EN 61188-5-8:2008

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

Provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.

Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 5-8: Betrachtungen zur Montage (Anschlussfläche/Verbindung) - Flächenmatrix-Bauelemente (BGA, FBGA, CGA, LGA)

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-8: Considérations sur les liaisons pistes-soudures - Composants matriciels (BGA, FBGA, CGA, LGA)

La CEI 61188-5-8:2007 fournit des informations sur la géométrie des plages d'accueil utilisées pour la fixation en surface des composants électroniques à sorties matricielles de forme de boules de brasure, de colonnes de brasure ou de pastilles recouvertes d'une protection. Le but des informations indiquées dans la présente norme est de fournir les dimensions, formes et tolérances appropriées des plages d'accueil pour montage en surface afin de garantir une surface suffisante pour le raccord de brasure et pour permettre l'inspection, la mise en essai et les retouches des joints de brasure. Cette publication doit être lue conjointement avec la CEI 61188-5-1:2002.

Tiskane plošče in sestavi tiskanih plošč - Načrtovanje in uporaba - 5-8. del: Pregledovanje povezav (ploskev/stik) - Nizi ploskovnih komponent (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007)

General Information

• Status: Published
• Publication Date: 20-Mar-2008
• Withdrawal Date: 31-Jan-2011
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 21-Mar-2008
• Due Date: 21-Mar-2008
• Completion Date: 21-Mar-2008
• Ref Project: SIST EN 61188-5-8:2008 - Printed boards and printed board assemblies - Design and use -- Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2008
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3UHJOHGRYDQMHSRYH]DYSORVNHYVWLN1L]LSORVNRYQLKNRPSRQHQW%*$)%*$
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Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment
(land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 5-8:
Betrachtungen zur Montage (Anschlussfläche/Verbindung) - Flächenmatrix-Bauelemente
(BGA, FBGA, CGA, LGA)
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-8:
Considérations sur les liaisons pistes-soudures - Composants matriciels (BGA, FBGA,
CGA, LGA)
Ta slovenski standard je istoveten z: EN 61188-5-8:2008
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 61188-5-8
NORME EUROPÉENNE
March 2008
EUROPÄISCHE NORM
ICS 31.180
English version
Printed boards and printed board assemblies -
Design and use -
Part 5-8: Attachment (land/joint) considerations -
Area array components (BGA, FBGA, CGA, LGA)
(IEC 61188-5-8:2007)
Cartes imprimées  Leiterplatten und Flachbaugruppen -
et cartes imprimées équipées - Konstruktion und Anwendung -
Conception et utilisation - Teil 5-8: Betrachtungen zur Montage
Partie 5-8: Considérations sur les liaisons (Anschlussfläche/Verbindung) -
pistes-soudures - Flächenmatrix-Bauelemente
Composants matriciels (BGA, FBGA, CGA, LGA)
(BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007)
(CEI 61188-5-8:2007)
This European Standard was approved by CENELEC on 2008-02-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2008 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61188-5-8:2008 E
Foreword
The text of document 91/705/FDIS, future edition 1 of IEC 61188-5-8, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61188-5-8 on 2008-02-01.
This European Standard is to be read in conjunction with EN 61188-5-1.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-11-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2011-02-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61188-5-8:2007 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 61191-1 NOTE Harmonized as EN 61191-1:1998 (not modified).
__________
– 3 – EN 61188-5-8:2008
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60068-2-58 – Environmental testing - EN 60068-2-58 2004
Part 2-58: Tests - Test Td: Test methods + corr. December 2004
for solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60191-2 Series Mechanical standardization of – –
semiconductor devices -
Part 2: Dimensions
1) 2)
IEC 61188-5-1 – Printed boards and printed board EN 61188-5-1 2002
assemblies - Design and use -
Part 5-1: Attachment (land/joint)
considerations - Generic requirements

1) 2)
IEC 62090 – Product package labels for electronic EN 62090 2003
components using bar code and two-
dimensional symbologies
1)
Undated reference.
2)
Valid edition at date of issue.

