ES 59008-5-2:2001

Data requirements for semiconductor die -- Part 5-2: Particular requirements and recommendations for die types - Bare die with added connection structures

D129/C113: BTTF 97-1 disbanded * Superseded by 62258 series

Zahtevani podatki za polprevodniška integrirana vezja - 5-2. del: Posebne zahteve in priporočila za tipe polprevodniških integriranih vezij - Polprevodniška integrirana vezja brez ohišja z dodanimi priključnimi strukturami

General Information

• Status: Withdrawn
• Publication Date: 15-Mar-2001
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Completion Date: 16-Mar-2001
• Ref Project: SIST-TS ES 59008-5-2:2007 - Data requirements for semiconductor die -- Part 5-2: Particular requirements and recommendations for die types - Bare die with added connection structures

Standards Content (Sample)

SLOVENSKI STANDARD
SIST-TS ES 59008-5-2:2007
01-januar-2007
=DKWHYDQLSRGDWNL]DSROSUHYRGQLãNDLQWHJULUDQDYH]MDGHO3RVHEQH]DKWHYH
LQSULSRURþLOD]DWLSHSROSUHYRGQLãNLKLQWHJULUDQLKYH]LM3ROSUHYRGQLãND
LQWHJULUDQDYH]MDEUH]RKLãMD]GRGDQLPLSULNOMXþQLPLVWUXNWXUDPL
Data requirements for semiconductor die -- Part 5-2: Particular requirements and
recommendations for die types - Bare die with added connection structures
Ta slovenski standard je istoveten z: ES 59008-5-2:2001
ICS:
31.080.01
SIST-TS ES 59008-5-2:2007 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

EUROPEAN SPECIFICATION ES 59008-5-2
SPÉCIFICATION EUROPÉENNE
EUROPÄISCHE SPEZIFIKATION March 2001
English version
Data requirements for semiconductor die
Part 5-2: Particular requirements and recommendations for die types -
Bare die with added connection structures
This European Specification was approved by CENELEC on 2001-02-05.
CENELEC members are required to announce the existence of this ES in the same way as for an EN and to
make the ES available promptly at national level in an appropriate form. It is permissible to keep conflicting
national standards in force.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway,
Portugal, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2001 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. ES 59008-5-2:2001 E

---------------------- Page: 2 ----------------------

ES 59008-5-2:2001 - 2 -
Foreword
This European Specification has been prepared by the CENELEC BTTF 97-1, Known Good Die.
It was submitted to the vote during the meeting of BTTF 97-1 and approved by CENELEC as ES 59008-5-2
on 2001-02-05.
The following date was fixed:
- latest date by which the existence of the ES
has to be announced at national level (doa) 2001-06-01
The structure of this European Specification is as follows:
ES 59008 Data requirements for semiconductor die
Part 1 General requirements
Part 2 Vocabulary
Part 3 Mechanical, material and connectivity requirements
Part 4 Specific requirements and recommendations
Part 4-1 Test and quality
Part 4-2 Handling and storage
Part 4-3 Thermal
Part 4-4 Electrical simulation
Part 5 Particular requirements and recommendations for die types
Part 5-1 Bare die
Part 5-2 Bare die with added connection structures
Part 5-3 Minimally packaged die
Part 6 Exchange data formats and data dictionary
Part 6-1 Data exchange - DDX
Part 6-2 Data dictionary

---------------------- Page: 3 ----------------------

- 3 - ES 59008-5-2:2001
Introduction
This European Specification has been developed to facilitate the selection of unpackaged and
minimally packaged semiconductor die, with or without connection structures in order to save
both design and procurement time.
It is a data specification which defines the requirements of
• product identity,
• product data,
• die mechanical information,
• test, quality and reliability information,
• handling, storage and mounting information,
• thermal data and electrical simulation data.
This document was prepared by CENELEC Task Force CLC/BTTF 97-1 Known Good Die.
Other organisations that helped prepare it were: the ESPRIT GOOD-DIE projects, EECA,
Sematech, DPC and EIAJ.
th
This specification was derived from the work carried out in the ESPRIT 4 Framework project
GOOD-DIE. This project was set up to develop a database for the selection of unpackaged and
minimally packaged semiconductor die, with or without connection structures, and for the
downloading of information to CAD design stations to facilitate the layout and simulation of
MCMs and hybrid circuits. During the early part of the GOOD-DIE project the need was identified
for a standard way of presenting information for the selection and procurement of these
components.

