de cartes imprimées (IEC 61189-5-3:2015)
(IEC 61189-5-3:2015)
This European Standard was approved by CENELEC on 2015-02-12. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 61189-5-3:2015 E

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SIST EN 61189-5-3:2015
EN 61189-5-3:2015 - 2 -
Foreword
The text of document 91/1211/FDIS, future edition 1 of IEC 61189-5-3, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 61189-5-3:2015.

The following dates are fixed:
(dop) 2015-11-12
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2018-02-12
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 61189-5-3:2015 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-1:2013 NOTE Harmonized as EN 60068-1:2014 (not modified).
IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20.
IEC 61189-1 NOTE Harmonized as EN 61189-1.
IEC 61189-2 NOTE Harmonized as EN 61189-2.
IEC 61189-3 NOTE Harmonized as EN 61189-3.
IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1.
IEC 61249-2-7 NOTE Harmonized as EN 61249-2-7.
IEC 62137:2004 NOTE Harmonized as EN 62137:2004 (not modified).
ISO 9001 NOTE Harmonized as EN ISO 9001.
ISO 9455-2 NOTE Harmonized as EN ISO 9455-2.

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SIST EN 61189-5-3:2015
- 3 - EN 61189-5-3:2015
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu

Publication Year Title EN/HD Year

IEC 61189-5 -  Test methods for electrical materials, EN 61189-5 -
interconnection structures and assemblies
- Part 5: Test methods for printed board
assemblies
IEC 61189-6 -  Test methods for electrical materials, EN 61189-6 -
interconnection structures and assemblies
- Part 6: Test methods for materials used in
manufacturing electronic assemblies
IEC 61190-1-2 2014 Attachment materials for electronic EN 61190-1-2 2014
assembly -
Part 1-2: Requirements for soldering
pastes for high-quality interconnects in
electronics assembly
IEC 61190-1-3 -  Attachment materials for electronic EN 61190-1-3 -
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed
solid solders for electronic soldering
applications

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SIST EN 61189-5-3:2015

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SIST EN 61189-5-3:2015




IEC 61189-5-3

®


Edition 1.0 2015-01




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –

Part 5-3: General test methods for materials and assemblies – Soldering paste


for printed board assemblies



Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres


structures d'interconnexion et ensembles –

Partie 5-3: Méthodes d'essai générales pour les matériaux et les assemblages –

Pâte de brasage pour les assemblages de cartes imprimées










INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.180 ISBN 978-2-8322-1998-0



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 61189-5-3:2015
– 2 – IEC 61189-5-3:2015 © IEC 2015
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Accuracy, precision and resolution . 8
3.1 General . 8
3.2 Accuracy . 9
3.3 Precision . 9
3.4 Resolution . 10
3.5 Report. 10
3.6 Student’s t distribution . 10
3.7 Suggested uncertainty limits . 11
4 X: Miscellaneous test methods . 12
4.1 Test 5-3X01: Paste flux viscosity – T-Bar spindle method . 12
4.1.1 Object . 12
4.1.2 Test specimen . 12
4.1.3 Apparatus and reagents . 12
4.1.4 Procedure . 12
4.1.5 Safety notes . 12
4.2 Test 5-3X02: Spread test, extracted solder flux, paste flux and solder paste . 12
4.2.1 Object . 12
4.2.2 Method A . 13
4.2.3 Method B . 14
4.2.4 Additional information . 15
4.3 Test 5-3X03: Solder paste viscosity – T-Bar spin spindle method (applicable
for 300 Pa·s to 1 600 Pa·s) . 15
4.3.1 Object . 15
4.3.2 Test specimen . 15
4.3.3 Equipment/apparatus . 15
4.3.4 Procedure . 16
4.3.5 Evaluation . 16
4.3.6 Additional information . 16
4.4 Test 5-3X04: Solder paste viscosity – T-Bar spindle method (applicable to
300 Pa·s) . 16
4.4.1 Object . 16
4.4.2 Test specimen . 17
4.4.3 Equipment/apparatus . 17
4.4.4 Procedure . 17
4.4.5 Evaluation . 17
4.4.6 Additional information . 17
4.5 Test 5-3X05: Solder paste viscosity – Spiral pump method (applicable for
300 Pa·s to 1 600 Pa·s) . 18
4.5.1 Object . 18
4.5.2 Test specimen . 18
4.5.3 Equipment/apparatus . 18
4.5.4 Procedure . 18

