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ASTM F1512-94(2003)

(Practice)

Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies

Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies

SIGNIFICANCE AND USE
This practice supplements Practice E 1001 by indicating specific equipment choices and test arrangements appropriate for evaluating sputtering target bonds.
The bond between sputtering target and its supporting backing plate is a critical reliability element in a sputter deposition system. A bond must have high thermal conductivity to provide adequate target cooling during sputtering. The target-backing plate joint must also have strength enough to withstand the shear stresses caused by differential thermal expansion between target and backing plate.
Flaws in a bond, for example, voids in the joining material, degrade bond performance. An inadequate bond may fail in service, potentially causing catastrophic separation of the target from the backing plate. Assurance of sound bonds is an important concern among users of sputtering equipment.
Ultrasonic testing is accepted as an efficient method for evaluating target bonds, but differences in technique inhibit intercomparison of results from one laboratory to another. This practice is intended to promote uniformity in use so that specifications for bond integrity may be universally applied.
The C-span display of ultrasonic test data is a direct method for visually demonstrating bond character. Practice E 1001 upon which this practice is modeled, however, does not address C-scan display. Instructions specific to the C-scan display mode are indicated in this practice. In other respects this practice is a section by section commentary on Practice E 1001.
SCOPE
1.1 This practice describes a method for ultrasonic mapping of the soundness of a bond joining a sputtering target to its supporting backing plate. The results of the examination may be used in predicting the target-backing plate assembly's suitability for use. Accept/reject standards are not specified; these are subject to agreement between target supplier and user, depending upon the application requirements.
1.2 This standard is intended to be used with Practice E1001.
1.3 The method reveals unbonded areas 0.125 in. (3 mm) in diameter and larger. The technique permits, for example, unambiguous quantitative measurement of the voided area in solder bonds.
1.3.1 This technique may also show regions in which bond integrity is marginally degraded by imperfect adhesion, for example, areas in which oxide inclusion has inhibited the development of full bond strength. Evaluation of indications of degraded bond areas may vary in rigor from purely subjective to semiquantitative. Target supplier and user must agree upon the means used to display and grade partially bonded areas.
1.4 This practice is applicable to assemblies having planar bonds in which the design provides at least one flat plane parallel to the bond that may be used as the entry/exit surface for ultrasonic excitation.
1.5 Only the immersion pulse-echo method is covered.
1.6 Evaluation by this method is intended to be nondestructive. For target assemblies that would be degraded by immersion in demineralized water, for example, for porous target materials, the test should be considered a destructive one.
1.7 This practice is applicable to bonding methods that use a filler material to join the target and backing plate. These include solder, epoxy, and braze bonds.
1.8 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
1.9 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

Status
Historical
Publication Date
09-Dec-1999
ICS
19.100 - Non-destructive testing
Technical Committee
F01 - Electronics
Drafting Committee
F01.17 - Sputter Metallization
Current Stage
Ref Project

Relations

Replaces
ASTM F1512-94(1999) - Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
Effective Date
10-Dec-1999
Replaced By
ASTM F1512-94(2011) - Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies (Withdrawn 2020)
Effective Date
01-Jun-2011
Referred By
ASTM F3192-16 - Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023)
Effective Date
10-Dec-1999
Referred By
ASTM F3166-16 - Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization (Withdrawn 2023)
Effective Date
10-Dec-1999

