EN 62194:2005
(Main)Method of evaluating the thermal performance of enclosures
Method of evaluating the thermal performance of enclosures
Provides a method of thermal performance evaluation for empty indoor enclosures according to EN 60917 and EN 60297, and, for outdoor enclosures according to EN 61969. Provides criteria to determine the thermal absorption factors relating to principles of enclosure design; internal heat load; sun radiation.
Verfahren zur Bewertung der Wärmeleistung von Gehäusen
Méthode d'évaluation de la performance thermique des enveloppes
Fournit une méthode d'évaluation de la performance thermique dans les enveloppes d'intérieur conformément à la EN 60917, la EN 60297 et, pour les enveloppes d'extérieur, conformément à la EN 61969. Fournit des critères pour la détermination des facteurs d'absorption thermique se rapportant: aux principes de conception d'enveloppe; à la puissance thermique interne; au rayonnement solaire.
Metoda vrednotenja toplotnih lastnosti ohišij (IEC 62194:2005)
General Information
Standards Content (Sample)
SLOVENSKI SIST EN 62194:2006
STANDARD
februar 2006
Metoda vrednotenja toplotnih lastnosti ohišij (IEC 62194:2005)
Method of evaluating the thermal performance of enclosures (IEC 62194:2005)
ICS 31.240 Referenčna številka
© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno
EUROPEAN STANDARD EN 62194
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2005
ICS 31.240
English version
Method of evaluating the thermal performance of enclosures
(IEC 62194:2005)
Méthode d'évaluation de la performance Verfahren zur Bewertung
thermique des enveloppes der Wärmeleistung von Gehäusen
(CEI 62194:2005) (IEC 62194:2005)
This European Standard was approved by CENELEC on 2005-09-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62194:2005 E
Foreword
The text of document 48D/324/FDIS, future edition 1 of IEC 62194, prepared by SC 48D, Mechanical
structures for electronic equipment, of IEC TC 48, Electromechanical components and mechanical
structures for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 62194 on 2005-09-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2006-06-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2008-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62194:2005 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60297-2 NOTE Harmonized as HD 493.2 S1:1988 (not modified).
IEC 60721 NOTE Harmonized in EN 60721 series (not modified).
IEC 60917-2 NOTE Harmonized as EN 60917-2:1994 (not modified).
IEC 61587-1 NOTE Harmonized as EN 61587-1:1999 (not modified).
IEC 61969-1 NOTE Harmonized as EN 61969-1:2000 (not modified).
IEC 61969-2 NOTE Harmonized as EN 61969-2:2000 (not modified).
IEC 61969-3 NOTE Harmonized as EN 61969-3:2001 (not modified).
__________
- 3 - EN 62194:2005
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60297 Series Mechanical structures for electronic EN 60297 Series
equipment - Dimensions of mechanical
structures of the 482,6 mm (19 in) series
1) 2)
IEC 60721-2-4 - Classification of environmental conditions HD 478.2.4 S1 1989
Part 2: Environmental conditions
appearing in nature - Solar radiation and
temperature
IEC 60917 Series Modular order for the development of EN 60917 Series
mechanical structures for electronic
equipment practices
IEC 61969 Series Mechanical structures for electronic EN 61969 Series
equipment - Outdoor enclosures
1)
Undated reference.
2)
Valid edition at date of issue.
NORME CEI
INTERNATIONALE
IEC
INTERNATIONAL
Première édition
STANDARD
First edition
2005-08
Méthode d'évaluation de la performance
thermique des enveloppes
Method of evaluating the thermal
performance of enclosures
IEC 2005 Droits de reproduction réservés Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
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Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
CODE PRIX
V
PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue
62194 ¤ IEC:2005 – 3 –
CONTENTS
FOREWORD.7
INTRODUCTION . 11
1 Scope. 13
2 Normative references. 13
3 Terms, definitions, symbols and abbreviations. 15
3.1 Definition of enclosure design principles. 15
3.2 Symbols and abbreviated terms. 15
4 Flow chart for establishing the absorption factor . 19
5 Evaluation of the heat load . 21
6 Environmental conditions. 21
6.1 Outdoor applications . 21
6.2 Indoor applications. 23
7 Determination of the enclosure absorption factor . 23
7.1 Measurement set-up. 23
7.2 Calculation . 27
8 Result and presentation . 27
8.1 Comparison of different enclosure designs . 27
8.2 Heat transfer through walls . 29
8.3 Airflow between walls . 31
8.4 Results for single-wall enclosures. 33
8.5 Results for double-wall enclosures (simple method). 35
Annex A (normative) Heat transfer rate. 39
Annex B (informative) Geometric relations for solar radiation . 41
Annex C (informative) Example for single and double wall calculation. 45
Annex D (informative) Iteration method for exact results of a double wall enclosure . 49
Bibliography. 61
Figure 1 – Enclosure types. 15
Figure 2 – Flow chart for establishing the absorption factor. 19
Figure 3 – Example of measurement set-up for enclosure absorption factor. 25
Figure 4 – Heat transfer through walls . 29
Figure 5 – Airflow between walls . 33
Figure B.1 – Geometric angles for solar radiation impact . 41
Figure D.1 – Thermal model for double wall enclosure. 49
Figure D.2 – Iteration procedure for double-wall enclosures. 53
62194 ¤ IEC:2005 – 5 –
Table 1 – Convection heat transfer coefficients. 23
Table 2 – Parameters for single-wall enclosure calculation . 35
Table 3 – Parameters for double-wall enclosure calculation (simple method) . 37
Table C.1 – Given parameters for single-wall enclosure calculation . 45
Table C.2 – Given parameters for double-wall enclosure calculation (simple method). 47
Table D.1 – Given parameters for double wall enclosure calculation . 57
Table D.2 – Starting values for iterations . 57
Table D.3 – Results after first iteration block . 57
Table D.4 – Results after second iteration block . 59
62194 ¤ IEC:2005 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
METHOD OF EVALUATING THE THERMAL
PERFORMANCE OF ENCLOSURES
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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agreement between the two organizations.
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consensus of opinion on the relevant subjects since each technical committee has representation from all
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62194 has been prepared by subcommittee 48D: Mechanical
structures for electronic equipment, of IEC technical committee 48: Electromechanical
components and mechanical structures for electronic equipment.
The text of this standard is based on the following documents:
FDIS Report on voting
48D/324/FDIS 48D/328/RVD
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