SIST EN 62433-4:2016

EMC IC modelling - Part 4: Models of Integrated Circuits for RF Immunity behavioural simulation - Conducted Immunity modelling (ICIM-CI) (IEC 62433-4:2016)

IEC 62433-4:2016 specifies a flow for deriving a macro-model to allow the simulation of the conducted immunity levels of an integrated circuit (IC). This model is commonly called Integrated Circuit Immunity Model - Conducted Immunity, ICIM-CI. It is intended to be used for predicting the levels of immunity to conducted RF disturbances applied on IC pins. In order to evaluate the immunity threshold of an electronic device, this macro-model will be inserted in an electrical circuit simulation tool. This macro-model can be used to model both analogue and digital ICs (input/output, digital core and supply). This macro-model does not take into account the non-linear effects of the IC. The added value of ICIM-CI is that it could also be used for immunity prediction at board and system level through simulations. This part of IEC 62433 has two main parts:
- the electrical description of ICIM-CI macro-model elements;
- a universal data exchange format called CIML based on XML. This format allows ICIM-CI to be encoded in a more useable and generic form for immunity simulation.

EMV-IC-Modellierung - Teil 4: Modelle integrierter Schaltungen für die Simulation des Verhaltens der HF-Störfestigkeit - Modellierung der Störfestigkeit gegen leitungsgeführte Störungen (ICIM-CI)

EMC IC modelling - Part 2: Models of Integrated Circuits for EMI behavioural simulation - Conducted Emissions modelling (ICEM-CE) (IEC 62433-4:2016)

L'IEC 62433-4:2016 spécifie un macromodèle de simulation des niveaux d'immunité conduite d'un circuit intégré (CI). Ce modèle est communément appelé Modèle d'immunité de circuits intégrés - Immunité conduite (ICIM-CI - Integrated Circuit Immunity Model - Conducted Immunity). Il est destiné à prévoir les niveaux d'immunité aux perturbations radioélectriques conduites appliqués aux broches de circuits intégrés. Afin d'évaluer le seuil d'immunité d'un dispositif électronique, ce macromodèle est inséré dans un outil de simulation de circuit électrique. Ce macromodèle peut être utilisé pour modéliser les circuits intégrés analogiques et numériques (entrée/sortie, noyau numérique et alimentation). Ce macromodèle ne tient pas compte des effets non linéaires du circuit intégré.
L'ICIM-CI présente l'avantage de pouvoir également être utilisé pour la prévision d'immunité au niveau de la carte et du système grâce à des simulations. La présente partie de l'IEC 62433 est composée de deux parties principales:
- la description électrique des éléments du macromodèle ICIM-CI;
- un format universel d'échange de données appelé CIML et reposant sur le langage XML. Ce format permet de coder l'ICIM-CI sous une forme plus utile et générique pour la simulation d'immunité.

Modeliranje integriranih vezij (IC) za elektromagnetno združljivost (EMC) - 4. del: Modeli integriranih vezij za vedenjsko simulacijo RF odpornosti - Modeliranje odpornosti integriranih vezij proti prevajanim motnjam (ICIM-CI) (IEC 62433-4:2016)

Ta del standarda IEC 62433 določa potek za izpeljavo makro modela, ki omogoča simulacijo ravni odpornosti integriranega vezja (IC) proti prevajanim motnjam. Ta model običajno imenujemo model odpornosti integriranih vezij – odpornost proti prevajanim motnjam, ICIM-CI. Uporablja se za napovedovanje ravni odpornosti na prevajane motnje RF, ki se pojavijo na kontaktih integriranih vezij.
Ta makro model bo vstavljen v orodje za simulacijo električnega tokokroga za ocenjevanje praga odpornosti elektronske naprave.
Ta makro model se lahko uporablja za analogna in digitalna integrirana vezja (vhod/izhod, digitalno jedro in napajanje). Ta makro model ne upošteva nelinearnih učinkov integriranega vezja.
Dodana vrednost modela ICIM-CI je, da se na podlagi simulacij lahko uporablja tudi za napovedovanje odpornosti plošče in sistema.
Ta del standarda IEC 62433 ima dva glavna dela:
• električni opis elementov makro modela ICIM-CI:
• univerzalni format za izmenjavo CIML, ki temelji na formatu XML. Ta format omogoča, da se model ICIM-CI kodira v uporabnejši in splošnejši obliki za simulacijo odpornosti.