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ASTM F1512-94(2003) - Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate AssembliesASTM F1512-94(2003) - Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
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ASTM F1512-94(2003) - Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
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NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation:F1512–94 (Reapproved 2003)
Standard Practice for
Ultrasonic C-Scan Bond Evaluation of Sputtering
Target-Backing Plate Assemblies
This standard is issued under the fixed designation F1512; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 1.9 This standard does not purport to address all of the
safety concerns, if any, associated with its use. It is the
1.1 This practice describes a method for ultrasonic mapping
responsibility of the user of this standard to establish appro-
of the soundness of a bond joining a sputtering target to its
priate safety and health practices and determine the applica-
supporting backing plate. The results of the examination may
bility of regulatory limitations prior to use.
be used in predicting the target-backing plate assembly’s
suitability for use. Accept/reject standards are not specified;
2. Referenced Documents
thesearesubjecttoagreementbetweentargetsupplieranduser,
2.1 ASTM Standards:
depending upon the application requirements.
E127 Practice for Fabricating and Checking Aluminum
1.2 This standard is intended to be used with Practice
Alloy Ultrasonic Standard Reference Blocks
E1001.
E428 Practice for Fabrication and Control of Metal, Other
1.3 The method reveals unbonded areas 0.125 in. (3 mm) in
than Aluminum, Reference Blocks Used in Ultrasonic
diameter and larger. The technique permits, for example,
Testing
unambiguous quantitative measurement of the voided area in
E1001 Practice for Detection and Evaluation of Disconti-
solder bonds.
nuities by the Immersed Pulse-Echo Ultrasonic Method
1.3.1 This technique may also show regions in which bond
Using Longitudinal Waves
integrity is marginally degraded by imperfect adhesion, for
E1316 Terminology for Nondestructive Examinations
example, areas in which oxide inclusion has inhibited the
2.2 American Society for Nondestructive Testing Standard:
development of full bond strength. Evaluation of indications of
ASNT Recommended Practice SNT-TC-1A for Personnel
degraded bond areas may vary in rigor from purely subjective
Qualification and Certification in Nondestructive Testing
to semiquantitative. Target supplier and user must agree upon
the means used to display and grade partially bonded areas.
3. Terminology
1.4 This practice is applicable to assemblies having planar
3.1 Definitions:
bonds in which the design provides at least one flat plane
3.1.1 For definitions of terms used in this practice see
parallel to the bond that may be used as the entry/exit surface
Practice E1001 and Terminology E1316.
for ultrasonic excitation.
1.5 Only the immersion pulse-echo method is covered.
4. Summary of Practice
1.6 Evaluation by this method is intended to be nondestruc-
4.1 This practice describes a preferred means of applying
tive. For target assemblies that would be degraded by immer-
PracticeE1001toobtainatwodimensionalmapoftheflawsin
sion in demineralized water, for example, for porous target
asputteringtarget-backingplatebond.Thetarget-backingplate
materials, the test should be considered a destructive one.
assembly is immersed in demineralized water, used as a
1.7 This practice is applicable to bonding methods that use
couplant, and the target-backing plate joint is scanned ultra-
a filler material to join the target and backing plate. These
sonically.
include solder, epoxy, and braze bonds.
1.8 The values stated in inch-pound units are to be regarded
as the standard. The values given in parentheses are for
information only.
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
This practice is under the jurisdiction ofASTM Committee F01 on Electronics Standards volume information, refer to the standard’s Document Summary page on
and is the direct responsibility of Subcommittee F01.17 on Sputter Metallization. the ASTM website.
Current edition approved April 15, 1994. Published June 1994. DOI: 10.1520/ Available from the American Society for Nondestructive Testing, 1711 Arlin-
F1512-94R03. gate Plaza, P.O. Box 28518, Columbus, OH 43228-0518.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
F1512–94 (2003)
5. Significance and Use reflectedsignalissampledataratesufficienttocharacterizethe
area-modulated ultrasonic reflectance of the bond interface.
5.1 This practice supplements Practice E1001 by indicating
These data may be plotted off-line to provide an equivalent
specific equipment choices and test arrangements appropriate
C-scan map.
for evaluating sputtering target bonds.
6.1.1.2 It is intended that the C-scan plotter be set to make
5.2 The bond between sputtering target and its supporting
a full-sized map of the bonded area. If a scaling factor other
backing plate is a critical reliability element in a sputter
than 1:1 is used the enlargement/reduction factor may be
deposition system. A bond must have high thermal conductiv-
determined from the reference block scan (see 8.2.3.1, 8.3.3,
ity to provide adequate target cooling during sputtering. The
and 9.1.1).
target-backing plate joint must also have strength enough to
6.1.2 Plotter—The plotter system must be capable of re-
withstand the shear stresses caused by differential thermal
solving the reference block calibration indications (6.7) with
expansion between target and backing plate.
contrast sufficient to permit unambiguous identification by the
5.3 Flaws in a bond, for example, voids in the joining
unaided eye under ordinary room lighting conditions.
material, degrade bond performance.An inadequate bond may
6.1.3 Data Acquisition System—The data system must be
fail in service, potentially causing catastrophic separation of
capable of displaying a C-scan mode plot of the reference
the target from the backing plate.Assurance of sound bonds is
block calibration indications (6.7) with contrast and resolution
an important concern among users of sputtering equipment.
sufficient to permit unambiguous identification by unaided eye
5.4 Ultrasonic testing is accepted as an efficient method for
under ordinary room lighting conditions.Asampling rate of at
evaluating target bonds, but differences in technique inhibit
least 50/in. (2/ mm) of search unit travel is recommended.
intercomparison of results from one laboratory to another.This
Display of the ultrasonic map’s features in contrasting colors
practice is intended to promote uniformity in use so that
may be used to enhance visibility.
specifications for bond integrity may be universally applied.
6.2 Voltage Regulator—Provide if necessary, in accordance
5.5 The C-span display of ultrasonic test data is a direct
with Practice E1001 (6.2).
method for visually demonstrating bond character. Practice
6.3 Search Units—Use round, immersion type, single ele-
E1001 upon which this practice is modeled, however, does not
ment, straight-beam (longitudinal), focused search units. The
address C-scan display. Instructions specific to the C-scan
focal length must be sufficiently long that the beam minimum
display mode are indicated in this practice. In other respects
area may be focused at the target-backing plate interface.
this practice is a section by section commentary on Practice
Search units 0.375 to 0.500 in. (9.5 to 12.5 mm) in diameter,
E1001.
tuned at 5 or 10 Mhz operating frequency, with focal length (in
water)of2to4in.(50to100mm)haveprovedsatisfactoryfor
6. Apparatus
most applications.
6.1 Electronic Equipment—Provide electronic equipment in
6.4 Alarm—Not applicable for this determination.
general conformance with the requirements of Practice E1001,
6.4.1 Gate Synchronization—Set the electronic gate syn-
6.1. It is recommended that 5 or 10 Mhz frequency be used for
chronization to lock onto the top surface echo pulse from the
testing sputtering target bonds.The equipment and its cathode-
test article (not the primary excitation pulse) as reference. Set
ray tube (CRT) display, operating in the A-scan mode, should
the gate delay and width to capture the echo pulse from the
be capable of producing echo amplitudes of at least 60 % of
target/backing plate interface.
full scale, with the noise level no greater than 20 % of full
6.5 Manipulating Equipment, should conform to Practice
scale, using an 0.125-in. (3-mm) diameter flat-bottom test hole
E1001 (6.5).
in a reference block (6.7) simulating the assembly under test.
6.6 Tank—Provide tank in accordance with Practice E1001
Note that for C-scan mapping of target bonds theA-scan mode
(6.6).
is used for assisting in the setup only. A-scan data are not
6.7 Reference Blocks—Ultrasonic reference blocks, often
collected or reported.
called test blocks, are used to standardize the ultrasonic
6.1.1 C-scan Plotter/Data Acquisition System—The C-scan
equipment and to evaluate indications received from disconti-
presentation is a mapping of the reflected ultrasound pulse
nuities in the test part.
intensity (peak voltage) from the target/backing plate interface
6.7.1 It is mandatory that test blocks specifically made for
as a function of position. Modulations of the reflected inten-
sputtering target testing be provided for this procedure. Blocks
sity“ indications” are indicative of variations in the metallur-
should be designed, manufactured, and tested in conformance
gical bond between target and backing plate. The electronic
with Practices E127 and E428.
system may be equipped with a plotter to make C-scan maps
on-line as the search unit traces a raster pattern over the test 6.7.2 Test blocks must be 1.5 in. (38 mm) square or
article’s surface. diameter, or larger. In order to duplicate the target-backing
plateassembly,testblocksmustbemadeofthesamematerials,
6.1.1.1 Suitable plotters may use an electric discharge pen
that is, having the same acoustic properties as the article under
andconductivepaper;amechanicalorelectricallinkagecauses
thetest,ofthesamethicknesses,andjoinedinthesamemanner
the pen to traverse the paper in synchronism with the search
as the target assembly to be evaluated.
unit’s raster of the test article. The density of the pen trace is
made proportional to the reflected ultrasonic pulse from the 6.7.2.1 Itiscriticalfortestblockcredibilitythatthebonding
target/backing plate interface. Alternatively, a computer-based of target and backing plate materials be sound in areas not
data acquisition system may be used in which the gated purposefully altered to provide calibration indications (6.7.4,
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1.5 The use of deliberate lateral displacements is not included in this practice (that is, scratch testing).  
1.6 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.  
1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.  
1.8 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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ASTM
ASTM E2862-23(Practice)
Standard Practice for Probability of Detection Analysis for Hit/Miss Data

