EN IEC 62228-7:2026
(Main)Integrated circuits - EMC evaluation of transceivers - Part 7: CXPI transceivers
- Abstract
This part of IEC 62228 specifies test and measurement methods for the EMC evaluation of CXPI transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. This specification is applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and covers
– the emission of RF disturbances;
– the immunity against RF disturbances;
– the immunity against impulses;
– the immunity against electrostatic discharges (ESD).
- Status
- Published
- Publication Date
- 10-Sep-2026
- Technical Committee
- CLC/TC 47X - Semiconductor devices and trusted chips
- Current Stage
- 6060 - Document made available - Publishing
- Start Date
- 11-Sep-2026
- Due Date
- 13-Feb-2026
- Completion Date
- 11-Sep-2026
EN IEC 62228-7:2026 is a CENELEC European Standard that adopts IEC 62228-7:2026 without modification. It specifies test and measurement methods for EMC evaluation of CXPI transceiver ICs under network conditions, for engineers and test labs working with standard CXPI transceiver ICs and ICs with embedded CXPI transceiver.
What does EN IEC 62228-7:2026 specify?
EN IEC 62228-7:2026 specifies how to evaluate the electromagnetic compatibility (EMC) performance of CXPI transceiver ICs in application-like network conditions. It covers emission of RF disturbances, immunity to RF disturbances, immunity to impulses, and electrostatic discharge (ESD).
Clause 1 sets the scope. Clauses 2 to 7 cover normative references, terms and definitions, general principles, test and operating conditions, test and measurement methods, and the test report. Annexes A to E give the test circuits, PCB guidance, example limits, example signal settings, and notes for impulse testing.
| Annex | What it covers |
|---|---|
| Annex A | CXPI test circuits for functional tests and unpowered ESD tests |
| Annex B | Test circuit boards for functional and ESD tests |
| Annex C | Example test limits for automotive application |
| Annex D | Example settings for test signals |
| Annex E | Points to note for impulse immunity measurement for functional status class A |
What are the key requirements of EN IEC 62228-7:2026?
EN IEC 62228-7:2026 requires testing in a minimal network, with defined test signals, evaluation criteria, and test setups that match the transceiver type. In practice, the standard is organized so that the same basic approach can be used for RF emission, RF immunity, impulse immunity, and unpowered ESD, while still accounting for the different CXPI transceiver architectures.
Test conditions and network setup
Clause 5 sets default operating conditions around a 12 V automotive-style supply. The functional test conditions use VBAT at 14 V nominal, VCC at 5 V or 3.3 V, and an ambient temperature of 23 °C ± 5 °C. For RF emission measurements, the ambient noise floor must sit at least 6 dB below the target limit and be recorded.
Clause 5.3 requires a minimal two-node CXPI network for powered functional tests. Node 1 is the commander node and Node 2 is the responder node. For unpowered ESD tests, the standard uses one transceiver IC on a separate board. This matters because the test setup is meant to reflect real application behavior, not just component-level behavior.
Test signals and operating modes
Clause 5.4 defines different signals for different transceiver types. TX1 is used for standard type-A, TX2 for standard type-B, TX3 for ICs with embedded CXPI transceiver, and TX4 for wake-up from sleep mode. For the reader, this means the test signal must match the architecture under test or the result is not comparable.
The standard evaluates normal mode and sleep mode. In normal mode, communication is checked. In sleep mode, the test looks for both unwanted wake-up and wanted wake-up behavior. That distinction matters because a device can be electrically quiet yet still react incorrectly to disturbances.
Evaluation criteria and failure detection
Clause 5.5 defines how to decide pass or fail. For powered tests, the document uses functional status classes A, C, D1 or D2 according to IEC 62132-1. For unpowered damage checks, it compares I-V characteristics before and after ESD exposure, and a significant change is treated as failure. In practice, this means the lab must capture reference behavior before the test and compare the same signals or pin characteristics after each step.
RF emission and RF immunity
Clause 6.1 uses the 150 ohm direct coupling method from IEC 61967-4 for RF emission. Measurements are taken on the CXPI and VBAT coupling points, with settings for spectrum analysis and EMI receivers given in the tables. The result is a conducted-emission view of what the transceiver puts onto the network.
Clause 6.2 uses direct RF power injection (DPI) from IEC 62132-4 for RF immunity. The standard defines a frequency sweep from 1 MHz to 1 GHz, with step sizes and forward power levels set in Table 15. For status class A, the lab searches for malfunction while increasing power; for status classes C, D1 or D2, it applies the defined level and checks the status after each test. That difference matters because class A is a threshold search, while the other classes are a fixed-level verification.