General Information

• Status: Published
• Publication Date: 06-Nov-2016
• ICS: 31.200 - Integrated circuits. Microelectronics
• ICS: 33.100.20 - Immunity
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 26-Oct-2016
• Due Date: 31-Dec-2016
• Completion Date: 07-Nov-2016
• Ref Project: EN 62433-4:2016 - EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)

Overview

EN 62433-4:2016 (CLC adoption of IEC 62433-4:2016) defines a structured flow for deriving an Integrated Circuit Immunity Model – Conducted Immunity (ICIM-CI). The standard specifies how to build behavioural macro-models that predict an IC’s immunity to conducted RF disturbances applied to pins and supply connections. ICIM-CI macro-models are designed for insertion into electrical circuit simulators (SPICE-style) to assess immunity thresholds at IC, board and system levels. The document also defines CIML, an XML-based universal data exchange format to encode ICIM-CI models for simulation and interoperability.

Key Topics

• Macro-model derivation flow: process steps to create an ICIM-CI behavioural model suitable for circuit simulation.
• Model elements: electrical description of macro-model constituents including PDN (power distribution network) elements, IBC and IB sections used to represent ports and internal responses.
• CIML format: XML schema and keywords for encoding models in a machine-readable, vendor-neutral format.
• SPICE compatibility: guidelines for embedding macro-model netlists and behavioural elements into common simulators.
• Extraction methods: recommended measurement and parameter extraction techniques (S/Z/Y parameters, RF injection techniques) to populate model data.
• Validation and limitations: model verification approaches (linearity checks, immunity criteria) and the clear limitation that ICIM-CI does not capture non-linear IC effects.

Applications

• Predicting conducted RF immunity of analog and digital ICs (I/O, digital core, supply pins) during early design stages.
• Simulating IC behavior under injected RF to estimate immunity thresholds before board prototyping.
• Performing board- and system-level EMC simulations by plugging ICIM-CI macro-models into full-system netlists.
• Automating model exchange between IC vendors, tool vendors and system integrators using the CIML XML format.
• Supporting EMC compliance planning, troubleshooting and design-for-EMC activities.

Who Uses This Standard

• IC design engineers and IP integrators who need behavioural immunity models.
• EMC test engineers and lab specialists conducting conducted immunity analysis.
• PCB and system-level simulation engineers performing pre-compliance assessments.
• EDA and tool vendors implementing CIML import/export and SPICE-compatible macro-model support.
• Product compliance teams aiming to reduce iterations between IC, board and system testing.

Related Standards

• EN/IEC 62433-2 (IC emissions modelling) - complements ICIM-CI by covering conducted emissions.
• IEC 62132 series - referenced for EMC immunity measurement methods (e.g., direct RF injection).
• CIML leverages XML best practices for standardized data exchange.

EN 62433-4:2016 is essential for anyone who needs reproducible, simulator-ready models to predict conducted RF immunity of integrated circuits and to integrate those models into board- and system-level EMC analysis.

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Modeliranje integriranih vezij (IC) za elektromagnetno združljivost (EMC) - 4. del: Modeli integriranih vezij za vedenjsko simulacijo RF odpornosti - Modeliranje odpornosti integriranih vezij proti prevajanim motnjam (ICIM-CI) (IEC 62433-4:2016)EMC IC modelling - Part 2: Models of Integrated Circuits for EMI behavioural simulation - Conducted Emissions modelling (ICEM-CE) (IEC 62433-4:2016)EMC IC modelling - Part 4: Models of Integrated Circuits for RF Immunity behavioural simulation - Conducted Immunity modelling (ICIM-CI) (IEC 62433-4:2016)33.100.20ImunostImmunity31.200Integrirana vezja, mikroelektronikaIntegrated circuits. MicroelectronicsICS:Ta slovenski standard je istoveten z:EN 62433-4:2016SIST EN 62433-4:2016en01-december-2016SIST EN 62433-4:2016SLOVENSKI
STANDARD
EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN 62433-4
October 2016 ICS 31.200
English Version
EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI) (IEC 62433-4:2016)
Modèles de circuits intégrés pour la CEM -
Partie 4: Modèles de circuits intégrés pour la simulation du comportement d'immunité aux radiofréquences - Modélisation de l'immunité conduite (ICIM-CI) (IEC 62433-4:2016)
EMV-IC-Modellierung - Teil 4: Modelle integrierter Schaltungen für die Simulation des Verhaltens der HF-Störfestigkeit - Modellierung der Störfestigkeit gegen leitungsgeführte Störungen (ICIM-CI) (IEC 62433-4:2016) This European Standard was approved by CENELEC on 2016-06-29. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17,
B-1000 Brussels © 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62433-4:2016 E SIST EN 62433-4:2016