SIGNIFICANCE AND USE
5.1 The POD analysis method described herein is based on a well-known and well established statistical regression method. It shall be used to quantify the demonstrated POD for a specific set of examination parameters and known range of discontinuity sizes under the following conditions.  
5.1.1 The initial response from a nondestructive evaluation inspection system is ultimately binary in nature (that is, hit or miss).  
5.1.2 Discontinuity size is the predictor variable and can be accurately quantified.  
5.1.3 A relationship between discontinuity size and POD exists and is best described by a generalized linear model with the appropriate link function for binary outcomes.  
5.2 This practice does not limit the use of a generalized linear model with more than one predictor variable or other types of statistical models if justified as more appropriate for the hit/miss data.  
5.3 If the initial response from a nondestructive evaluation inspection system is measurable and can be classified as a continuous variable (for example, data collected from an Eddy Current inspection system), then Practice E3023 may be more appropriate.  
5.4 Prior to performing the analysis it is assumed that the discontinuity of interest is clearly defined; the number and distribution of induced discontinuity sizes in the POD specimen set is known and well-documented; discontinuities in the POD specimen set are unobstructed; and the POD examination administration procedure (including data collection method) is well-designed, well-defined, under control, and unbiased. The analysis results are only valid if convergence is achieved and the model adequately represents the data.  
5.5 The POD analysis method described herein is consistent with the analysis method for binary data described in MIL-HDBK-1823A, and is included in several widely utilized POD software packages to perform a POD analysis on hit/miss data. It is also found in statistical software packages that have generalized line...
SCOPE
1.1 This practice covers the procedure for performing a statistical analysis on nondestructive testing hit/miss data to determine the demonstrated probability of detection (POD) for a specific set of examination parameters. Topics covered include the standard hit/miss POD curve formulation, validation techniques, and correct interpretation of results.  
1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.  
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.  
1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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ASTM
ASTM E3370-23(Practice)
Standard Practice for Matrix Array Ultrasonic Testing of Composites, Sandwich Core Constructions, and Metals