Impulse immunity and ESD
Clause 6.3 uses the non-synchronous transient injection method from IEC 62215-3. It applies ISO 7637-2 pulse types 1, 2a, 3a and 3b at the CXPI and VBAT coupling points. The standard also explains how to document impulse immunity levels for the different status classes.
Clause 6.4 uses direct contact discharge from ISO 10605 for ESD testing on an unpowered transceiver. The test starts at 1 kV and goes up in 1 kV steps to the damage level or 15 kV, with positive and negative polarities and three pulses per point. For a buyer or test engineer, this is the part that shows how the device behaves under handling and assembly-related static discharge stress.
What terms does EN IEC 62228-7:2026 define?
EN IEC 62228-7:2026 defines several CXPI-specific terms that are central to the test setups.
- global pin - a pin that carries a signal or power directly into or out of the application board without active circuitry in between.
- standard CXPI transceiver IC - a standalone CXPI transceiver according to ISO 20794-4, or an IC with an integrated CXPI transceiver cell that exposes CXPI RXD and TXD.
- IC with embedded CXPI transceiver - an IC with an integrated CXPI transceiver cell and CXPI protocol handler, with or without external RXD and TXD access.
- mandatory components - the parts needed for correct operation of the IC, as specified by the manufacturer.
- commander node - the node that provides schedule management and the primary clock.
- responder node - any CXPI node other than the commander node.
- ReqTypeId - the request type identifier used to enable polling for dedicated measurement data or control data.
Who uses EN IEC 62228-7:2026?
EN IEC 62228-7:2026 is used by semiconductor engineers, EMC test laboratories, automotive electronics suppliers, and quality teams that need repeatable EMC evaluation of CXPI transceiver ICs. It is also useful for buyers and technical reviewers who need to compare test evidence from different suppliers on the same basis.
In practice, users apply it to design test boards, set up minimal CXPI networks, run emission and immunity measurements, verify wake-up behavior, and document ESD robustness. It is especially relevant where CXPI is used in road-vehicle electronics and where test reproducibility and comparable limits matter.
What changed in EN IEC 62228-7:2026 from the previous edition?
EN IEC 62228-7:2026 supersedes EN IEC 62228-7:2022 and is described as a technical revision. The foreword states these significant changes:
- the terms master and slave were changed to commander and responder in 3.1.5 and 3.1.6
- the test configuration for embedded transceivers was changed in 5.3.1 and Figure A.4 was added accordingly
- the definition of TX2 for type-B transceivers was changed in 5.4.2
- examples for test limits were added in Annex C
Which standards are used with EN IEC 62228-7:2026?
EN IEC 62228-7:2026 relies on a set of test and companion standards that define the measurement methods, vehicle disturbance tests, and CXPI protocol context.
- IEC 61967-1 - general conditions and definitions for integrated-circuit emission measurements
- IEC 61967-4 - the 1 ohm/150 ohm direct coupling method used for RF emission
- IEC 62132-1 - general conditions, definitions, and functional status classes for IC immunity
- IEC 62132-4 - direct RF power injection method for RF immunity
- IEC 62215-3 - non-synchronous transient injection method for impulse immunity
- IEC 62228-1 - general conditions and definitions for transceiver EMC evaluation
- ISO 7637-2 - vehicle transient pulse definitions used for impulse testing
- ISO 10605 - vehicle ESD test method used for unpowered ESD
- ISO 20794-4 - CXPI data link layer and physical layer context for the transceiver types and signals
- ISO 20794-7 - CXPI conformance test plan referenced for embedded-transceiver communication tests
- EIA-198-1 - capacitor characteristics referenced for passive component selection in the test circuits
The bibliography also points to CISPR 16-1-1, IEC 61000-4-4, and IEC 61000-4-5 as related measurement and pulse references.
What does the EN IEC 62228-7:2026 document contain?
EN IEC 62228-7:2026 contains a complete test framework with tables, figures, and circuit drawings that support EMC evaluation of CXPI transceiver ICs. The body of the standard includes an overview of the required tests, operating conditions, coupling ports, test signals, evaluation criteria, and detailed procedures for RF emission, RF immunity, impulse immunity, and ESD.
