EN 61760-4:2015/A1:2018

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

Oberflächenmontagetechnik - Teil 4: Klassifikation, Verpackung, Kennzeichnung und Handhabung feuchteempfindlicher Bauteile

Technique du montage en surface (SMT) - Partie 4: Classification, emballage, étiquetage et manipulation des dispositifs sensibles à l'humidité

Tehnologija površinske montaže - 4. del: Razvrščanje, pakiranje, etiketiranje in ravnanje z napravami, občutljivimi na vlago

General Information

• Status: Published
• Publication Date: 03-May-2018
• Withdrawal Date: 16-Apr-2021
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 04-May-2018
• Completion Date: 04-May-2018
• Ref Project: SIST EN 61760-4:2015/A1:2018 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

Relations

• Amends: EN 61760-4:2015 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
• Effective Date: 23-Jan-2023
• Revised: prEN IEC 61760-4:2025 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
• Effective Date: 09-Apr-2024

Overview

EN 61760-4:2015/A1:2018 is a European standard developed by the CLC (European Committee for Electrotechnical Standardization) that focuses on surface mounting technology (SMT)-specifically on the classification, packaging, labelling, and handling of moisture sensitive devices (MSDs). This amendment updates the 2015 edition, aligning with IEC 61760-4:2015/A1:2018 to enhance the management and protection of moisture sensitive electronic components during manufacturing, storage, and transportation.

Moisture sensitivity in surface mount devices poses risks of damage during soldering processes due to moisture-induced failures. This standard sets precise conditions and processes to minimize such risks and ensure product reliability.

Key Topics

• Moisture Sensitivity Classification:
  The standard defines moisture sensitivity levels (MSLs) which classify devices based on their susceptibility to moisture and the allowable floor life once removed from packaging.

• Packaging Requirements:
  Specifies appropriate packaging materials and methods designed to protect MSDs from moisture ingress. Packaging must prevent moisture absorption during storage and transportation.

• Labelling Guidelines:
  Mandates clear and consistent labelling on packaging that indicates moisture sensitivity levels, handling instructions, and shelf life information to inform users and handlers.

• Handling Procedures:
  Establishes best practices for handling MSDs, including time limits for device exposure to ambient conditions before re-baking or repackaging to prevent moisture damage.

• Moisture Soak and Reflow Testing:
  Defines the environmental conditions for moisture soak and requirements for reflow temperature profiles to simulate actual manufacturing conditions and guarantee device robustness.

• Standard Cross-References:
  Incorporates references to related standards such as IEC 60068-2-58:2015 for environmental testing, IEC 60749-20-1 for mechanical and climatic test methods, IEC 61340-5-1 for electrostatic protection, and IPC/JEDEC J-STD-020E for moisture/reflow sensitivity classification.

Applications

EN 61760-4:2015/A1:2018 is vital for:

• Electronics Manufacturers:
  Ensuring components are handled, stored, and processed in accordance with moisture sensitivity classifications reduces defect rates and improves product quality.

• Supply Chain and Packaging Specialists:
  Developing packaging solutions that meet standard requirements guarantees moisture protection throughout distribution.

• Quality Control and Compliance Teams:
  Applying the standard helps maintain conformity with industry regulations and supports traceability and audit processes for SMT components.

• Assembly and Process Engineers:
  Enables design of soldering profiles and workflows that prevent moisture damage during SMT assembly lines.

Related Standards

EN 61760-4:2015/A1:2018 complements and references several key standards enhancing its practical value:

• IEC 60068-2-58:2015 – Environmental testing methods for solderability and resistance to soldering heat for surface mount devices.
• IEC 60749-20-1 – Test methods for mechanical and climatic resistance of plastic encapsulated SMDs.
• IEC 61340-5-1 – General requirements for electrostatic protection of electronic devices.
• IEC 61760-2 – Transportation and storage conditions for surface mounting devices.
• IPC/JEDEC J-STD-020E (2015) – Moisture/Reflow sensitivity classification for nonhermetic solid state surface mount devices.
• J-STD-075:2008 – Classification of non-IC electronic components for assembly processes.