IEC 61188-5-8
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
Printed boards and printed board assemblies – Design and use –
Part 5-8: Attachment (land/joint) considerations – Area array components (BGA,
FBGA, CGA, LGA)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
U
ICS 31.180 ISBN 2-8318-9343-7
– 2 – 61188-5-8 © IEC:2007(E)
CONTENTS
FOREWORD.04
INTRODUCTION.1H1H6

1 Scope.2H2H7
2 Normative references .3H3H7
3 General information.4H4H8
3.1 General component description .5H5H8
3.2 Marking .6H6H8
3.3 Carrier packaging format .7H7H9
3.4 Process considerations .8H8H9
4 BGA (square) .9H9H9
4.1 Field of application .10H10H9
4.2 Component descriptions .11H11H9
4.2.1 Basic construction .12H12H9
4.2.2 Termination materials .13H13H10
4.2.3 Marking .14H14H11
4.2.4 Carrier package format .15H15H11
4.2.5 Process considerations.16H16H11
4.3 Component dimensions (square) .17H17H11
4.3.1 PBGA 1,5 mm pitch component dimensions (square).18H18H12
4.3.2 PBGA 1,27 mm pitch component dimensions (square).19H19H14
4.3.3 PBGA 1,00 mm pitch component dimensions (square).20H20H15
4.4 Solder joint fillet design .21H21H17
4.4.1 Solder joint fillet design – Non-collapsing, collapsing (level 3) .22H22H17
4.5 Land pattern dimensions .23H23H18
4.5.1 PBGA 1,5 mm pitch land pattern dimensions (square) .24H24H19
4.5.2 PBGA 1,27 mm pitch land pattern dimensions (square) .25H25H21
4.5.3 PBGA 1,00 mm pitch land pattern dimensions (square) .26H26H23
5 FBGA (square) .27H27H25
6 BGA (rectangular) .28H28H25
6.1 Field of application .29H29H25
6.2 Component descriptions .30H30H25
6.2.1 Basic construction .31H31H25
6.2.2 Termination materials .32H32H25
6.2.3 Marking .33H33H26
6.2.4 Carrier package format .34H34H26
6.2.5 Process considerations.35H35H26
6.3 Component dimensions (rectangular) .36H36H26
6.4 Solder joint fillet design .37H37H27
6.4.1 Solder joint fillet design – Collapsing (level 3) .38H38H27
6.4.2 Land approximation .39H39H28
6.4.3 Total variation .40H40H28
6.5 Land pattern dimensions .41H41H28
7 FBGA (rectangular) .42H42H29
8 CGA .43H43H29
9 LGA.44H44H29

61188-5-8 © IEC:2007(E) – 3 –
Bibliography.45H45H30

Figure 1 – Area array land pattern configuration .46H46H7
Figure 2 – BGA physical configuration examples .47H47H10
Figure 3 – High land and eutectic solder ball and joint comparison .48H48H10
Figure 4 – BGA (square) .49H49H11
Figure 5 – General BGA dimensional characteristics.50H50H12
Figure 6 – Solder joint fillet design.51H51H18
Figure 7 – BGA (square) land pattern dimensions .52H52H19

Table 1 – Ball diameter sizes .53H53H8
Table 2 – BGA products with pitch of 1,5 mm.54H54H13
Table 3 – BGA products with pitch of 1,27 mm.55H55H14
Table 4 – BGA products with pitch of 1,0 mm.56H56H16
Table 5 – BGA product land patterns with pitch of 1,50 mm .57H57H20
Table 6 – BGA product land patterns with pitch of 1,27 mm .58H58H22
Table 7 – BGA product land patterns with pitch of 1,00 mm .59H59H24
Table 8 – Rectangular BGA products with pitch of 1,27 mm .60H60H27
Table 9 – Rectangular BGA product land patterns with pitch of 1,27 mm.61H61H29

– 4 – 61188-5-8 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-8: Attachment (land/joint) considerations –
Area array components (BGA, FBGA, CGA, LGA)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions
...