Annex A gives functional-test and ESD circuit diagrams for standard type-A, standard type-B, and embedded CXPI transceivers. Annex B gives PCB layout guidance such as two-layer construction, GND layer use, short interconnects, and discharge-point placement. Annex C provides example limits for automotive application, Annex D shows example signal settings, and Annex E explains the special handling of ISO 7637-2 pulse 1 during impulse immunity testing.
Relations
- Effective Date
- 24-Sep-2024
- Effective Date
- 11-Aug-2026
- Effective Date
- 11-Aug-2026
- Effective Date
- 11-Aug-2026
- Effective Date
- 11-Aug-2026
- Effective Date
- 11-Aug-2026
- Effective Date
- 11-Aug-2026
- Effective Date
- 11-Aug-2026
- Effective Date
- 11-Aug-2026
Frequently Asked Questions
EN IEC 62228-7:2026 is a standard published by CLC. Its full title is "Integrated circuits - EMC evaluation of transceivers - Part 7: CXPI transceivers". This standard covers: This part of IEC 62228 specifies test and measurement methods for the EMC evaluation of CXPI transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. This specification is applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and covers – the emission of RF disturbances; – the immunity against RF disturbances; – the immunity against impulses; – the immunity against electrostatic discharges (ESD).
This part of IEC 62228 specifies test and measurement methods for the EMC evaluation of CXPI transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. This specification is applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and covers – the emission of RF disturbances; – the immunity against RF disturbances; – the immunity against impulses; – the immunity against electrostatic discharges (ESD).
EN IEC 62228-7:2026 is classified under the following ICS (International Classification for Standards) categories: 31.200 - Integrated circuits. Microelectronics. The ICS classification helps identify the subject area and facilitates finding related standards.
EN IEC 62228-7:2026 has the following relationships with other standards: It is inter standard links to EN IEC 62228-7:2022, EN 62215-3:2013, EN IEC 62228-1:2018, EN IEC 61967-1:2019, EN 62132-1:2016, EN IEC 61967-4:2021, ISO 7637-2:2011, ISO 10605:2008, EN 62132-4:2006. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
EN IEC 62228-7:2026 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
01-november-2026
Nadomešča:
SIST EN IEC 62228-7:2022
Integrirana vezja - Vrednotenje elektromagnetne združljivosti (EMC) oddajnikov-
sprejemnikov - 7. del: Oddajniki-sprejemniki CXPI (IEC 62228-7:2026)
Integrated circuits - EMC evaluation of transceivers - Part 7: CXPI transceivers (IEC
62228-7:2026)
Integrierte Schaltungen - Bewertung der elektromagnetischen Verträglichkeit von Sende-
Empfangsgeräten – Teil 7: CXPI-Sende-Empfangsgeräte (IEC 62228-7:2026)
Circuits intégrés - évaluation de la CEM des émetteurs-récepteurs - Partie 7: émetteurs-
récepteurs CXPI (IEC 62228-7:2026)
Ta slovenski standard je istoveten z: EN IEC 62228-7:2026
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
33.100.01 Elektromagnetna združljivost Electromagnetic compatibility
na splošno in general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 62228-7
NORME EUROPÉENNE
EUROPÄISCHE NORM September 2026
ICS 31.200 Supersedes EN IEC 62228-7:2022
English Version
Integrated circuits - EMC evaluation of transceivers - Part 7:
CXPI transceivers
(IEC 62228-7:2026)
Circuits intégrés - Évaluation de la CEM des émetteurs- Integrierte Schaltungen - Bewertung der
récepteurs - Partie 7: Émetteurs-récepteurs CXPI elektromagnetischen Verträglichkeit von Sende-
(IEC 62228-7:2026) Empfangsgeräten - Teil 7: CXPI-Sende-Empfangsgeräte
(IEC 62228-7:2026)
This European Standard was approved by CENELEC on 2026-08-17. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2026 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62228-7:2026 E
European foreword
The text of document 47A/1180/CDV, future edition 2 of IEC 62228-7, prepared by SC 47A "Integrated
circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN IEC 62228-7:2026.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2027-09-30
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2029-09-30
document have to be withdrawn
This document supersedes EN IEC 62228-7:2022 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 62228-7:2026 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
CISPR 16-1-1 NOTE Approved as EN IEC 55016-1-1
IEC 61000-4-4 NOTE Approved as EN 61000-4-4