Practical Value

Compliance with EN 61760-4:2015/A1:2018 is critical for mitigating moisture-related failures in SMT components, which can lead to costly rework, reduced reliability, or device failure in electronic products. By following standardized procedures for classification, packaging, labelling, and handling, manufacturers and assemblers ensure:

• Enhanced durability and performance of surface mount devices.
• Reduced risk of moisture-induced solder defects and failures.
• Clear communication of moisture sensitivity information across the supply chain.
• Streamlined quality assurance and regulatory compliance.

This standard is an essential reference for anyone involved in electronic component manufacturing, packaging, storage, or assembly, promoting best practices for moisture management in SMT technology.

Standards Content (Sample)

SLOVENSKI STANDARD
01-oktober-2018
7HKQRORJLMDSRYUãLQVNHPRQWDåHGHO5D]YUãþDQMHSDNLUDQMHHWLNHWLUDQMHLQ
UDYQDQMH]QDSUDYDPLREþXWOMLYLPLQDYODJR
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of
moisture sensitive devices
Oberflächenmontagetechnik - Teil 4: Genormtes Verfahren zur Klassifikation,
Verpackung, Kennzeichnung und Handhabung feuchteempfindlicher Bauteile
Technique du montage en surface (SMT) - Partie 4: Classification, emballage, étiquetage
et manipulation des dispositifs sensibles à l'humidité
Ta slovenski standard je istoveten z: EN 61760-4:2015/A1:2018
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 61760-4:2015/A1

NORME EUROPÉENNE
EUROPÄISCHE NORM
May 2018
ICS 31.190
English Version
Surface mounting technology - Part 4: Classification, packaging,
labelling and handling of moisture sensitive devices
(IEC 61760-4:2015/A1:2018)
Technique du montage en surface (SMT) - Partie 4: Oberflächenmontagetechnik - Teil 4: Klassifikation,
Classification, emballage, étiquetage et manipulation des Verpackung, Kennzeichnung und Handhabung
dispositifs sensibles à l'humidité feuchteempfindlicher Bauteile
(IEC 61760-4:2015/A1:2018) (IEC 61760-4:2015/A1:2018)
This amendment A1 modifies the European Standard EN 61760-4:2015; it was approved by CENELEC on 2018-04-17. CENELEC
members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this amendment the
status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This amendment exists in three official versions (English, French, German). A version in any other language made by translation under the
responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as
the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 61760-4:2015/A1:2018 E

European foreword
The text of document 91/1419/CDV, future edition 1 of IEC 61760-4:2015/A1, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61760-4:2015/A1:2018.

The following dates are fixed:
(dop) 2019-01-17
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2021-04-17
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 61760-4:2015/A1:2018 was approved by CENELEC as a
European Standard without any modification.
Replace the Bibliography of EN 61760-4:2015 by the following:

In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-2-58:2015 NOTE Harmonized as EN 60068-2-58:2015 (not modified).
IEC 60068-2-78 NOTE Harmonized as EN 60068-2-78.
IEC 60749-20-1 NOTE Harmonized as EN 60749-20-1.
ISO 62 NOTE Harmonized as EN ISO 62.
Replace Annex ZA of EN 61760-4:2015 by the following:

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-1 -  Environmental testing -- Part 1: General EN 60068-1 -
and guidance
IEC 60749-20 -  Semiconductor devices - Mechanical and EN 60749-20 -
climatic test methods -- Part 20:
Resistance of plastic encapsulated SMDs
to the combined effect of moisture and
soldering heat
IEC 61340-5-1 -  Electrostatics - Part 5-1: Protection of EN 61340-5-1 -
electronic devices from electrostatic
phenomena - General requirements
...