---------------------- Page: 4 ----------------------

ES 59008-5-2:2001 - 4 -
1 Scope
This European Specification specifies requirements for the exchange of data pertaining to bare
semiconductor die with or without connection structures, and minimally-packaged semiconductor
die.
This specification also gives recommendations for general industry good practice for handling
bare die, with or without connection structures and minimally-packaged die.
ES 59008-5-2 specifies particular requirements and recommendations for bare die with
connection structures, such as bumped, flip-chip or TAB mounted die including TCP (Tape
Carrier Package), that are not contained elsewhere in this series of specifications. Bumped die in
wafer form, sawn or unsawn, are included in this part with the exception of information that is
common to die without connection structures that is contained in ES 59008-5-1.
This specification is for use by semiconductor manufacturers, suppliers, die processors and
users of semiconductor die.
ES 59008-5-2 is to be read in conjunction with ES 59008-1, General requirements, and
ES 59008-3, Mechanical, material and connectivity requirements, and, where relevant,
ES 59008-4-1, ES 59008-4-2, ES 59008-4-3 and ES 59008-4-4
2 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of ES 59008-5-2.
ES 59008-1 Data requirements for semiconductor die --Part 1: General requirements
ES 59008-2 Part 2: Vocabulary
ES 59008-3 Part 3: Mechanical, material and connectivity requirements
ES 59008-4-1 Part 4-1: Specific requirements and recommendations – Test and quality
ES 59008-4-2 Part 4-2: Specific requirements and recommendations – Handling, assembly and
storage
ES 59008-4-3 Part 4-3: Specific requirements and recommendations – Thermal
ES 59008-4-4 Part 4-4: Specific requirements and recommendations – Electrical simulation
EIA/JESD49 Procurement standard for Known Good Die (KGD) February 1996
FED-STD-209 Clean room and workstation requirements, controlled environments
3 Definitions
For the purposes of this European Specification, the definitions given in ES 59008-2,
Vocabulary, shall apply. In addition the following terms are used in this document.
3.1 Anisotropic Conductive Film (ACF)
conductive polymer material which, when processed, is conductive only in the vertical or 'Z'
direction. Also known as 'Z axis material'

---------------------- Page: 5 ----------------------

- 5 - ES 59008-5-2:2001
3.2 Chip on Film, Foil or Flex (COF)
semiconductor die mounted on a flexible lead-frame, similar to TAB, where bumped die are flip-
chip bonded to a flexible substrate, which may be continuous. This could also be a complete
circuit i.e. Radio Frequency Identification Tag
3.3 Direct Chip Attach (DCA)
combined attachment and connection of a semiconductor die, active side down, to the surface on
which it is mounted
3.4 Tape Carrier Package (TCP)
semiconductor die, mounted in a similar manner to TAB, where bumped die are inner-lead
bonded to a lead frame in a cutout in a tape
3.5 underfill
material used to fill the void between a flip-chip die and the surface on which it is mounted. This
may be applied either before or after flip-chip mounting and may prevent the ingress of
contaminants, aid heat dissipation, alleviate mismatch in thermal coefficients of expansion and
can also act as an adhesive
4 Conformity levels
Conformity levels generally do not apply to this part of ES 59008. However, where any item in
this part of the standard is already covered by ES 59008-3, ES 59008-4-1, ES 59008-4-2,
ES 59008-4-3 or ES 59008-4-4, then the conformity requirement, as detailed, shall apply. This
part provides recommendations for good industry practice when exchanging information about
die. All information specific to a bare die or wafer form is included in this part and should be
used as a basis for a detailed supplier or user specification.
5 Specific recommendations – Test and quality
5.1 General
This clause contains classes of information specifically related to the testing performed on the
die by the supplier or related to the quality of the die supplied.
5.2 Probing of bumped or TAB die
Recommendations for probe-testing bumped or TAB die, especially where the bump or TAB lead
could be damaged by incorrect probing. This should also include information for r
...