IEC 61000-4-5 NOTE Approved as EN 61000-4-5
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 61967-1 - Integrated circuits - Measurement of EN IEC 61967-1 -
electromagnetic emissions - Part 1:
General conditions and definitions
IEC 61967-4 - Integrated circuits - Measurement of EN IEC 61967-4 -
electromagnetic emissions - Part 4:
Measurement of conducted emissions - 1
ohm/150 ohm direct coupling method
IEC 62132-1 - Integrated circuits - Measurement of EN 62132-1 -
electromagnetic immunity - Part 1: General
conditions and definitions
IEC 62132-4 - Integrated circuits - Measurement of EN 62132-4 -
electromagnetic immunity 150 kHz to 1
GHz - Part 4: Direct RF power injection
method
IEC 62215-3 - Integrated circuits - Measurement of EN 62215-3 -
impulse immunity - Part 3: Non-
synchronous transient injection method
IEC 62228-1 - Integrated circuits - EMC evaluation of EN IEC 62228-1 -
transceivers - Part 1: General conditions
and definitions
ISO 7637-2 - Road vehicles - Electrical disturbances - -
from conduction and coupling - Part 2:
Electrical transient conduction along supply
lines only
ISO 10605 - Road vehicles - Test methods for electrical - -
disturbances from electrostatic discharge
ISO 20794-4 - Road vehicles - Clock extension peripheral - -
interface (CXPI) - Part 4: Data link layer
and physical layer
ISO 20794-7 - Road vehicles - Clock extension peripheral - -
interface (CXPI) - Part 7: Data link and
physical layer conformance test plan
EIA-198-1 - Ceramic Dielectric Capacitors Classes I, II, - -
III, and IV - Part 1: Characteristics and
Requirements
IEC 62228-7 ®
Edition 2.0 2026-07
INTERNATIONAL
STANDARD
Integrated circuits - EMC evaluation of transceivers -
Part 7: CXPI transceivers
ICS 31.200 ISBN 978-2-8327-1286-3
IEC 62228-7:2026-07(en)
IEC 62228-7:2026 © IEC 2026
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms . 8
4 General . 9
5 Test and operating conditions . 11
5.1 Supply and ambient conditions. 11
5.2 Test operation modes . 11
5.3 Test configuration . 12
5.3.1 General test configuration for functional test . 12
5.3.2 General test configuration for unpowered ESD test . 13
5.3.3 Coupling ports and coupling networks for functional tests . 13
5.3.4 Coupling ports and coupling networks for unpowered ESD tests . 14
5.3.5 Power supply with decoupling network . 15
5.4 Test signals . 15
5.4.1 General . 15
5.4.2 Test signals for normal operation mode . 15
5.4.3 Test signal for wake-up from sleep mode . 17
5.5 Evaluation criteria . 18
5.5.1 General . 18
5.5.2 Evaluation criteria in functional operation modes during exposure to
disturbances . 18
5.5.3 Evaluation criteria in unpowered condition after exposure to
disturbances . 20
5.5.4 Status classes . 21
6 Test and measurement . 21
6.1 Emission of RF disturbances . 21
6.1.1 Test method . 21
6.1.2 Test setup . 21
6.1.3 Test procedure and parameters . 22
6.2 Immunity to RF disturbances . 22
6.2.1 Test method . 22
6.2.2 Test setup . 23
6.2.3 Test procedure and parameters . 24
6.3 Immunity to impulses . 26
6.3.1 Test method . 26
6.3.2 Test setup . 26
6.3.3 Test procedure and parameters . 27
6.4 Electrostatic discharge (ESD) . 30
6.4.1 Test method . 30
6.4.2 Test setup . 30
6.4.3 Test procedure and parameters . 32
7 Test report . 32
Annex A (normative) CXPI test circuits . 33
IEC 62228-7:2026 © IEC 2026
A.1 General . 33
A.2 CXPI test circuit for functional tests on standard type-A CXPI transceiver ICs . 33
A.3 CXPI test circuit for functional tests on standard type-B CXPI transceiver ICs . 36
A.4 CXPI test circuit for functional tests on ICs with embedded CXPI transceiver . 38
A.5 CXPI test circuit for unpowered ESD test on a standard type-A CXPI
transceiver IC . 41
A.6 CXPI test circuit for unpowered ESD test on a standard type-B CXPI
transceiver IC . 41
Annex B (normative) Test circuit boards. 43
B.1 Test circuit board for functional tests . 43
B.2 ESD test . 44
Annex C (informative) Examples for test limits for CXPI transceiver in automotive
application . 45
C.1 General . 45
C.2 Emission of RF disturbances . 45
C.3 Immunity to RF disturbances . 46
C.4 Immunity to impulse . 47
C.5 Electrostatic discharge (ESD) . 48
Annex D (informative) Example of setting for test signals . 49
Annex E (informative) Points to note for impulse immunity measurement for functional
status class A . 51
IC
E.1 General . 51
E.2 Points to note when testing pulse 1 . 51
Bibliography . 53
Figure 1 – PHY sub-layers overview and CXPI transceiver types . 10
Figure 2 – General test configuration for tests in functional operation modes . 12