The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2017-04-21 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2019-10-21
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent rights.
Endorsement notice The text of the International Standard IEC 62433-4:2016 was approved by CENELEC as a European Standard without any modification. SIST EN 62433-4:2016

Normative references to international publications with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu
Publication Year Title EN/HD Year
IEC 62132-1 -
Circuits intégrés - Mesure de l'immunité électromagnétique -
Partie 1: Conditions générales et définitions EN 62132-1 -
IEC 62132-4 -
Circuits intégrés - Mesure de l'immunité électromagnétique 150 kHz à 1 GHz - Partie 4: Méthode d'injection directe de puissance RF EN 62132-4 -
IEC 62433-2 -
Modèles de circuits intégrés pour la CEM - Partie 2: Modèles de circuits intégrés pour la simulation du comportement lors de perturbations électromagnétiques - Modélisation des émissions conduites (ICEM-CE) EN 62433-2 -
ISO 8879 1986 Traitement de l'information - Systèmes bureautiques - Langage normalisé de balisage généralisé (SGML) - -
ISO/IEC 646 1991 Technologies de l'information - Jeu ISO de caractères codés à 7 éléments pour l'échange d'information - -
CISPR 17 -
Méthodes de mesure des caractéristiques d'antiparasitage des dispositifs de filtrage CEM passifs EN 55017 -
IEC 62433-4 Edition 1.0 2016-05 INTERNATIONAL STANDARD NORME INTERNATIONALE EMC IC modelling –
Part 4: Models of integrated circuits for RF immunity behavioural simulation – Conducted immunity modelling (ICIM-CI)
Modèles de circuits intégrés pour la CEM –
Partie 4: Modèles de circuits intégrés pour la simulation du comportement d’immunité aux radiofréquences – Modélisation de l'immunité conduite (ICIM-CI)
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE
ICS 31.200
ISBN 978-2-8322-3417-4
– 2 – IEC 62433-4:2016 © IEC 2016 CONTENTS FOREWORD . 7 1 Scope . 9 2 Normative references. 9 3 Terms, definitions, abbreviations and conventions . 10 3.1 Terms and definitions . 10 3.2 Abbreviations . 11 3.3 Conventions . 11 4 Philosophy . 12 5 ICIM-CI model description . 12 5.1 General . 12 5.2 PDN description . 14 5.3 IBC description . 15 5.4 IB description . 16 6 CIML format . 17 6.1 General . 17 6.2 CIML structure . 18 6.3 Global keywords . 19 6.4 Header section . 19 6.5 Lead definitions . 20 6.6 SPICE macro-models . 21 6.7 Validity section . 23 6.7.1 General . 23 6.7.2 Attribute definitions . 23 6.8 PDN . 25 6.8.1 General . 25 6.8.2 Attribute definitions . 26 6.8.3 PDN for a single-ended input or output . 29 6.8.4 PDN for a differential input . 36 6.8.5 PDN multi-port description. 39 6.9 IBC . 40 6.9.1 General . 40 6.9.2 Attribute definitions . 41 6.10 IB . 42 6.10.1 General . 42 6.10.2 Attribute definitions . 43 6.10.3 Description . 48 7 Extraction . 50 7.1 General . 50 7.2 Environmental extraction constraints . 50 7.3 PDN extraction . 51 7.3.1 General . 51 7.3.2 S-/Z-/Y-parameter measurement . 51 7.3.3 RFIP technique . 51 7.4 IB extraction. 52 7.4.1 General . 52 7.4.2 Direct RF power injection test method . 52 SIST EN 62433-4:2016

