Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors

is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.

Direkt geheizte temperaturabhängige Widerstände mit negativem Temperaturkoeffizienten - Teil 2: Rahmenspezifikation - Oberflächenmontierbare temperaturabhängige Widerstände mit negativem Temperaturkoeffizienten

Thermistors à coefficient de température négatif à chauffage direct - Partie 2: Spécification intermédiaire - Montage en surface de thermistors à coefficient de température négatif

is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.

Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors (IEC 60539-2:2003)

Ta del IEC 60539 velja za neposredno ogrevane termistorje z negativnim temperaturnim koeficientom za površinsko montažo, običajno izdelanimi iz materialov iz oksidov prehodnih kovin z polprevodniškimi lastnostmi. Ti termistorji imajo metalizirane priključne ploskve ali trakove za mehko spajkanje in so namenjeni za vgradnjo naravnost na substrate za hibridna vezja ali na tiskane plošče.

General Information

Status
Withdrawn
Publication Date
09-Feb-2004
Current Stage
6060 - Document made available
Start Date
10-Feb-2004
Completion Date
10-Feb-2004

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SLOVENSKI SIST EN 60539-2:2004
STANDARD
julij 2004
Directly heated negative temperature coefficient thermistors - Part 2: Sectional
specification - Surface mount negative temperature coefficient thermistors (IEC
60539-2:2003)
ICS 31.040.30 Referenčna številka
SIST EN 60539-2:2004(en)

© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

---------------------- Page: 1 ----------------------
EUROPEAN STANDARD EN 60539-2
NORME EUROPÉENNE
EUROPÄISCHE NORM February 2004
ICS 31.040.30
English version
Directly heated negative temperature coefficient thermistors
Part 2: Sectional specification -
Surface mount negative temperature coefficient thermistors
(IEC 60539-2:2003)
Thermistors à coefficient de température Direkt geheizte temperaturabhängige
négatif à chauffage direct Widerstände mit negativem
Partie 2: Spécification intermédiaire - Temperaturkoeffizienten
Montage en surface de thermistors Teil 2: Rahmenspezifikation -
à coefficient de température négatif Oberflächenmontierbare
(CEI 60539-2:2003) temperaturabhängige Widerstände
mit negativem Temperaturkoeffizienten
(IEC 60539-2:2003)

This European Standard was approved by CENELEC on 2004-02-01. CENELEC members are bound to

comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European

Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on

application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other

language made by translation under the responsibility of a CENELEC member into its own language and

notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech

Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,

Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60539-2:2004 E
---------------------- Page: 2 ----------------------
EN 60539-2:2004 - 2 -
Foreword

The text of document 40/1346/FDIS, future edition 1 of IEC 60539-2, prepared by IEC TC 40,

Capacitors and resistors for electronic equipment, was submitted to the IEC-CENELEC parallel vote

and was approved by CENELEC as EN 60539-2 on 2004-02-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-11-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2007-02-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice

The text of the International Standard IEC 60539-2:2003 was approved by CENELEC as a European

Standard without any modification.
__________
---------------------- Page: 3 ----------------------
- 3 - EN 60539-2:2004
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated

references, only the edition cited applies. For undated references, the latest edition of the referenced

document (including any amendments) applies.

NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.
Publication Year Title EN/HD Year
IEC 60068-2-2 1974 Basic environmental testing procedures EN 60068-2-2 1993
Part 2: Tests - Tests B: Dry heat
A1 1993 A1 1993
A2 1994 A2 1994
IEC 60068-2-14 1984 Part 2: Tests - Test N: Change of
temperature
+ A1 1986 EN 60068-2-14 1999
IEC 60068-2-30 1980 Part 2: Tests - Test Db and guidance:
Damp heat, cyclic (12 + 12 hour cycle)
+ A1 1985 EN 60068-2-30 1999
IEC 60068-2-58 1999 Part 2-58: Tests - Test Td: Test EN 60068-2-58 1999
methods for solderability, resistance to
dissolution of metallization and to
soldering heat of surface mounting
devices (SMD)
2) 3)
IEC 60068-2-78 - Part 2-78: Tests - Test Cab: Damp heat, EN 60068-2-78 2001
steady state
IEC 60410 1973 Sampling plans and procedures for - -
inspection by attributes
IEC 60539-1 2002 Directly heated negative temperature EN 60539-1 2002
coefficient thermistors
Part 1: Generic specification
EN 60068-2-2 includes supplement A:1976 to IEC 60068-2-2.
Undated reference.
Valid edition at date of issue.
---------------------- Page: 4 ----------------------
INTERNATIONAL IEC
STANDARD
60539-2
First edition
2003-11
Directly heated negative temperature
coefficient thermistors –
Part 2:
Sectional specification –
Surface mount negative temperature
coefficient thermistors
© IEC 2003 ⎯ Copyright - all rights reserved

No part of this publication may be reproduced or utilized in any form or by any means, electronic or

mechanical, including photocopying and microfilm, without permission in writing from the publisher.

International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland

Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch

PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
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For price, see current catalogue
---------------------- Page: 5 ----------------------
– 2 – 60539-2 © IEC:2003(E)
CONTENTS

FOREWORD .......................................................................................................................... 4

1 General ........................................................................................................................... 6

1.1 Scope ..................................................................................................................... 6

1.2 Normative references ............................................................................................. 6

1.3 Information to be given in a detail specification....................................................... 6

1.3.1 Outline drawing and dimensions ................................................................. 7

1.3.2 Mounting..................................................................................................... 7

1.3.3 Ratings and characteristics......................................................................... 7

1.4 Terminology............................................................................................................ 7

2 Preferred ratings and characteristics................................................................................ 7

2.1 Tolerances on rated zero-power resistance ............................................................ 7

2.2 Climatic categories ................................................................................................. 7

3 Quality assessment procedures ....................................................................................... 8

3.1 Primary stage of manufacture ................................................................................. 8

3.2 Structurally similar components .............................................................................. 8

3.3 Qualification approval procedures........................................................................... 8

3.3.1 The manufacturer shall comply with 3.4 of IEC 60539-1.............................. 8

3.4 Quality conformance inspection .............................................................................. 8

3.4.1 Qualification approval on the basis of the fixed sample size

procedure ................................................................................................... 8

3.5 Quality conformance inspection .............................................................................10

3.5.1 Formation of inspection lots .......................................................................10

3.5.2 Test schedule ............................................................................................11

3.5.3 Delayed delivery ........................................................................................11

3.5.4 Assessment level.......................................................................................11

4 Test and measurement procedures .................................................................................12

4.1 Mounting ...............................................................................................................12

4.2 Drying and recovery...............................................................................................12

4.2.1 Drying........................................................................................................12

4.2.2 Recovery ...................................................................................................12

4.3 Visual examination and check of dimensions .........................................................12

4.3.1 Visual examination.....................................................................................12

4.3.2 Requirements ............................................................................................12

4.3.3 Marking......................................................................................................14

4.3.4 Dimensions................................................................................................14

4.4 Electrical tests .......................................................................................................14

4.4.1 Zero-power resistance ...............................................................................14

4.4.2 B-value or resistance ratio .........................................................................14

4.4.3 Resistance/temperature characteristic .......................................................15

4.5 Thermal tests.........................................................................................................15

4.5.1 Dissipation factor (δ)..................................................................................15

4.5.2 Thermal time constant by cooling after self-heating (τ ).............................15

---------------------- Page: 6 ----------------------
60539-2 © IEC:2003(E) – 3 –

4.6 Resistance to soldering heat .................................................................................15

4.6.1 Initial measurement ...................................................................................15

4.6.2 Test conditions ..........................................................................................15

4.6.3 Recovery ...................................................................................................16

4.6.4 Final inspection, measurements and requirements ....................................16

4.7 Solderability ..........................................................................................................16