Figure 3 – General test configuration for unpowered ESD test . 13
Figure 4 – Coupling ports and networks for functional tests . 13
Figure 5 – Coupling ports and networks for unpowered ESD tests . 14
Figure 6 – Test signal types for standard type-A CXPI transceiver ICs . 16
Figure 7 – Test signal types for standard type-B CXPI transceiver ICs . 17
Figure 8 – Wake-up signal types for standard CXPI transceiver ICs . 18
Figure 9 – Principle drawing of the maximum deviation in an I-V characteristic . 20
Figure 10 – Test setup for measurement of RF disturbances. 21
Figure 11 – Test setup for DPI tests . 23
Figure 12 – Test setup for impulse immunity tests. 27
Figure 13 – Test setup for direct ESD tests . 31
Figure A.1 – General drawing of the circuit diagram of the test network for standard
type-A CXPI transceiver ICs for functional tests . 35
Figure A.2 – General drawing of the circuit diagram of the test network for standard
type-B CXPI transceiver ICs for functional tests . 37
Figure A.3 – General drawing of the circuit diagram of the test network for ICs with
embedded CXPI transceiver for functional tests using standard type-A CXPI
transceiver IC as Node 1 . 39
IEC 62228-7:2026 © IEC 2026
Figure A.4 – General drawing of the circuit diagram of the test network for ICs with
embedded CXPI transceiver for functional tests using IC with embedded CXPI
transceiver as Node 1 . 40
Figure A.5 – A general drawing of the test circuit diagram for testing direct ESD of
CXPI transceiver in unpowered mode . 41
Figure A.6 – A general drawing of the test circuit diagram for testing direct ESD of
CXPI standard Type-B transceiver in unpowered mode . 42
Figure B.1 – Example of IC interconnections of CXPI signal . 43
Figure B.2 – Example of ESD test board for CXPI transceiver ICs . 44
Figure C.1 – Example of limits for RF emission – CXPI . 45
Figure C.2 – Example of limits for RF emission – VBAT . 45
Figure C.3 – Example of limits for RF immunity for functional status class A – CXPI . 46
IC
Figure C.4 – Example of limits for RF immunity for functional status class A – VBAT . 46
IC
Figure C.5 – Example of limits for RF immunity for functional status class C or D –
IC IC
CXPI . 47
Figure C.6 – Example of limits for RF immunity for functional status class C or D –
IC IC
VBAT . 47
Figure D.1 – Example of signal setting for standard type-A in two transceiver
configuration . 49
Figure D.2 – Example of signal setting for standard type-B in two transceiver
configuration . 50
Figure E.1 – Relationship between ISO 7637-2 pulse 1 and transceiver VBAT supply . 51
Figure E.2 – Transceiver VBAT supply image when t time is shortened . 52
Table 1 – Types for CXPI transceiver . 9
Table 2 – Overview of required measurement and tests . 10
Table 3 – Supply and ambient conditions for functional operation . 11
Table 4 – Definition of coupling ports and coupling network components for functional
tests . 14
Table 5 – Definitions of coupling ports for unpowered ESD tests . 15
Table 6 – Communication test signal TX1 . 15
Table 7 – Communication test signal TX2 . 16
Table 8 – Communication test signal TX3 . 17
Table 9 – Wake-up test signal TX4 . 18
Table 10 – Evaluation criteria for standard type-A in functional operation modes . 19
Table 11 – Evaluation criteria for standard type-B in functional operation modes . 19
Table 12 – Evaluation criteria for ICs with embedded CXPI transceiver in functional
operation modes . 20
Table 13 – Parameters for emission measurements . 22
Table 14 – Settings for the RF measurement equipment . 22
Table 15 – Specifications for DPI tests . 24
Table 16 – Required DPI tests for functional status class A evaluation of standard
IC
type-A . 25
Table 17 – Required DPI tests for functional status class A evaluation of standard
IC
type-B . 25
IEC 62228-7:2026 © IEC 2026
Table 18 – Required DPI tests for functional status class A evaluation of ICs with
IC
embedded CXPI transceiver. 25
Table 19 – Required DPI tests for functional status class C , D1 or D2 evaluation
IC IC IC
of standard CXPI transceiver ICs and ICs with embedded CXPI transceiver . 26
Table 20 – Specifications for impulse immunity tests . 28
Table 21 – Parameters for impulse immunity tests . 28
Table 22 – Required impulse immunity tests for functional status class A evaluation
IC
of standard type-A . 29
Table 23 – Required impulse immunity tests for functional status class A evaluation
IC
of standard type-B . 29
Table 24 – Required impulse immunity tests for functional status class A evaluation
IC
of ICs with embedded CXPI transceiver . 29