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SIST EN 61189-5-3:2015
IEC 61189-5-3:2015 © IEC 2015 – 3 –
4.5.5 Evaluation . 18
4.5.6 Additional information . 18
4.6 Test 5-3X06: Solder paste viscosity – Spiral pump method (applicable to 300
Pa·s) . 19
4.6.1 Object . 19
4.6.2 Test specimen . 19
4.6.3 Equipment/apparatus . 19
4.6.4 Procedure . 19
4.6.5 Evaluation . 19
4.6.6 Additional information . 19
4.7 Test 5-3X07: Solder paste – Slump test . 20
4.7.1 Object . 20
4.7.2 Test specimen . 20
4.7.3 Equipment/apparatus . 20
4.7.4 Procedure . 20
4.7.5 Evaluation . 22
4.8 Test 5-3X08: Solder paste − Solder ball test . 22
4.8.1 Object . 22
4.8.2 Test specimen . 23
4.8.3 Equipment/apparatus . 23
4.8.4 Procedure . 23
4.8.5 Evaluation . 24
4.9 Test 5-3X09: Solder paste − Tack test . 25
4.9.1 Object . 25
4.9.2 Method A . 25
4.9.3 Method B . 26
4.9.4 Test equipment sources . 27
4.10 Test 5-3X10: Solder paste − Wetting test . 27
4.10.1 Object . 27
4.10.2 Test specimen . 27
4.10.3 Equipment/materials/apparatus. 27
4.10.4 Procedure . 27
4.10.5 Evaluation . 28
4.11 Test 5-3X11: Determination of solder powder particle size distribution –
Screen method for types 1-4 . 28
4.11.1 Object . 28
4.11.2 Test specimen . 28
4.11.3 Equipment/apparatus . 28
4.11.4 Procedure . 28
4.12 Test 5-3X12: Solder powder particle size distribution – Measuring
microscope method . 30
4.12.1 Object . 30
4.12.2 Test specimen . 30
4.12.3 Equipment/apparatus . 30
4.12.4 Procedure . 30
4.13 Test 5-3X13: Solder powder particle size distribution – Optical image
analyser method . 31
4.13.1 Object . 31
4.13.2 Test specimen . 31
4.13.3 Equipment/apparatus . 31

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SIST EN 61189-5-3:2015
– 4 – IEC 61189-5-3:2015 © IEC 2015
4.13.4 Procedure . 32
4.14 Test 5-3X14: Solder powder particle size distribution – Measuring laser
diffraction method . 33
4.14.1 Object . 33
4.14.2 Test specimen . 33
4.14.3 Equipment/apparatus . 33
4.14.4 Preparation . 34
4.14.5 Test procedure . 34
4.14.6 Test . 34
4.14.7 Evaluation . 34
4.15 Test 5-3X15: Determination of maximum solder powder particle size . 35
4.15.1 Object . 35
4.15.2 Test specimen . 35
4.15.3 Evaluation . 35
4.16 Test 5-3X16: Solder paste metal content by weight . 36
4.16.1 Object . 36
4.16.2 Test specimen . 36
4.16.3 Equipment/apparatus . 36
4.16.4 Procedure . 36
Annex A (informative) Typical comparison of particle size distributions between laser
diffraction method and screen method . 38
Bibliography . 39

Figure 1 – Slump test stencil thickness, 0,20 mm . 21
Figure 2 – Slump test stencil thickness, 0,10 mm . 21
Figure 3 – Solder-ball test evaluation . 24
Figure 4 – Solder wetting examples . 28
Figure A.1 – Typical comparison between laser diffraction and sieving . 38

Table 1 – Student’s t distribution . 11
2
Table 2 – Typical spread areas defined in mm . 13
Table 3 – Example of a test report – Stencil thickness, 0,2 mm . 22
Table 4 – Example of a test report – Stencil thickness, 0,1 mm . 22
Table 5 – Screen opening . 29
Table 6 – Portions of particle sizes by weight % – nominal values . 30
Table 7 – Powder particle size distribution record . 30
Table 8 – Powder particle size distribution record . 31
Table 9 – Powder particle size distribution record (optical analysis) . 33
Table 10 – Powder particle size distribution record . 34
Table 11 – Acceptance of powders by particle sizes . 36
Table 12 – Example of a test report on solder paste . 37

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SIST EN 61189-5-3:2015
IEC 61189-5-3:2015 © IEC 2015 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

TEST METHODS FOR ELECTRICAL MATERIALS,
PRINTED BOARDS AND OTHER INTERCONNECTION
STRUCTURES AND ASSEMBLIES –

Part 5-3: General test methods for materials and assemblies –
Soldering paste for printed board assemblies

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61189-5-3 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1211/FDIS 91/1224/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN 61189-5-3:2015
– 6 – IEC 61189-5-3:2015 © IEC 2015
This International Standard is used in conjunction with IEC 61189-1:1997, IEC 61189-2:2006,
IEC 61189-3:2007.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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SIST EN 61189-5-3:2015
IEC 61189-5-3:2015 ©
...