SIGNIFICANCE AND USE
5.1 The procedures described in this practice have proven utility in the inspecting (1) monolithic polymer matrix composites (laminates) for bulk defects, (2) metals for corrosion during the service life of the part of interest, (3) thickness checks, (4) adhesive bonding of metals, composites, and sandwich core constructions, (5) coatings, and (6) composite filament windings. Both unpressurized, and with suitable precautions, pressurized materials and components are inspected.  
5.2 This practice provides guidelines for the application of longitudinal wave examination to the detection and quantitative evaluation of damage, discontinuities, and thickness variations in materials.  
5.3 This practice is intended primarily for the testing of parts to acceptance criteria most typically specified in a purchase order or other contractual document, and for testing of parts in-service to detect and evaluate damage.  
5.4 MAUT search units provide near-surface resolution and detection of small discontinuities comparable to phased array transducers. They may or may not be capable of beam steering. The advantage of MAUT for straight-beam longitudinal wave inspections is the ability to provide real-time C-scan data, which facilitates data interpretation and shortens inspection time. Depending on inspection needs, data can be displayed as A-, B- or C-scans, or three-dimensional renderings. Toggling between pulse-echo and through transmission ultrasonic (TTU) modes without having to use another system or changing transducers is also possible.  
5.5 The MAUT technique has proven utility in the inspection of multi-ply carbon-fiber reinforced laminates used in primary aircraft structures.11  
5.6 For ultrasonic testing of laminate composites and sandwich core materials using conventional UT equipment consult Practice E2580. Consult Practice E114 for ultrasonic testing of materials by the pulse-echo method using straightbeam longitudinal waves introduced by a piezoelectric elemen...
SCOPE
1.1 This practice covers procedures for matrix array ultrasonic testing (MAUT) of monolithic composites, composite sandwich constructions, and metallic test articles. These procedures can be used throughout the life cycle of a part during product and process design optimization, on line process control, post-manufacturing inspection, and in-service inspection.  
1.2 In general, ultrasonic testing is a common volumetric method for detection of embedded or subsurface discontinuities. This practice includes general requirements and procedures which may be used for detecting flaws and for making a relative or approximate evaluation of the size of discontinuities and part anomalies. The types of flaws or discontinuities detected include interply delaminations, foreign object debris (FOD), inclusions, disbond/un-bond, fiber debonding, fiber fracture, porosity, voids, impact damage, thickness variation, and corrosion.  
1.3 Typical test articles include monolithic composite layups such as uniaxial, cross ply and angle ply laminates, sandwich constructions, bonded structures, and filament windings, as well as forged, wrought and cast metallic parts. Two techniques can be considered based on accessibility of the inspection surface: namely, pulse echo inspection for one-sided access and through-transmission for two-sided access. As used in this practice, both require the use of a pulsed straight-beam ultrasonic longitudinal wave followed by observing indications of either the reflected (pulse-echo) or received (through transmission) wave.  
1.4 This practice provides two ultrasonic test procedures. Each has its own merits and requirements for inspection and shall be selected as agreed upon in a contractual document.  
1.4.1 Test Procedure A, Pulse Echo (non-contacting and contacting) is at a minimum a single matrix array transducer transmitting and receiving longitudinal waves in the range of 0.5 MHz to 20 MHz (see Fig. 1). Th...

