EN IEC 62878-2-602:2021

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.

Montageverfahren für eingebettete Bauteile – Teil 2-602: Leitfaden für gestapelte Elektronikmodule – Verfahren zur Beurteilung der elektrischen Verbindungsfähigkeit zwischen den Modulen

Techniques d’assemblage avec appareil(s) intégré(s) - Partie 2-602: Lignes directrices pour un empilement de modules électroniques - Méthode d’évaluation de la connectivité électrique entre modules

L'IEC 62878-2-602:2021 spécifie les exigences et les méthodes d’évaluation de la connectivité électrique. Il s’applique aux empilements de modules électroniques.

Tehnologija sestavov z vdelanimi elementi - 2-602. del: Smernice za zložene elektronske module - Metode vrednotenja vmesnih modulov električne povezljivosti

General Information

• Status: Published
• Publication Date: 12-Aug-2021
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 13-Aug-2021
• Completion Date: 13-Aug-2021
• Ref Project: SIST EN IEC 62878-2-602:2021 - Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

Overview

EN IEC 62878-2-602:2021 addresses the essential requirements and evaluation methods for assessing the electrical connectivity between stacked electronic modules. Published by the European Committee for Electrotechnical Standardization (CENELEC/CLC), and harmonized with IEC 62878-2-602, this standard provides practical guidelines for device-embedding assembly technology, focusing on robust inter-module electrical performance-a critical factor in modern high-density electronic assemblies.

The standard targets manufacturers, quality engineers, and researchers engaged in the design, assembly, and testing of complex three-dimensional (3D) electronic modules. These modules are vital to high-end servers, network systems, IoT devices, and next-generation smart electronics, where miniaturization, performance, and reliability are paramount.

Key Topics

• Stacked Electronic Modules:
  The document defines and provides context for "stacked electronic modules," assemblies where multiple functional blocks are vertically integrated to achieve high component density and functionality.
• Evaluation Methods:
  Specific procedures are outlined for measuring inter-module electrical connectivity, including the use of four-terminal resistance measurement methods, which enable precise assessment of low-resistance interconnects.
• Test Apparatus and Specimens:
  Requirements for the test environment, including digital multimeters, constant-current power supplies, micro probers, and X-Y stages, are specified. Guidance is given for the preparation of test specimens, typically consisting of daisy-chained modules to simulate inter-module connectivity.
• Assembly Methods:
  Annexed informative sections illustrate common stacking assembly techniques, such as lead-free soldering, isotropic and anisotropic adhesive methods, and insulation adhesives, reflecting current manufacturing practices.

Applications

The guidelines and evaluation methodologies described in EN IEC 62878-2-602:2021 have practical applications across industries that depend on:

• Advanced Printed Circuit Boards (PCBs):
  For manufacturers of printed circuit boards and modules, the standard ensures consistency and reliability in stacked architectures.
• Electronics Assembly:
  Assembly technicians and engineers use these test methods to validate the performance of 3D integrated packaging in consumer electronics, automotive, telecommunications, and medical devices.
• Quality Assurance:
  Quality control teams rely on standard testing procedures outlined in this document to ensure conforming electrical connectivity across all manufactured modules, reducing failure rates and warranty claims.
• Research and Development:
  R&D departments use the standard as a benchmark for developing new stacking technologies and improving electrical interconnect solutions, supporting continuous innovation in device embedding assembly technology.

Related Standards

Compliance with EN IEC 62878-2-602:2021 may require consideration of the following related standards:

• IEC 62878 Series:
  Covers broader requirements and guidelines for device embedding assembly technology, including terminology and design considerations.
• IEC 60194-2:
  Defines vocabulary and terms related to printed boards design, manufacture, and electronic assembly, which supports consistent understanding and communication.
• Other PCB Assembly Standards:
  Reference may be made to standards governing PCB reliability, soldering practices, and electrical testing to complement the evaluation methods in this document.

EN IEC 62878-2-602:2021 is an essential reference for ensuring reliable performance in stacked electronic modules, driving quality and innovation in miniaturized, high-performance electronic systems. For organizations involved in advanced assembly and testing, adopting this standard supports compliance, product excellence, and global market access.

Standards Content (Sample)

SLOVENSKI STANDARD
01-oktober-2021
Tehnologija sestavov z vdelanimi elementi - 2-602. del: Smernice za zložene
elektronske module - Metode vrednotenja vmesnih modulov električne
povezljivosti
Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic
module - Evaluation method of inter-module electrical connectivity
Ta slovenski standard je istoveten z: EN IEC 62878-2-602:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 62878-2-602

NORME EUROPÉENNE
EUROPÄISCHE NORM
August 2021
ICS 31.180; 31.190
English Version
Device embedding assembly technology - Part 2-602: Guideline
for stacked electronic module - Evaluation method of inter-
module electrical connectivity
(IEC 62878-2-602:2021)
Techniques d'assemblage avec appareil(s) intégré(s) - Montageverfahren für eingebettete Bauteile - Teil 2-602:
Partie 2-602: Lignes directrices pour un empilement de Leitfaden für gestapelte Elektronikmodule - Verfahren zur
modules électroniques - Méthode d'évaluation de la Beurteilung der elektrischen Verbindungsfähigkeit zwischen
connectivité électrique entre modules den Modulen
(IEC 62878-2-602:2021) (IEC 62878-2-602:2021)
This European Standard was approved by CENELEC on 2021-07-27. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62878-2-602:2021 E

European foreword
The text of document 91/1663/CDV, future edition 1 of IEC 62878-2-602, prepared by IEC/TC 91
“Electronics assembly technology” was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 62878-2-602:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022–04–27
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024–07–27
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 62878-2-602:2021 was approved by CENELEC as a
European Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 62878-2-602 ®
Edition 1.0 2021-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Device embedding assembly technology –

Part 2-602: Guideline for stacked electronic module – Evaluation method of

inter-module electrical connectivity

Techniques d’assemblage avec appareil(s) intégré(s) –

Partie 2-602: Lignes directrices pour un empilement de modules électroniques –

Méthode d’évaluation de la connectivité électrique entre modules

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180; 31.190 ISBN 978-2-8322-9894-7

– 2 – IEC 62878-2-602:2021  IEC 2021
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General . 6
5 Test apparatus . 7
6 Test specimen . 8
6.1 General . 8
6.2 Preparation of test specimen. 9
7 Evaluation test . 9
7.1 Test method . 9
7.2 Measurement . 9
7.3 Test procedure . 9
Annex A (informative) Specification of test specimen on outline size and terminal
layout. 11
Annex B (informative) Representative examples of stacking assembly methods . 12

Figure 1 – Stackable electronic module. 6
Figure 2 – Stacked electronic module . 7
Figure 3 – Test apparatus . 8
Figure 4 – Illustration of a typical test specimen . 9
Figure 5 – Input and output interface between test specimen and test apparatus . 10
Figure A.1 – Outline drawing of test specimen . 11

Table A.1 – The final specifications . 11
Table B.1 – Representative examples of stacking assembly methods . 12

IEC 62878-2-602:2021  IEC 2021 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY –

Part 2-602: Guideline for stacked electronic module –
Evaluation method of inter-module electrical connectivity

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly
...