kSIST FprEN IEC 61249-2-51:2023
(Main)Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
Werkstoffe für Leiterplatten und andere Verbindungsstrukturen – Teil 2-51: Verstärkte Basismaterialien, kaschiert und nicht kaschiert – Basismaterialien für Trägerbänder für integrierte Schaltungen, nicht kaschiert
Matériaux pour circuits imprimés et autres structures d’interconnexion - Partie 2-51: Matériaux de base renforcés, recouverts ou non - Matériaux de base pour bande support de carte à circuit intégré, non recouverts
L’IEC 61249-2-51:2023 spécifie les exigences relatives à la construction, aux matériaux et aux propriétés, ainsi qu’à l’assurance qualité, à l’emballage, au marquage et au stockage des matériaux de base pour bande support de carte à circuit intégré, non plaqués (ici désignés par matériaux de base pour bande support de CI).
Le présent document s’applique aux matériaux de base pour bande support de CI ; il s’agit d’un matériau recouvert de colle, un côté étant composé d’une sous-couche époxy renforcée en tissu de verre de type E, l’autre côté étant recouvert d’un adhésif et protégé par une pellicule antiadhésive.
Materiali za plošče tiskanih vezij in druge povezovalne strukture - 2-51. del: Ojačeni laminati z bakreno folijo in brez nje - Osnovni materiali za nosilne trakove kartic integriranih vezij, neprevlečeni
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
oSIST prEN IEC 61249-2-51:2022
01-oktober-2022
Materiali za plošče tiskanih vezij in druge povezovalne strukture - 2-51. del:
Ojačeni laminati z bakreno folijo in brez nje - Osnovni materiali za nosilne trakove
kartic integriranih vezij, neprevlečeniMaterials for printed boards and other interconnecting structures - Part 2-51: Reinforced
base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape,
uncladTa slovenski standard je istoveten z: prEN IEC 61249-2-51:2022
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
oSIST prEN IEC 61249-2-51:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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oSIST prEN IEC 61249-2-51:2022
91/1793/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61249-2-51 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2022-07-29 2022-10-21
SUPERSEDES DOCUMENTS:
91/1749/CD, 91/1792/CC
IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Masahide Okamoto
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if any, in
this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel votingThe attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they
are aware and to provide supporting documentation.TITLE:
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials,
clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad
PROPOSED STABILITY DATE: 2028NOTE FROM TC/SC OFFICERS:
Copyright © 2022 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
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oSIST prEN IEC 61249-2-51:2022
IEC 61249-2-51-Ed1 IEC (E) – 2 – 91/1793/CDV
1 CONTENTS
3 FOREWORD ........................................................................................................................... 4
4 1 Scope .............................................................................................................................. 6
5 2 Normative references ...................................................................................................... 6
6 3 Terms and definitions ...................................................................................................... 6
7 4 Construction and Materials .............................................................................................. 7
8 4.1 Construction ........................................................................................................... 7
9 4.2 Epoxide woven E-glass underlayer ......................................................................... 7
10 4.3 Adhesive ................................................................................................................. 7
11 4.4 Release film ............................................................................................................ 7
12 5 Electrical properties ......................................................................................................... 7
13 6 Non-electrical properties .................................................................................................. 7
14 6.1 Appearance of the IC carrier tape base materials .................................................... 7
15 6.1.1 Delamination ................................................................................................... 7
16 6.1.2 Colloidal particles and metallic particles in underlayer ..................................... 8
17 6.1.3 Colloidal particles in adhesive layer ................................................................. 8
18 6.1.4 Scratches of adhesive ..................................................................................... 8
19 6.1.5 Bubbles in underlayer ...................................................................................... 8
20 6.1.6 Breakages and exposures of reinforcement fiber in underlayer ........................ 8
21 6.2 Dimensional of IC carrier tape base materials ........................................................ 8
22 6.2.1 Length and Width ............................................................................................ 8
23 6.2.2 Thickness of underlayer ................................................................................... 8
24 6.2.3 Thickness of adhesive layer ............................................................................. 8
25 6.3 Splices .................................................................................................................... 8
26 6.4 Glass transition temperature ................................................................................... 8
27 6.5 Surface properties of the underlayer side ................................................................ 8
28 6.6 Tensile strength and Elongation at break ................................................................ 9
29 6.7 Water absorption .................................................................................................... 9
30 6.8 Peel strength .......................................................................................................... 9
31 6.9 Resin flow ............................................................................................................. 10
32 7 Packaging, marking and storage .................................................................................... 10
33 7.1 Packaging, marking .............................................................................................. 10
34 7.2 Storage, Storage condition, Shelf life .................................................................... 10
35 8 Ordering information ...................................................................................................... 10