Table 25 – Required impulse immunity tests for functional status class C , D1 or
IC IC
D2 evaluation of standard CXPI transceiver ICs and ICs with embedded CXPI
IC
transceiver . 30
Table 26 – Specifications for direct ESD tests . 32
Table B.1 – Parameter ESD test circuit board . 44
Table C.1 – Example of limits for impulse immunity for functional status
class C or D . 47
IC IC
IEC 62228-7:2026 © IEC 2026
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
Integrated circuits - EMC evaluation of transceivers -
Part 7: CXPI transceivers
FOREWORD
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
respect thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which
may be required to implement this document. However, implementers are cautioned that this may not represent
the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
shall not be held responsible for identifying any or all such patent rights.
IEC 62228-7 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical
committee 47: Semiconductor devices. It is an International Standard.
This second edition cancels and replaces the first edition published in 2022. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) change transceiver terms and definitions from master to commander and slave to responder
in 3.1.5 and 3.1.6.
b) change test configuration for embedded transceiver in 5.3.1 and add on Figure A.4
accordingly.
c) change the definition of TX2 test signal for type-B transceiver in 5.4.2.
d) add examples for test limits in Annex C.
IEC 62228-7:2026 © IEC 2026
The text of this International Standard is based on the following documents:
Draft Report on voting
47A/1180/CDV 47A/1195/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 62228 series, published under the general title Integrated circuits -
EMC evaluation of transceivers, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
– reconfirmed,
– withdrawn, or
– revised.
IEC 62228-7:2026 © IEC 2026
1 Scope
This part of IEC 62228 specifies test and measurement methods for the EMC evaluation of
CXPI transceiver ICs under network condition. It defines test configurations, test conditions,
test signals, failure criteria, test procedures, test setups and test boards. This specification is
applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and
covers
– the emission of RF disturbances;
– the immunity against RF disturbances;
– the immunity against impulses;
– the immunity against electrostatic discharges (ESD).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61967-1, Integrated circuits - Measurement of electromagnetic emissions - Part 1: General
conditions and definitions
IEC 61967-4, Integrated circuits - Measurement of electromagnetic emissions - Part 4:
Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method
IEC 62132-1, Integrated circuits - Measurement of electromagnetic immunity - Part 1: General
conditions and definitions
IEC 62132-4, Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz
- Part 4: Direct RF power injection method
IEC 62215-3, Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous
transient injection method
IEC 62228-1, Integrated circuits - EMC evaluation of transceivers - Part 1: General conditions
and definitions
ISO 7637-2, Road vehicles - Electrical disturbances from conduction and coupling - Part 2:
Electrical transient conduction along supply lines only
ISO 10605, Road vehicles - Test methods for electrical disturbances from electrostatic
discharge
ISO 20794-4, Road vehicles - Clock extension peripheral interface (CXPI) - Part 4: Data link
layer and physical layer
ISO 20794-7, Road vehicles - Clock extension peripheral interface (CXPI) - Part 7: Data link
and physical layer conformance test plan
EIA‑198-1, Ceramic Dielectric Capacitors Classes I, II, III, and IV - Part 1: Characteristics and
Requirements
IEC 62228-7:2026 © IEC 2026
3 Terms, definitions and abbreviated terms
For the purposes of this document, the terms and definitions given in IEC 62228-1, IEC 61967-1
and IEC 62132-1 and the following apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
– IEC Electropedia: available at https://www.electropedia.org/
– ISO Online browsing platform: available at https://www.iso.org/obp
3.1 Terms and definitions
3.1.1
global pin
pin that carries a signal or power which enters or leaves the application board without any active
component in between
3.1.2
standard CXPI transceiver IC
standalone CXPI transceiver according to ISO 20794-4 or IC with integrated CXPI transceiver
cell with access to CXPI RXD and TXD signal
3.1.3
IC with embedded CXPI transceiver