IEC 62433-4:2016 © IEC 2016 – 3 –
7.4.3 RF Injection probe test method . 54 7.4.4 IB data table . 55 7.5 IBC . 56 8 Validation of ICIM-CI hypotheses . 56 8.1 General . 56 8.2 Linearity . 57 8.3 Immunity criteria versus transmitted power . 58 9 Model usage . 59 Annex A (normative)
Preliminary definitions for XML representation . 61 A.1 XML basics . 61 A.1.1 XML declaration . 61 A.1.2 Basic elements . 61 A.1.3 Root element . 61 A.1.4 Comments . 62 A.1.5 Line terminations . 62 A.1.6 Element hierarchy . 62 A.1.7 Element attributes . 62 A.2 Keyword requirements . 62 A.2.1 General . 62 A.2.2 Keyword characters . 63 A.2.3 Keyword syntax . 63 A.2.4 File structure . 63 A.2.5 Values . 65 Annex B (informative)
ICIM-CI example with disturbance load . 68 Annex C (informative)
Conversions between parameter types . 69 C.1 General . 69 C.2 Single-ended input or output . 69 C.3 Differential input or output . 70 Annex D (informative)
Example of ICIM-CI macro-model in CIML format . 74 Annex E (normative)
CIML Valid keywords and usage . 79 E.1 Root element keywords . 79 E.2 File header keywords . 79 E.3 Validity section keywords . 81 E.4 Global keywords . 81 E.5 Lead keyword . 82 E.6 Lead_definitions section attributes . 82 E.7 Macromodels section attributes . 83 E.8 Pdn section keywords . 84 E.8.1 Lead element keywords . 84 E.8.2 Netlist section keywords . 86 E.9 Ibc section keywords . 87 E.9.1 Lead element keywords . 87 E.9.2 Netlist section keywords . 89 E.10 Ib section keywords . 89 E.10.1 Lead element keywords . 89 E.10.2 Max_power_level section keywords . 91 E.10.3 Voltage section keywords . 91 E.10.4 Current section keywords . 93 SIST EN 62433-4:2016

– 4 – IEC 62433-4:2016 © IEC 2016 E.10.5 Power section keywords . 94 E.10.6 Test_criteria section keywords . 95 Annex F (informative)
PDN impedance measurement methods
using vector network analyzer . 97 F.1 General . 97 F.2 Conventional one-port method . 97 F.3 Two-port method for low impedance measurement . 97 F.4 Two-port method for high impedance measurement . 98 Annex G (informative)
RFIP measurement method description . 99 G.1 General . 99 G.2 Obtaining immunity parameters . 99 Annex H (informative)
Immunity simulation with ICIM model based on pass/fail test . 101 H.1 ICIM-CI macro-model of a voltage regulator IC . 101 H.1.1 General . 101 H.1.2 PDN extraction . 101 H.1.3 IB extraction . 101 H.1.4 SPICE-compatible macro-model . 102 H.2 Application level simulation and failure prediction . 102 Annex I (informative)
Immunity simulation with ICIM model based on non pass/fail test . 104 Bibliography . 106
Figure 1 – Example of ICIM-CI model structure . 13 Figure 2 – Example of an ICIM-CI model of an electronic board . 14 Figure 3 – Example of an IBC network . 16 Figure 4 – ICIM-CI model representation with different blocks . 16 Figure 5 – CIML inheritance hierarchy . 18 Figure 6 – Example of a netlist file defining a sub-circuit . 22 Figure 7 – PDN electrical schematics . 29 Figure 8 – PDN represented as a one-port black-box . 29 Figure 9 – PDN represented as S-parameters in Touchstone format . 32 Figure 10 – PDN represented as two-port S-parameters in Touchstone format . 33 Figure 11 – Example structure for defining the PDN using circuit elements . 34 Figure 12 – Example of a single-ended PDN Netlist main circuit definition . 35 Figure 13 – Example of a single-ended PDN Netlist
with both sub-circuit
and main circuit definitions . 35 Figure 14 – Differential input schematic . 37 Figure 15 – PDN represented as a two-port black-box . 37 Figure 16 – PDN data format for differential input or output . 37 Figure 17 – Differential inputs of an operational amplifier example . 39 Figure 18 – ICIM-CI Model for a 74HC08 component . 40 Figure 19 – Example IB file obtained from DPI measurement . 50 Figure 20 – Test setup of the DPI immunity measurement method
as specified in IEC 62132-4 . 52 Figure 21 – Principle of single and multi-pin DPI . 53 Figure 22 – Electrical representation of the DPI test setup . 54 Figure 23 – Test setup of the RFIP measurement method derived from the DPI method . 55 SIST EN 62433-4:2016