4.7.1 Test conditions ..........................................................................................16

4.7.2 Recovery ...................................................................................................17

4.7.3 Final inspection, measurements and requirements ....................................17

4.8 Rapid change of temperature ................................................................................17

4.9 Thermal shock.......................................................................................................17

4.10 Climatic sequence .................................................................................................18

4.10.1 Initial measurements .................................................................................18

4.10.2 Dry heat ....................................................................................................18

4.10.3 Damp heat (cyclic), first cycle....................................................................18

4.10.4 Cold ..........................................................................................................18

4.10.5 Damp heat (cyclic), remaining cycles.........................................................18

4.10.6 Final measurements ..................................................................................19

4.11 Damp heat, steady state........................................................................................19

4.12 Endurance.............................................................................................................19

4.12.1 Endurance at θ and P .......................................................................19

3 max.

4.12.2 Endurance at upper category temperature .................................................19

4.13 Shear (adhesion) test ............................................................................................20

4.14 Substrate bending test ..........................................................................................20

4.15 Component solvent resistance...............................................................................20

4.16 Solvent resistance of marking................................................................................20

Annex A (normative) Guide for the specification and coding of dimensions of surface

mount negative temperature coefficient thermistors ..............................................................21

Table 1 – Upper and lower category temperatures and duration of the damp heat test............8

Table 2 – Fixed sample size test schedule for qualification approval of surface mount

negative temperature coefficient thermistors Assessment level EZ .......................................10

Table 3 – Lot-by-lot inspection..............................................................................................11

Table 4 – Periodic test ..........................................................................................................12

Table 5 – Number of cycles ..................................................................................................18

Table A.1 – Dimensions ........................................................................................................21

Figure 1 – Fault: fissure or defect .........................................................................................13

Figure 2 – Fault: crack ..........................................................................................................13

Figure 3 – Separation or delamination ..................................................................................13

Figure 4 – Exposed electrodes..............................................................................................13

Figure 5 – Principal faces .....................................................................................................14

Figure A.1 – Dimensioning of surface mount thermistors.......................................................21

---------------------- Page: 7 ----------------------
– 4 – 60539-2 © IEC:2003(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DIRECTLY HEATED NEGATIVE TEMPERATURE
COEFFICIENT THERMISTORS –
Part 2: Sectional specification –
Surface mount negative temperature coefficient thermistors
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any

equipment declared to be in conformity with an IEC Publication.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60539-2 has been prepared by IEC technical committee 40:

Capacitors and resistors for electronic equipment.
The text of this standard is based on the following documents:
FDIS Report on voting
40/1346/FDIS 40/1368/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

---------------------- Page: 8 ----------------------
60539-2 © IEC:2003(E) – 5 –

The committee has decided that the contents of this publication will remain unchanged until

2008. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual edition of this document may be issued at a later date.
---------------------- Page: 9 ----------------------
– 6 – 60539-2 © IEC:2003(E)
DIRECTLY HEATED NEGATIVE TEMPERATURE
COEFFICIENT THERMISTORS –
Part 2: Sectional specification –
Surface mount negative temperature coefficient thermistors
1 General
1.1 Scope

This part of IEC 60539 is applicable to surface mount directly heated negative temperature

coefficient thermistors, typically made from transition metal oxide materials with

semiconducting properties. These thermistors have metallized connecting pads or soldering

strips and are intended to be mounted directly on to substrates for hybrid circuits or on to

printed boards.
1.2 Normative references

The following referenced documents are indispensable for the application of this document.