IC with integrated CXPI transceiver cell and CXPI protocol handler, with or without access to
CXPI RXD and TXD signal
3.1.4
mandatory components
components needed for proper function of IC as specified by the IC manufacturer
3.1.5
commander node
node that provides schedule management (including ReqTypeId transmission), the primary
clock and optionally the sleep message transmission management
3.1.6
responder node
node other than commander node connected to the CXPI network
3.1.7
ReqTypeId
request type identifier, parameter that enables the polling method for dedicated measurement
data and/or control data
3.2 Abbreviated terms
ASSP application specific standard product
CRC cyclic redundancy check
CXPI clock extension peripheral interface
DLL data link layer
EN enable
FI frame information
IBS inter byte space
NRZ non-return to zero
IEC 62228-7:2026 © IEC 2026
PCB printed circuit board
PID protected identifier
PMA physical media attachment
PS physical signalling
RXD receive data
TXD transmit data
PWM pulse width modulation
RX PMA receiver interface signal
PWM
RXD PS receiver interface signal
NRZ
TX PMA transmit interface signal
PWM
TXD PS transmit interface signal
NRZ
UART universal asynchronous receiver/transmitter
V
ESD voltage level of ESD testing
4 General
The intention of this document is to evaluate the EMC performance of CXPI transceiver ICs
under application conditions in a minimal network. CXPI transceiver ICs are generally classified
into three types, as listed in Table 1.
Figure 1 shows a sample configuration of each type of CXPI transceiver IC. The overview of
the PHY sublayers follows ISO 20794-4. Standard type-A comprises a CXPI transceiver IC that
contains the PS sublayer and the PMA sublayer. Standard type-B contains only the PMA
sublayer. The embedded type includes a microcontroller or ASSP function, in addition to the
functions of standard type-A. The PMA sublayer transmits and receives communication data on
the bus-line in the PWM signal format. The PS sublayer has the clock generation function, the
encoding and decoding of CXPI frames and the bit-wise collision resolution logic. The
microcontroller or ASSP transmits and receives communication data in the NRZ signal format
according to the specifications of the application.
Table 1 – Types for CXPI transceiver
Transceiver classification CXPI transceiver type Communication sublayer implementation
Standard type-A With PMA and PS sublayer
Standard CXPI transceiver IC
Standard type-B With PMA sublayer only
IC with embedded CXPI transceiver Embedded type With PMA, PS sublayer and DLL
IEC 62228-7:2026 © IEC 2026
Key
1 TXD
NRZ
2 RXD
NRZ
3 TX
PWM
4 RX
PWM
5 CXPI network
6 clock (commander node only, provided externally or from micro controller)
7 standard type-A
8 standard type-B
9 embedded type
10 PS
11 PMA
12 microcontroller or ASSP etc. including DLL
Figure 1 – PHY sub-layers overview and CXPI transceiver types
The evaluation of the EMC characteristics of CXPI transceivers shall be performed in functional
operation modes under network conditions for RF emission, RF immunity and impulse immunity
tests, and on a single unpowered transceiver IC for electrostatic discharge tests.
The aim of these tests is to determine the EMC performance on dedicated global pins of the
CXPI transceiver that are considered EMC relevant in the application. For a standard CXPI
transceiver IC and an IC with an embedded CXPI transceiver, these pins are VBAT and CXPI.
The test methods used for EMC characterization are based on the international standards for
IC EMC tests and are described in Table 2.
Table 2 – Overview of required measurement and tests
Transceiver mode Required test Test method Evaluation Operation mode
150 Ω direct coupling
RF emission Spectrum Normal
(IEC 61967-4)
Normal
DPI
RF immunity Function
Functional (powered)
(IEC 62132-4) Sleep
Non-synchronous transient Normal
injection
Impulse immunity Function
Sleep
(IEC 62215-3)
Contact discharge
Passive (unpowered) ESD
Damage Unpowered
(ISO 10605)
IEC 62228-7:2026 © IEC 2026
The RF emission, RF immunity and impulse immunity test methods are selected for the
evaluation of EMC characteristic of transceivers in functional (powered) modes. These three
test methods are based on the same approach using conductive coupling. Therefore, it is
possible to use the same test board for all tests in functional operation mode, which reduces
the effort required and increases the reproducibility and comparability of test results.
The ESD test is performed on passive (unpowered) transceiver IC on a separate test board.