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ASTM
ASTM E1901-23(Guide)
Standard Guide for Detection and Evaluation of Discontinuities by Contact Pulse-Echo Straight-Beam Ultrasonic Methods

SIGNIFICANCE AND USE
6.1 This guide provides procedures for the application of contact straight-beam examination for the detection and quantitative evaluation of discontinuities in materials.  
6.2 Although not all requirements of this guide can be applied universally to all examinations, situations, and materials, it does provide basis for establishing contractual criteria between the users, and may be used as a general guide for preparing detailed specifications for a particular application.  
6.3 This guide is directed towards the evaluation of discontinuities detectable with the beam normal to the entry surface. If discontinuities or other orientations are of concern, alternate scanning techniques are required.
SCOPE
1.1 This guide covers procedures for the contact ultrasonic examination of bulk materials or parts by transmitting pulsed ultrasonic waves into the material and observing the indications of reflected waves. This guide covers only examinations in which one search unit is used as both transmitter and receiver (pulse-echo). This guide includes general requirements and procedures that may be used for detecting discontinuities, locating depth and distance from a point of reference and for making a relative or approximate evaluation of the size of discontinuities as compared to a reference standard.  
1.2 This guide complements Practice E114 by providing more detailed procedures for the selection and standardization of the examination system and for evaluation of the indications obtained.  
1.3 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.  
1.4 This guide does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this guide to establish the appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.  
1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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ASTM E165/E165M-23(Practice)
Standard Practice for Liquid Penetrant Testing for General Industry