For dated references, only the edition cited applies. For undated references, the latest edition

of the referenced document (including any amendments) applies.
IEC 60068-2-2:1974, Environmental testing – Part 2: Tests – Tests B: Dry heat
Amendment 1 (1993)
Amendment 2 (1994)

IEC 60068-2-14:1984, Environmental testing – Part 2: Tests – Test N: Change of temperature

Amendment 1 (1986)

IEC 60068-2-30:1980, Environmental testing – Part 2: Tests – Test Db and guidance: Damp

heat, cyclic (12 + 12-hour cycle)
Amendment 1 (1985)

IEC 60068-2-58:1999, Environmental testing – Part 2-58: Tests – Test Td: Test methods for

solderability, resistance to dissolution of metallization and to soldering heat of surface

mounting devices (SMD)

IEC 60068-2-78: Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady

state
IEC 60410:1973, Sampling plans and procedures for inspection by attributes

IEC 60539-1:2002, Directly heated negative temperature coefficient thermistors – Part 1:

Generic specification
1.3 Information to be given in a detail specification

Detail specifications shall be derived from the relevant blank detail specification.

Detail specifications shall not specify requirements inferior to those of the generic, sectional

or blank detail specification. When more severe requirements are included, they shall be

listed in 1.9 of the detail specification and indicated in the test schedules, for example, by an

asterisk.
---------------------- Page: 10 ----------------------
60539-2 © IEC:2003(E) – 7 –

NOTE The information given in 1.3.1 may for convenience, be presented in tabular form.

The following information shall be given in each detail specification and the values quoted

shall preferably be selected from those given in the appropriate clause of this sectional

specification.
1.3.1 Outline drawing and dimensions

There shall be an illustration of the thermistor as an aid to easy recognition and for

comparison with others. Dimensions and their associated tolerances, which affect inter-

changeability and mounting, shall be given in the detail specification. All dimensions shall

preferably be stated in millimetres; however, when the original dimensions are given in

inches, the converted metric dimensions in millimetres shall be added.

Normally, the numerical values shall be given for the length, width and height of the body.

When necessary, for example when a number of items are covered by a detail specification,

the dimensions and their associated tolerances shall be placed in a table below the drawing.

When the configuration is other than described above, the detail specification shall state such

dimensional information as will adequately describe the thermistor.
1.3.2 Mounting

The detail specification shall give guidance on methods of mounting for normal use. Mounting

for test and measurement purposes (when required) shall be in accordance with 4.27 of

IEC 60539-1.
1.3.3 Ratings and characteristics
1.3.3.1 Particular characteristics

Additional characteristics may be listed when they are considered necessary to specify the

component adequately for design and application purposes.
1.3.3.2 Marking
See 2.4 of IEC 60539-1.
1.4 Terminology
See 2.2 of IEC 60539-1.
2 Preferred ratings and characteristics
2.1 Tolerances on rated zero-power resistance
Preferred values of tolerances on zero-power resistance are:
±1 %, ±2 %, ±3 %, ±5 %, ±10 %.
2.2 Climatic categories

The upper and lower category temperatures and the duration of the damp-heat steady-state

test shall be selected from Table 1.
---------------------- Page: 11 ----------------------
– 8 – 60539-2 © IEC:2003(E)

Table 1 – Upper and lower category temperatures and duration of the damp heat test

Lower category temperature
–55, –40, –25, –10, –5, +5
Upper category temperature
70, 85, 100, 105, 125, 150, 155
Damp heat, steady state
21, 42, 56
days
The detail specification shall prescribe the appropriate category.
3 Quality assessment procedures
3.1 Primary stage of manufacture

The primary stage of manufacture is defined as the initial mixing process of ingredients.

3.2 Structurally similar components

Surface mount thermistors may be grouped as structurally similar for the purpose of forming

inspection lots provided that the requirements of 3.1 of IEC 60539-1 are met, with the

following addition.

For the shear test and the substrate bending test, devices may be grouped if they have been

made on the same production line, have the same dimensions, internal structure and external

finish.
3.3 Qualification approval procedures
3.3.1 The manufacturer shall comply with 3.4 of IEC 60539-1.
3.4 Quality conformance inspection

Blank detail specifications associated with this specification shall prescribe the test schedule

for quality conformance inspection.

This schedule shall also specify the grouping, sampling and periodicity for the lot-by-lot and

periodic inspection.