A general drawing of a schematic with details of the CXPI transceiver test network for the
targeted EMC tests is described in Annex A. All measurements and tests should be done with
soldered transceivers on test boards as described in Annex B, to ensure application like
conditions and avoid setup effects by sockets.
Annex C provides example test limits and levels for CXPI transceivers in automotive application.
In general, the test definition is done for standard CXPI transceiver ICs. For ICs with embedded
CXPI transceivers some adaptations are necessary which are described in this document.
Specific adaptations shall be made individually for the dedicated IC but shall follow the general
definitions identified.
5 Test and operating conditions
5.1 Supply and ambient conditions
For all tests and measurements under operating conditions, the settings are based on systems
with a 12 V power supply, which is the main application for CXPI transceivers. If a transceiver
is designed or targeted for a higher power supply voltage, the test conditions and test targets
shall be adapted and documented accordingly. The defined supply and ambient conditions for
functional operation are given in Table 3. Although the standard voltage of VCC is 5 V, other
ext
voltages such as 3,3 V can be supplied depending on the product.
Table 3 – Supply and ambient conditions for functional operation
Parameter Value
a
(14 ± 0,2) V (default)
Voltage supply VBAT
ext
a
(5 ± 0,1) V (default), (3,3 ± 0,1) V
Voltage supply VCC
ext
Test temperature (23 ± 5) °C
a
V means voltage at external terminal on the test board as shown e.g. in Figure A.1.
ext
For RF emission measurements, the ambient noise floor shall be at least 6 dB below the applied
target limit and documented in the test report.
Unpowered ESD tests shall be carried out without any supply voltage, and the requirements of
ISO 10605 climatic environmental conditions shall be applied.
5.2 Test operation modes
The CXPI transceiver ICs shall be tested in powered functional operation modes and in the
unpowered mode. The functional operation modes are normal mode and sleep mode.
IEC 62228-7:2026 © IEC 2026
5.3 Test configuration
5.3.1 General test configuration for functional test
The test configuration in general consists of CXPI transceivers with mandatory components and
additional components for filtering and decoupling (CXPI node) in a minimal test network,
ext
where filtered power supplies, signals, monitoring probes and coupling networks are connected
as shown in Figure 2. Node 1 is defined as the commander node, and Node 2 is defined as the
responder node.
Figure 2 – General test configuration for tests in functional operation modes
For evaluation of RF emission, RF immunity and the impulse immunity characteristics of a CXPI
transceiver in functional operation mode, a minimal CXPI test network consisting of two CXPI
transceiver ICs shall be used. Depending on the type of transceiver, the following network
configurations are defined:
– two transceivers of the same type in case of standard CXPI transceiver IC (DUT), or
– one IC with embedded CXPI transceiver (DUT) and one standard CXPI transceiver IC, or
two transceivers of the same type of embedded CXPI transceiver IC (DUT).
NOTE In specific cases or for analyses, a deviation from this setup can be agreed between the users of this
document and noted in the test report.
The CXPI network termination and bus filter including ESD suppression devices (e.g. Zener
diode), if used, shall comply with the time constant defined in ISO 20794-4. If an optional ESD
suppression device is used (e.g. to achieve a certain ESD or impulse immunity level) it shall be
used for all other tests of this document and documented in the test report.
A general drawing of a schematic with details of the CXPI transceiver test network for the
targeted EMC tests is described in Annex A.
IEC 62228-7:2026 © IEC 2026
5.3.2 General test configuration for unpowered ESD test
The general test configuration for unpowered ESD test of CXPI transceiver ICs consists of a
single CXPI transceiver IC with mandatory external components and additional components for
filtering and decoupling on a test board with discharge coupling networks as shown in Figure 3.
Figure 3 – General test configuration for unpowered ESD test
5.3.3 Coupling ports and coupling networks for functional tests
The coupling ports and coupling networks are used to transfer disturbances to or from the test
network with a defined transfer characteristic. The schematic of the coupling ports, networks
and pins are shown in Figure 4. The values of the components depend on the test method and
are defined in Table 4. The tolerance of the components should be 1 % or less.
Key
1 coupling ports
2 coupling networks
3 pin networks (including all external mandatory components for the respective pin)
4 RF connector
Figure 4 – Coupling ports and networks for functional tests
IEC 62228-7:2026 © IEC 2026
Table 4 – Definition of coupling ports and coupling network components
for functional tests
Port Type Purpose Component
R , R C , C R , R
CP1 CP2 CP1 CP2 CP1t CP2t
EMI1 RF emission measurement on CXPI 12
...