IEC 62433-4:2016 © IEC 2016 – 5 –
Figure 24 – Example setup used for illustrating ICIM-CI hypotheses . 57 Figure 25 – Example of linearity assumption validation . 58 Figure 26 – Example of transmitted power criterion validation . 59 Figure 27 – Use of the ICIM-CI macro-model for simulation . 59 Figure A.1 – Multiple XML (CIML) files . 64 Figure A.2 – XML files with data files (*.dat) . 64 Figure A.3 – XML files with additional files . 65 Figure B.1 – ICIM-CI description applied to an oscillator stage for extracting IB. 68 Figure C.1 – Single-ended DI . 69 Figure C.2 – Differential DI . 70 Figure C.3 – Two-port representation of a differential DI . 70 Figure C.4 – Simulation of common-mode injection on a differential DI based on DPI . 72 Figure C.5 – Equivalent common-mode input impedance of a differential DI . 72 Figure C.6 – Determination of transmitted power for a differential DI . 72 Figure D.1 – Test setup on an example LIN transceiver . 74 Figure D.2 – PDN data in touchstone format (s2p), data measured using VNA . 76 Figure D.3 – PDN data of leads 6 (LIN) and 7 (VCC) . 77 Figure D.4 – IB data in ASCII format (.txt), data measured
using DPI method – Injection on VCC pin . 77 Figure D.5 – IB data for injection on VCC pin . 78 Figure F.1 – Conventional one-port S-parameter measurement . 97 Figure F.2 – Two-port method for low impedance measurement . 98 Figure F.3 – Two-port method for high impedance measurement. 98 Figure G.1 – Test setup of the RFIP measurement method derived from DPI method . 99 Figure G.2 – Principle of the RFIP measurement method . 99 Figure H.1 – Electrical schematic for extracting
the voltage regulator’s ICIM-CI . 101 Figure H.2 – ICIM-CI extraction on the voltage regulator example . 102 Figure H.3 – Example of a SPICE-compatible ICIM-CI
macro-model of the voltage regulator . 102 Figure H.4 – Example of a board level simulation on the voltage regulator’s
ICIM-CI with PCB model and other components including parasitic elements . 103 Figure H.5 – Incident power as a function of frequency
that is required to create a defect with a 10 nF filter . 103 Figure I.1 – Example of an IB file for a given failure criterion . 104 Figure I.2 – Comparison of simulated transmitted power
and measured immunity behaviour . 105
Table 1 – Attributes of Lead keyword in the Lead_definitions section . 20 Table 2 – Compatibility between the Mode and Type fields for correct CIML annotation . 20 Table 3 – Subckt definition . 21 Table 4 – Definition of the Validity section . 23 Table 5 – Definition of the Lead keyword for Pdn section . 25 Table 6 – Valid data formats and their default units in the Pdn section . 28 Table 7 – Valid file extensions in the Pdn section . 28 Table 8 – Valid fields of the Lead keyword for single-ended PDN . 30 SIST EN 62433-4:2016

