EN 62739-1:2013

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

Verfahren zur Erosionsprüfung für Wellenlötausrüstungen bei Verwendung von geschmolzener, bleifreier Lotlegierung - Teil 1: Erosionsprüfverfahren für metallische Werkstoffe ohne Oberflächenbehandlung

Méthode d'essai de l'érosion de l'équipement de brasage à la vague utilisant un alliage à braser sans plomb fondu - Partie 1: Méthode d'essai d'érosion des matériaux métalliques sans traitement de surface

La CEI 62739-1:2013 décrit une méthode d'essai pour évaluer l'érosion des matériaux métalliques sans traitement de surface, destinés à être utilisés avec un bain de brasure par les équipements de brasage à la vague sans plomb, et l'érosion d'autres composants qui entrent en contact avec la brasure fondue.

Preskusna metoda za opremo za valovno spajkanje, ki uporablja staljeno spajkalno zlitino brez svinca - 1. del: Metoda z erozijskim preskušanjem kovinskih materialov brez površinske obdelave (IEC 62739-1:2013)

Ta del standarda IEC 62739 zajema preskusno metodo za erozijo kovinskih materialov brez površinske obdelave, ki so namenjeni uporabi z opremo za valovno spajkanje, ki uporablja staljeno spajkalno zlitino brez svinca, in drugimi komponentami, ki so v stiku s staljeno spajkalno zlitino.

General Information

• Status: Published
• Publication Date: 29-Aug-2013
• Withdrawal Date: 22-Jul-2016
• ICS: 31.190 - Electronic component assemblies
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 30-Aug-2013
• Completion Date: 30-Aug-2013
• Ref Project: SIST EN 62739-1:2014 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

Relations

• Replaced By: EN 60601-2-52:2010 - Medical electrical equipment - Part 2-52: Particular requirements for basic safety and essential performance of medical beds (IEC 60601-2-52:2009)
• Effective Date: 23-Jan-2023

Overview

EN 62739-1:2013 (IEC 62739-1:2013) specifies an erosion test method for metal materials without surface processing used in lead‑free wave soldering equipment. It defines how to evaluate the tendency of base metals (solder baths and components in direct contact with molten lead‑free solder) to be dissolved or thinned by molten solder during wave‑soldering operations. The standard describes the required test setup, specimen configuration, test procedure and measurement techniques to quantify erosion depth.

Key topics and technical requirements

• Scope: Assessment of erosion for metallic materials without surface processing intended for use in lead‑free wave soldering equipment (solder baths and contact components).
• Test principle: Specimens are mounted on a rotation block and immersed into molten lead‑free solder while rotated to simulate solder flow; erosion depth is measured after a specified test duration.
• Test equipment: Specifies a pot unit (heater and solder pot), rotation unit (motor and rotation block) and control unit (temperature and motor control). Equipment components that contact solder must be erosion resistant or treated to resist erosion. Ventilation/exhaust is recommended to manage dross.
• Specimens: Material of specimen must be the same as the actual bath or component material; shape and labeling follow the standard’s figures.
• Measurement method: Erosion depth measurement uses the focal‑depth method with an optical microscope; specimen preparation, measurement equipment configuration and procedure are defined.
• Ancillary procedures: Includes dross removal procedure and items required in the test report.
• Documentation and analysis: Annexes provide specifications for test and measurement equipment and an informative method for estimating maximum erosion depth using extreme‑value statistical analysis.

Applications and who uses this standard

EN 62739-1 is used by:

• Wave soldering equipment manufacturers (solder bath design, material selection).
• Electronics manufacturing services (EMS) and production QA to evaluate component longevity and maintenance intervals.
• Materials engineers and suppliers assessing candidate metals for lead‑free solder compatibility.
• Independent test laboratories performing standardized erosion testing for procurement and compliance.
• R&D teams investigating corrosion/erosion mechanisms when adopting lead‑free solders.

Typical use cases include material qualification for new bath alloys, failure analysis of eroded parts, and comparative testing of candidate metals for durability in lead‑free wave soldering environments.

Related standards

• IEC 61190-1-3 (requirements for electronic grade solder alloys)
• IEC 60068-2-20 (solderability and resistance to soldering heat test methods)
• Other parts of the IEC 62739 series covering complementary erosion test methods

Keywords: EN 62739-1, IEC 62739-1, lead-free solder, wave soldering, erosion test, solder bath, dross, erosion depth measurement, optical microscope.

