SIST EN 61189-11:2013

Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

This part of IEC 61189 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 11: Messung der Schmelztemperatur und Schmelztemperaturbereiche von Lotlegierungen

Méthodes d'essai pour les matériaux électriques, les structures d'interconnexion et les ensembles - Partie 11: Mesure de la température de fusion ou des plages de températures de fusion des alliages à braser

La CEI 61189-11:2013 décrit la méthode de mesure des plages de fusion des alliages à braser utilisés principalement pour les équipements électriques de câblage, les matériels électriques, les équipements de communication, et pour d'autres appareils, ainsi que pour les composants de connexion.

Preskusne metode za električne materiale, povezovalne strukture in sestave - 11. del: Meritve talilne temperature in talilnih temperaturnih območij za spajkalne zlitine

Ta del IEC 61189 opisuje merilno metodo območij taljenja zlitin za spajkanje, ki se uporabljajo predvsem za napeljavo električne opreme, električno in komunikacijsko opremo, za druge naprave ter tudi za povezovanje komponent.

General Information

• Status: Published
• Publication Date: 09-Jul-2013
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 05-Jul-2013
• Due Date: 09-Sep-2013
• Completion Date: 10-Jul-2013
• Ref Project: EN 61189-11:2013 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61189-11:2013
01-september-2013
3UHVNXVQHPHWRGH]DHOHNWULþQHPDWHULDOHSRYH]RYDOQHVWUXNWXUHLQVHVWDYH
GHO0HULWYHWDOLOQHWHPSHUDWXUHLQWDOLOQLKWHPSHUDWXUQLKREPRþLM]DVSDMNDOQH
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Test methods for electrical materials, interconnection structures and assemblies - Part
11: Measurement of melting temperature or melting temperature ranges of solder alloys
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen - Teil 11: Messung der Schmelztemperatur und
Schmelztemperaturbereiche von Lotlegierungen
Méthodes d'essai pour les matériaux électriques, les structures d'interconnexion et les
ensembles - Partie 11: Mesure de la température de fusion ou des plages de
températures de fusion des alliages à braser
Ta slovenski standard je istoveten z: EN 61189-11:2013
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61189-11:2013 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61189-11:2013

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SIST EN 61189-11:2013

EUROPEAN STANDARD
EN 61189-11

NORME EUROPÉENNE
June 2013
EUROPÄISCHE NORM

ICS 31.180


English version


Test methods for electrical materials, printed boards and other
interconnection structures and assemblies -
Part 11: Measurement of melting temperature or melting temperature
ranges of solder alloys
(IEC 61189-11:2013)


Méthodes d'essai pour les matériaux Prüfverfahren für Elektromaterialien,
électriques, les cartes imprimées et autres Leiterplatten und andere
structures d'interconnexion et ensembles - Verbindungsstrukturen und Baugruppen -
Partie 11: Mesure de la température de Teil 11: Messung der Schmelztemperatur
fusion ou des plages de températures de und Schmelztemperaturbereiche von
fusion des alliages à braser Lotlegierungen
(CEI 61189-11:2013) (IEC 61189-11:2013)





This European Standard was approved by CENELEC on 2013-06-11. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61189-11:2013 E

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SIST EN 61189-11:2013
EN 61189-11:2013 - 2 -

Foreword
The text of document 91/1086/FDIS, future edition 1 of IEC 61189-11, prepared by IEC TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61189-11:2013.
The following dates are fixed:
• latest date by which the document has (dop) 2014-03-11
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2016-06-11
• latest date by which the national
standards conflicting with the

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.
Endorsement notice
The text of the International Standard IEC 61189-11:2013 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 61189-1 NOTE  Harmonized as EN 61189-1.

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SIST EN 61189-11:2013
- 3 - EN 61189-11:2013
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60194 - Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions


IEC 61189-3 - Test methods for electrical materials, printed EN 61189-3 -
boards and other interconnection structures
and assemblies -
Part 3: Test methods for interconnection
structures (printed boards)


IEC 61190-1-3 - Attachment materials for electronic assembly - E N 61190-1-3 -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications


ISO 9453 - Soft solder alloys - Chemical compositions EN ISO 9453 -
and forms


ISO 11357-1 - Plastics - Differential scanning calorimetry EN ISO 11357-1 -
(DSC) -
Part 1: General principles

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SIST EN 61189-11:2013

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SIST EN 61189-11:2013




IEC 61189-11

®


Edition 1.0 2013-05




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –

Part 11: Measurement of melting temperature or melting temperature ranges of


solder alloys



Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres


structures d'interconnexion et ensembles –

Partie 11: Mesure de la température de fusion ou des plages de températures de

fusion des alliages à braser










INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX P


ICS 31.180 ISBN 978-2-83220-800-7



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 61189-11:2013
– 2 – 61189-11 © IEC:2013
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Summary of measuring methods . 6
5 Test equipment . 6
5.1 Method A:DSC . 6
5.1.1 DSC . 6
5.1.2 Balance . 6
5.1.3 Pans . 6
5.1.4 Inert gas . 6
5.1.5 Alumina powder . 6
5.2 Method B:Cooling curve of molten solder . 7
5.2.1 Electric furnace . 7
5.2.2 Thermocouple. 7
5.2.3 Measuring instrument . 7
5.2.4 Recorder . 7
5.2.5 Container. 7
6 Calibration of the temperature . 7
7 Procedure for the measuring method . 7
7.1 Method A: DSC . 7
7.1.1 Test condition . 7
7.1.2 Procedure for measuring the DSC curve . 8
7.2 Method B: Cooling curve of molten solder . 10
7.2.1 Test condition . 10
7.2.2 Procedure for measuring the cooling curve of molten solder . 10
Annex A (normative) Test report on melting temperatures of solder alloys . 12
Annex B (informative) Examples of test result (Method A) . 13
Annex C (informative) Example of test result (Method B) . 14
Bibliography . 15

Figure 1 – Determination of solidus temperature . 8
Figure 2 – Determination of temperature of melting ends . 9
Figure 3 – Determination of liquidus temperature . 10
Figure 4 – Cooling curves of molten solder . 11
Figure B.1 – Example of test result (Method A: Sn96,5Ag3Cu,5 alloy) . 13
Figure B.2 – Example of test result (Method A: Sn95,8Ag3,5Cu,7 alloy). 13
Figure C.1 – Example of test result (Method B: Sn96,5Ag3Cu,5 alloy) . 14
Figure C.2 – Example of test result (Method B: Sn95,8Ag3,5Cu,7 alloy) . 14

Table 1 – Metal list for calibration . 7
Table A.1 – Report form . 12

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SIST EN 61189-11:2013
61189-11 © IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

TEST METHODS FOR ELECTRICAL MATERIALS,
PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES
AND ASSEMBLIES –

Part 11: Measurement of melting temperature or
melting temperature ranges of solder alloys

FOREWORD
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