– 6 – IEC 62433-4:2016 © IEC 2016 Table 9 – Netlist definition. 34 Table 10 – Valid fields of the Lead keyword for differential PDN . 38 Table 11 – Differences between the Pdn and Ibc section fields . 41 Table 12 – Valid fields of the Lead keyword for IBC definition . 42 Table 13 – Definition of the Lead keyword in Ib section . 43 Table 14 – Max_power_level definition . 44 Table 15 – Voltage, Current and Power definition . 45 Table 16 – Test_criteria definition . 45 Table 17 – Default values of Unit_voltage, Unit_current and Unit_power tags
as a function of data format . 48 Table 18 – Valid file extensions in the Ib section . 48 Table 19 – Example of IB table pass/fail criteria . 56 Table A.1 – Valid logarithmic units . 66 Table C.1 – Single-ended parameter conversion . 70 Table C.2 – Differential parameter conversion . 71 Table C.3 – Power calculation . 73 Table E.1 – Root element keywords . 79 Table E.2 – Header section keywords . 80 Table E.3 – Validity section keywords . 81 Table E.4 – Global keywords . 82 Table E.5 – Lead element definition . 82 Table E.6 – Lead_definitions section keywords . 83 Table E.7 – Macromodels section keywords . 83 Table E.8 – Lead element keywords in the Pdn section . 84 Table E.9 – Netlist section keywords . 87 Table E.10 – Lead element keywords in the Ibc section . 87 Table E.11 – Lead element keywords in the Ib section . 90 Table E.12 – Max_power_level section keywords . 91 Table E.13 – Voltage section keywords . 92 Table E.14 – Current section keywords . 93 Table E.15 – Power section keywords . 94 Table E.16 – Test_criteria section keywords . 96
IEC 62433-4:2016 © IEC 2016 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
EMC IC MODELLING –
Part 4: Models of integrated circuits for RF immunity behavioural
simulation – Conducted immunity modelling (ICIM-CI)
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62433-4 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47A/988/FDIS 47A/989/RVD
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. SIST EN 62433-4:2016

– 8 – IEC 62433-4:2016 © IEC 2016 The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be
• reconfirmed, • withdrawn, • replaced by a revised edition, or • amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer.
IEC 62433-4:2016 © IEC 2016 – 9 –
EMC IC MODELLING –
Part 4: Models of integrated circuits for RF immunity behavioural
simulation – Conducted immunity modelling (ICIM-CI)
1 Scope This part of IEC 62433 specifies a flow for deriving a macro-model to allow the simulation of the conducted immunity levels of an integrated circuit (IC). This model is commonly called Integrated Circuit Immunity Model – Conducted Immunity, ICIM-CI. It is intended to be used for predicting the levels of immunity to conducted RF disturbances applied on IC pins. In order to evaluate the immunity threshold of an electronic device, this macro-model will be inserted in an electrical circuit simulation tool. This macro-model can be used to model both analogue and digital ICs (input/output, digital core and supply). This macro-model does not take into account the non-linear effects of the IC. The added value of ICIM-CI is that it could also be used for immunity prediction at board and system level through simulations. This part of IEC 62433 has two main parts: • the electrical description of ICIM-CI macro-model elements; • a universal data exchange format called CIML based on XML. This format allows ICIM-CI to be encoded in a more useable and generic form for immunity simulation. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62132-1, Integrated circuits – Measurement of electromagnetic immunity – Part 1: General conditions and definitions IEC 62132-4, Integrated circuits – Measurement of electromagnetic immunity 150 kHz to 1 GHz – Part 4: Direct RF power injection method IEC 62433-2, EMC IC modelling – Part 2: Models of integrated circuits for EMI behavioural simulation – Conducted emissions modelling (ICEM-CE) ISO 8879: 1986, Information processing – Text and office systems – Standard Generalized Markup Language (SGML) ISO/IEC 646: 1991, Information technology – ISO 7-bit coded character set for information interchange (7-Bit ASCII) CISPR 17, Methods of measurement of the suppression characteristics of passive EMC filtering devices SIST EN 62433-4:2016

– 10 – IEC 62433-4:2016 © IEC 2016 3 Terms, definitions, abbreviations and conventions 3.1 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1.1
section XML element placed one level below the root element or within another section and that contains one or more XML elements, but no value 3.1.2
parent keyword which is one level above another keyword 3.1.3
child keyword which is one level below another keyword 3.1.4
external terminal terminal of an integrated circuit macro-model which interfaces the model to the external environment of the integrated circuit EXAMPLE Power supply pins and input/output pins. Note 1 to entry: In this part of IEC 62433, a terminal is by default considered as external unless otherwise stated. [SOURCE: IEC 62433-2:2008, 3.1, modified – Note 1 to entry has been changed, Example has been added] 3.1.5
internal terminal terminal of an integrated circuit macro-model's component which interfaces the component to other components of the integrated circuit macro-model [SOURCE: IEC 62433-2:2008, 3.2] 3.1.6
parser tool for syntactic analysis of data that is encoded in a specified format 3.1.7
CIML Conducted Immunity Markup Language data exchange format for ICIM-CI model 3.1.8
CIMLBase Conducted Immunity Markup Language Base abstract type from which all CIML model components are directly or indirectly derived in the ICIM-CI model definition 3.1.9
DI Disturbance Input input terminal for the injection of RF disturbances Note 1 to entry: It could be any pin of IC, an input, supply or an output. SIST EN 62433-4:2016