36 Annex A (informative) Guidance for the samples preparation of some performance
37 items ............................................................................................................................. 12
38 Annex B (informative) Engineering information ................................................................... 13
39 B.1 General ................................................................................................................. 13
40 B.2 Chemical properties .............................................................................................. 13
41 B.3 Electrical properties .............................................................................................. 13
42 B.4 Mechanical properties ........................................................................................... 13
43 B.5 Physical properties ............................................................................................... 13
44 B.6 Thermal properties ................................................................................................ 13
45 Annex C (informative) Guideline for qualification and conformance inspection ..................... 14
46 Bibliography .......................................................................................................................... 15
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IEC 61249-2-51-Ed1 IEC (E) – 3 – 91/1793/CDV
48 Figure 1 –Construction of IC carrier tape base materials ......................................................... 7
50 Table 1 – Electrical properties ................................................................................................ 7
51 Table 2 – Glass transition temperature of underlayer .............................................................. 8
52 Table 3 – Roughness, Glossiness(60゜) and Surface energy .................................................. 9
53 Table 4 – Tensile strength and Elongation at break ................................................................. 9
54 Table 5 – Water absorption ..................................................................................................... 9
55 Table 6 – Peel strength ......................................................................................................... 10
56 Table 7 – Resin flow ............................................................................................................. 10
57 Table A.1 –Guidance for the samples preparation of some performance items ...................... 12
58 Table C.1 – Qualification and conformance inspection .......................................................... 14
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IEC 61249-2-51-Ed1 IEC (E) – 4 – 91/1793/CDV
62 INTERNATIONAL ELECTROTECHNICAL COMMISSION
63 ____________
65 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING
66 STRUCTURES –
68 Part 2-51: Reinforced base materials clad and unclad-Base materials for
69 Integrated Circuit card carrier tape, unclad
73 FOREWORD
74 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
75 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
76 co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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82 Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
83 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
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85 interested IEC National Committees.86 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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88 Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
89 misinterpretation by any end user.90 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
91 transparently to the maximum extent possible in their national and regional publications. Any divergence between
92 any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
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101 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
102 indispensable for the correct application of this publication.103 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
104 rights. IEC shall not be held responsible for identifying any or all such patent rights.
105 International Standard IEC 61249-2-51 has been prepared by IEC technical committee 91,
106 Electronics assembly technology.107 The text of this International Standard is based on the following documents:
FDIS Report on voting
XX/XX/FDIS XX/XX/RVD
108
109 Full information on the voting for the approval of this International Standard can be found in the
110 report on voting indicated in the above table.111 This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
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IEC 61249-2-51-Ed1 IEC (E) – 5 – 91/1793/CDV
112 The committee has decided that the contents of this document will remain unchanged until the
113 stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
114 the specific document. At this date, the document will be115 • reconfirmed,
116 • withdrawn,
117 • replaced by a revised edition, or
118 • amended.
119
120
121
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oSIST prEN IEC 61249-2-51:2022
IEC 61249-2-51-Ed1 IEC (E) – 6 – 91/1793/CDV
122 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING
123 STRUCTURES –
124
125 Part 2-51: Reinforced base materials clad and unclad-Base materials for
126 Integrated Circuit card carrier tape, unclad
127
128
129
130 1 Scope
131 This standard specifies the construction, materials, property requirements, quality assurance,
132 packaging, marking, storage of Base materials for Integrated Circuit Card carrier tape,
133 unclad(hereinafter referred to as IC carrier tape base materials).134 This standard is applicable to IC carrier tape base materials, which is a glue-coated material,
135 one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with
136 adhesive and protected by release film.137 2 Normative references
138 The following documents are referred to in the text in such a way that some or all of their content
139 constitutes requirements of this document. For dated references, only the edition cited applies.
140 For undated references, the latest edition of the referenced document (including any
141 amendments) applies.142 IEC 61189-2:2006, Test methods for electrical materials, printed boards and other
143 interconnection structures and assemblies – Part 2: Test methods for materials and other
144 interconnection structures145 IEC PAS 61249-6-3, Specification for finished fabric woven from "E" glass for printed boards
146 ISO 2813, Paints and varnishes — Determination of gloss value at 20 degrees, 60 degrees and
147 85 degrees148 ISO 4287, Geometrical Product Specifications (GPS) — Surface texture: Profile method —
149 Terms, definitions and surface texture parameters150 ISO 8296, Plastics — Film and sheetin
...
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