ASTM F1711-96(2008)
(Practice)Standard Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method
Standard Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method
SCOPE
1.1 This practice describes methods for measuring the sheet electrical resistance of sputtered thin conductive films deposited on large insulating substrates, used in making flat panel information displays. It is assumed that the thickness of the conductive thin film is much thinner than the spacing of the contact probes used to measure the sheet resistance.
1.2 This standard is intended to be used with Test Method F 390.
1.3 Sheet resistivity in the range 0.5 to 5000 ohms per square may be measured by this practice. The sheet resistance is assumed uniform in the area being probed.
1.4 This practice is applicable to flat surfaces only.
1.5 Probe pin spacings of 1.5 mm to 5.0 mm, inclusive (0.059 to 0.197 in inclusive) are covered by this practice.
1.6 The method in this practice is potentially destructive to the thin film in the immediate area in which the measurement is made. Areas tested should thus be characteristic of the functional part of the substrate, but should be remote from critical active regions. The method is suitable for characterizing dummy test substrates processed at the same time as substrates of interest.
1.7 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
1.8 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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Designation:F1711 −96(Reapproved 2008)
Standard Practice for
Measuring Sheet Resistance of Thin Film Conductors for
Flat Panel Display Manufacturing Using a Four-Point Probe
1
Method
This standard is issued under the fixed designation F1711; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 2. Referenced Documents
2
2.1 ASTM Standards:
1.1 This practice describes methods for measuring the sheet
F390Test Method for Sheet Resistance of Thin Metallic
electrical resistance of sputtered thin conductive films depos-
Films With a Collinear Four-Probe Array
ited on large insulating substrates, used in making flat panel
information displays. It is assumed that the thickness of the
3. Terminology
conductive thin film is much thinner than the spacing of the
contact probes used to measure the sheet resistance.
3.1 Definitions:
3.1.1 For definitions of terms used in this practice see Test
1.2 This standard is intended to be used with Test Method
Method F390.
F390.
1.3 Sheet resistivity in the range 0.5 to 5000 ohms per
4. Summary of Practice
square may be measured by this practice. The sheet resistance
4.1 This practice describes the preferred means of applying
is assumed uniform in the area being probed.
Test Method F390 to measure the electrical sheet resistance of
1.4 This practice is applicable to flat surfaces only. thinfilmsonverylargeflatsubstrates.Anarrayoffourpointed
probesisplacedincontactwiththefilmofinterest.Ameasured
1.5 Probe pin spacings of 1.5 mm to 5.0 mm, inclusive
electrical current is passed between two of the probes, and the
(0.059 to 0.197 in inclusive) are covered by this practice.
electrical potential difference between the remaining two
probes is determined. The sheet resistance is calculated from
1.6 The method in this practice is potentially destructive to
the measured current and potential values using correction
the thin film in the immediate area in which the measurement
factors associated with the probe geometry and the probe’s
is made. Areas tested should thus be characteristic of the
distance from the test specimen’s boundaries.
functional part of the substrate, but should be remote from
critical active regions. The method is suitable for characteriz-
4.2 The method of F390 is extended to cover staggered
ing dummy test substrates processed at the same time as
in-lineandsquareprobearrays.Inallthedesigns,however,the
substrates of interest.
probe spacings are nominally equal.
4.3 This practice includes a special electrical test for veri-
1.7 The values stated in SI units are to be regarded as the
fying the proper functioning of the potential measuring instru-
standard. The values given in parentheses are for information
ment (voltmeter), directions for making and using sheet resis-
only.
tance reference films, an estimation of measurement error
1.8 This standard does not purport to address all of the
caused by probe wobble in the probe supporting fixture, and a
safety concerns, if any, associated with its use. It is the
protocol for reporting film uniformity.
responsibility of the user of this standard to establish appro-
4.4 Two appendices indicate the computation methods em-
priate safety and health practices and determine the applica-
ployed in deriving numerical relationships and correction
bility of regulatory limitations prior to use.
factors employed in this practice, and in Test Method F390.
1
This practice is under the jurisdiction ofASTM Committee F01 on Electronics
2
and is the direct responsibility of Subcommittee F01.17 on Sputter Metallization. For referenced ASTM standards, visit the ASTM website, www.astm.org, or
Current edition approved June 15, 2008. Published July 2008. Originally contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
approved in 1996. Last previous edition approved in 2002 as F1711–96(2002). Standards volume information, refer to the standard’s Document Summary page on
DOI: 10.1520/F1711-96R08. the ASTM website.
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F1711−96 (2008)
5. Significance and Use 5.1.4 It is difficult, given the conditions cited in 5.1.3,to
ensure that uniform probe spacing is not degraded by rough
5.1 ApplyingTestMethodF390tolargeflatpanelsubstrates
handlingoftheequipment.Thephasedsquarearray,described,
presents a number of serious difficulties not anticipated in the
averages out probe placement errors.
development of that standard. The following problems are
5.1.5 This practice is estimated
...
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