IEC 62433-4:2016 © IEC 2016 – 11 –
3.1.10
DO Disturbance Output terminal whose load influences the impedance of DI terminal, and/or the transfer characteristics of PDN, and that outputs a part of the disturbance received on the DI terminals 3.1.11
OO Observable Output output terminal where the immunity criteria are monitored during the test 3.1.12
GND Ground terminal terminal that is used as reference for return path 3.1.13
PDN Passive Distribution Network block that describes the impedance network of one or more ports of the integrated circuit 3.1.14
IB Immunity Behaviour block that describes the internal immunity behaviour of the IC 3.1.15
IBC Inter Block Coupling block that describes the coupling network between different PDN blocks within an IC [SOURCE: IEC TS 62433-1:2011, 3.3] 3.1.16
VNA Vector Network Analyzer instrument to measure complex network parameters such as S-, Y- or Z- parameters in the frequency domain 3.1.17
RFIP Radio Frequency Injection Probe probe for injecting RF disturbances into a pin of an IC allowing measurement of voltage and current 3.2 Abbreviations CIM
Conducted Immunity Model XML
eXtensible Markup Language SPICE Simulation Program with Integrated Circuit Emphasis ESD
ElectroStatic Discharge 3.3 Conventions For the sake of clarity, but with some exceptions, the writing conventions of XML have been used in text and tables. SIST EN 62433-4:2016

– 12 – IEC 62433-4:2016 © IEC 2016 4 Philosophy Integrated circuits contain more and more gates, the integration density of technologies is increasing and supply voltages are becoming lower. The reduction of distance between on-chip signals, die geometry size reduction and the increase of unwanted currents in parasitic structures, such as isolation capacitances, leads to increased internal crosstalk. Consequently, the immunity of integrated circuits is becoming more and more critical. Due to this increased risk of lower IC immunity, the use of models and simulation tools is required to optimize the immunity behaviour of both the IC and the application. This part of IEC 62433 describes such macro-models for simulating immunity behaviour at the IC level. The model, called ICIM-CI, will be used to predict electromagnetic immunity at the application level. This model is based on files describing the PDN and the IB containing data on electromagnetic disturbances leading to a variation of one or more observable signals. The PDN is considered to be linear, while the inherent non-linearity of the IC is taken into account in the IB. This assumption is shown in 8.2 (see Figure 25). Users of the model should apply a failure criterion to the observable signal depending on their requirements. ICIM-CI model data is arranged in a decipherable nested manner using XML format. The objective of this exchange format, called Conducted Immunity Markup Language (CIML), is to create simple and practical universal access to the ICIM-CI model. The preliminary definitions for XML representation are given in Annex A. 5 ICIM-CI model description 5.1 General The internal structure of an IC can be broken down into two parts: a) Passive parts (parasitic elements of pins, bondings and tracks, ESD protection), which conduct the disturbances from the external environment to the internal IC blocks, b) Active parts (CPU core, clock system, memory, analogue blocks). It is these active internal blocks which are sensitive to the incoming disturbances. The ICIM-CI model consists of a set of data describing these two parts: • PDN: the Passive Distribution Network is a multi-port circuit. It is composed of four different terminals: – DI: Terminals to which disturbances are applied, – DO: Terminals that can influence the impedance of the DI terminals and consequently receive a part of the disturbance applied on the DI terminals, – GND: PDN shall have one or more ground terminals (such as digital ground, analogue ground), – Internal terminals: Terminals that can influence the impedance of the DI terminals and are internal to the IC (at chip-level). • IB: The Immunity Behaviour component that describes how the IC reacts to the applied disturbances (referenced to one ground terminal of the PDN). The immunity criterion is set on terminals that are called Observable Output (OO). These OO could be associated or not to the various DI, depending on the configuration of the IC. NOTE 1 DI, DO, OO and GND terminals are external terminals and are interfaced at pin level. These pins connect to the external environment of the IC. NOTE 2 OO terminals link the PDN to the IB. Though these terminals are external on the IC and are used to obtain
...