Standards Content (Sample)

SLOVENSKI STANDARD
01-maj-2014
Preskusna metoda za opremo za valovno spajkanje, ki uporablja staljeno
spajkalno zlitino brez svinca - 1. del: Metoda z erozijskim preskušanjem kovinskih
materialov brez površinske obdelave (IEC 62739-1:2013)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy
- Part 1: Erosion test method for metal materials without surface processing
Verfahren zur Erosionsprüfung für Wellenlötausrüstungen bei Verwendung von
geschmolzener, bleifreier Lotlegierung - Teil 1: Erosionsprüfverfahren für metallische
Werkstoffe ohne Oberflächenbehandlung
/
Ta slovenski standard je istoveten z: EN 62739-1:2013
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 62739-1
NORME EUROPÉENNE
August 2013
EUROPÄISCHE NORM
ICS 31.190; 31.240
English version
Test method for erosion of wave soldering equipment using molten lead-
free solder alloy -
Part 1: Erosion test method for metal materials without surface
processing
(IEC 62739-1:2013)
Méthode d'essai de l'érosion de Verfahren zur Erosionsprüfung für
l'équipement de brasage à la vague Wellenlötausrüstungen bei Verwendung
utilisant un alliage à braser sans plomb von geschmolzener, bleifreier Lotlegierung
fondu - -
Partie 1: Méthode d'essai d'érosion des Teil 1: Erosionsprüfverfahren für
matériaux métalliques sans traitement de metallische Werkstoffe ohne
surface Oberflächenbehandlung
(CEI 62739-1:2013) (IEC 62739-1:2013)

This European Standard was approved by CENELEC on 2013-07-23. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62739-1:2013 E
Foreword
The text of document 91/1092/FDIS, future edition 1 of IEC 62739-1, prepared by IEC TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 62739-1:2013.
The following dates are fixed:
(dop) 2014-04-23
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2016-07-23
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62739-1:2013 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:

IEC 60194:2006 NOTE  Harmonized as EN 60194:2006.

- 3 - EN 62739-1:2013
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are

indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by
(mod), the relevant EN/HD applies.

Publication Year Title EN/HD Year

IEC 60068-2-20 2008 Environmental testing - EN 60068-2-20 2008
Part 2-20: Tests - Test T: Test methods for
solderability and resistance to soldering heat
of devices with leads
IEC 61190-1-3 Attachment materials for electronic EN 61190-1-3
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications

IEC 62739-1 ®
Edition 1.0 2013-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test method for erosion of wave soldering equipment using molten lead-free

solder alloy –
Part 1: Erosion test method for metal materials without surface processing

Méthode d'essai de l'érosion de l'équipement de brasage à la vague utilisant un

alliage à braser sans plomb fondu –

Partie 1: Méthode d'essai d'érosion de matériaux métalliques sans traitement de

surface
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX R
ICS 31.190; 31.240 ISBN 978-2-83220-870-0

– 2 – 62739-1 © IEC:2013
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test . 6
4.1 Overview . 6
4.2 Test equipment . 6
4.2.1 Test equipment description . 6
4.2.2 Configuration example of test equipment . 6
4.3 Specimen . 7
4.4 Test conditions . 9
4.5 Test method . 9
4.5.1 Test procedure . 9
4.5.2 Dross removal procedure . 10
5 Method of erosion depth measurement (focal depth method with optical
microscope) . 10
5.1 General . 10
5.2 Preparation of the specimen . 10
5.3 Measurement equipment . 10
5.4 Measurement procedure . 11
6 Items to be recorded in test report . 12
Annex A (normative) Specifications of test equipment & measurement equipment . 13
Annex B (informative) Method of estimation of maximum erosion depth by extreme
value statistical analysis . 15
Bibliography . 18

Figure 1 – Configuration example of test equipment . 7
Figure 2 – Shape of the specimen . 8
Figure 3 – Example of measurement equipment configuration for the focal depth
method using an optical microscope . 11
Figure B.1 – Example of section division of plate specimen . 15
Figure B.2 – Estimated maximum erosion depth for N = 8 . 17

Table 1 – Test conditions . 9

62739-1 © IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHOD FOR EROSION OF WAVE SOLDERING
EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY –

Part 1: Erosion test method for metal materials
without surface processing
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62739-1 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1092/FDIS 91/1106/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 62739-1 © IEC:2013
A list of all parts in the IEC 62739 series, published under the general title Test method for
erosion of wave soldering equipment using molten lead-free solder alloy, can be found on the
IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
62739-1 © IEC:2013 – 5 –
TEST METHOD FOR EROSION OF WAVE SOLDERING
EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY –

Part 1: Erosion test method for metal materials
without surface processing
1 Scope
This part of the IEC 62739 series provides an evaluating test method for the erosion of the
metallic materials without surface processing intended to be used for lead-free wave soldering
equipment as a solder bath and other components which are in contact with the molten solder.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering
applications
IEC 60068-2-20:2008, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
erosion
phenomenon where a base material is dissolved and made thinner by coming into contact with
molten solder
3.2
lead-free solder
alloy that does not contain more than 0,1 % mass fraction of lead (Pb) as its constituent and
is used for joining components to substrates or for coating surfaces
[SOURCE: IEC 60194:2006, 75.1904 modified — "mass fraction" is used instead of "weight"]
3.3
dross
oxide and other contaminants that form on the surface of molten solder
[SOURCE: IEC 60194:2006, 75.0410]

– 6 – 62739-1 © IEC:2013
4 Test
4.1 Overview
The specimen is mounted to the rotation block of the test equipment which is driven by the
motor (may include gear unit) then immersed into molten lead-free solder and rotated to
...