SIGNIFICANCE AND USE
5.1 Liquid penetrant testing methods indicate the presence, location, and to a limited extent, the nature and magnitude of the detected discontinuities. Each of the various penetrant methods has been designed for specific uses such as critical service items, volume of parts, portability, or localized areas of examination. The method selected will depend accordingly on the design and service requirements of the parts or materials being tested.
SCOPE
1.1 This practice2 covers procedures for penetrant examination of materials. Penetrant testing is a nondestructive testing method for detecting discontinuities that are open to the surface such as cracks, seams, laps, cold shuts, shrinkage, laminations, through leaks, or lack of fusion and is applicable to in-process, final, and maintenance examinations. It can be effectively used in the examination of nonporous, metallic materials, ferrous and nonferrous metals, and of nonmetallic materials such as nonporous glazed or fully densified ceramics, as well as certain nonporous plastics, and glass.  
1.2 This practice also provides a reference:  
1.2.1 By which a liquid penetrant examination process recommended or required by individual organizations can be reviewed to ascertain its applicability and completeness.  
1.2.2 For use in the preparation of process specifications and procedures dealing with the liquid penetrant testing of parts and materials. Agreement by the customer requesting penetrant testing is strongly recommended. All areas of this practice may be open to agreement between the cognizant engineering organization and the supplier, or specific direction from the cognizant engineering organization.  
1.2.3 For use in the organization of facilities and personnel concerned with liquid penetrant testing.  
1.3 This practice does not indicate or suggest criteria for evaluation of the indications obtained by penetrant testing. It should be pointed out, however, that after indications have been found, they must be interpreted or classified and then evaluated. For this purpose there must be a separate code, standard, or a specific agreement to define the type, size, location, and direction of indications considered acceptable, and those considered unacceptable.  
1.4 Units—The values stated in either SI units or inch-pound units are to be regarded separately as standard. The values stated in each system may not be exact equivalents; therefore, each system shall be used independently of the other. Combining values from the two systems may result in non-conformance with the standard.  
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.  
1.6 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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ASTM
ASTM E2663-23(Practice)
Standard Practice for Digital Imaging and Communication in Nondestructive Evaluation (DICONDE) for Ultrasonic Test Methods

SIGNIFICANCE AND USE
5.1 Personnel that are responsible for the creation, transfer, and storage of ultrasonic test results will use this standard. This practice defines a set of information modules that, along with Practice E2339 and the DICOM standard, provides a standard means to organize ultrasonic test parameters and results. The ultrasonic test results may be displayed and analyzed on any device that conforms to this standard. Personnel wishing to view any ultrasonic inspection data stored in DICONDE format may use this document to help them decode and display the data contained in the DICONDE compliant inspection record.
SCOPE
1.1 This practice covers the interoperability of ultrasonic imaging equipment by specifying image data transfer and archival storage methods in commonly accepted terms. This document is intended to be used in conjunction with Practice E2339. Practice E2339 defines an industrial adaptation of NEMA PS3 / ISO 12052 (DICOM, see http://medical.nema.org), an international standard for image data acquisition, review, transfer, and archival storage. The goal of Practice E2339, commonly referred to as DICONDE, is to provide a standard that facilitates the display and analysis of NDE test results on any system conforming to the DICONDE standard. Toward that end, Practice E2339 provides a data dictionary and set of information modules that are applicable to all NDE modalities. This practice supplements Practice E2339 by providing information object definitions, information modules, and data dictionary that are specific to ultrasonic test methods.  
1.2 This practice has been developed to overcome the issues that arise when analyzing or archiving data from ultrasonic test equipment using proprietary data transfer and storage methods. As digital technologies evolve, data must remain decipherable through the use of open, industry-wide methods for data transfer and archival storage. This practice defines a method where all the ultrasonic technique parameters and test results are communicated and stored in a standard format regardless of changes in digital technology.  
1.3 This practice does not specify:  
1.3.1 A testing or validation procedure to assess an implementation's conformance to the standard.  
1.3.2 The implementation details of any features of the standard on a device claiming conformance.  
1.3.3 The overall set of features and functions to be expected from a system implemented by integrating a group of devices each claiming DICONDE conformance.  
1.4 Although this practice contains no values that require units, it does describe methods to store and communicate data that do require units to be properly interpreted. The SI units required by this practice are to be regarded as standard. No other units of measurement are included in this standard.  
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.  
1.6 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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