Inspection levels and sampling plans shall be selected from those given in IEC 60410.

If required, more then one test schedule may be specified.
3.4.1 Qualification approval on the basis of the fixed sample size procedure
a) Sampling

The sample shall be representative of the range of thermistors for which approval is sought.

This may or may not be the complete range covered by the detail specification.

The sample shall consist of specimens having the lowest, highest and middle-rated zero-

power resistance of each case size.
---------------------- Page: 12 ----------------------
60539-2 © IEC:2003(E) – 9 –

Per value, three spare specimens are permitted and may be used as replacements for

specimens which are defective because of incidents not attributable to the manufacturer.

b) Tests

The complete series of tests specified in Table 2 are required for the approval of thermistors

covered by one detail specification. The tests of each group shall be carried out in the order

given.

The whole sample shall be subjected to the tests of Group "0" and then divided for the other

groups.

Specimens found defective during the tests of Group "0" shall not be used for the other

groups.

"One defective" is counted when a thermistor has not satisfied the whole or a part of the tests

of a group.

Approval is granted when the number of non-conformances does not exceed the specified

number of permissible defects for each group or subgroup.

The conditions of test and performance requirements for the fixed sample size schedule shall

be identical to those described in the detail specification for quality conformance inspection.

---------------------- Page: 13 ----------------------
– 10 – 60539-2 © IEC:2003(E)

Table 2 – Fixed sample size test schedule for qualification approval of surface mount

negative temperature coefficient thermistors
Assessment level EZ
a) b)
Group Test Subclause Conditions of test and n c
No. of this requirements
publication
0 Visual examination 4.3.1 See 4.3.1 to 4.3.2 90 0
Marking 4.3.3
Dimensions (gauging) 4.3.4 For requirements, see Table A.1
Zero-power resistance 4.4.1
1 Dimensions (detail) 4.3.4 For requirements, see Table A.1 10 0
B-value or resistance ratio 4.4.2 Choice to be made in the detail
specification
Resistance/temperature 4.4.3 Measuring temperatures to be
characteristic defined in the detail specification
Resistance to soldering heat – 4.6 See 4.6
dissolution of metallization
2 Solderability 4.7 See 4.7.1 to 4.7.3 10 0
Solvent resistance of marking 4.16
3 Resistance to soldering heat – 4.6 See 4.6.1 to 4.6.4 10 0
dewetting
4 Mounting 4.1 60 0
Visual examination 4.3.1
Zero-power resistance 4.4.1
4.1 Dissipation factor 4.5.1 10 0
Thermal time constant by cooling 4.5.2
after self-heating (τ )
4.2 Shear test 4.13 10 0
Rapid change of temperature 4.8
Climatic sequence 4.10
4.3 Damp heat, steady state 4.11 10 0
4.4 4.12.1 10 0
Endurance at θ and P
3 max
4.5 Endurance at upper category 4.12.2 10 0
temperature
5 Substrate bending test 4.14 10 0
Number of specimens to be tested.
Permissible numbers of non-conforming items.
3.5 Quality conformance inspection
3.5.1 Formation of inspection lots
a) Groups A and B inspection
These tests shall be carried out on a lot-by-lot basis.

A manufacturer may aggregate the current production into inspection lots subject to the

following safeguards:

a) the inspection lot shall consist of structurally similar thermistors (see 3.2);

---------------------- Page: 14 ----------------------
60539-2 © IEC:2003(E) – 11 –

b) for Group A the sample tested shall consist of each of the values and each of the

dimensions contained in the inspection lot
– in relation to their number;
– with a minimum of five of any one value;

c) if there are less than five of any one value in the sample, the basis for the drawing of

samples shall be agreed upon between the manufacturer and the National Supervising

Inspectorate;
d) Group C inspection.
These tests shall be carried out on a periodic basis.

Samples shall be representative of the current production of the specified periods and shall

be divided into small, medium and large sizes. In order to cover the range of approvals in any

period, one rated zero
...

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