Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

NEW!IEC 61191-1:2018 is available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition: - the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F; - the term "assembly drawing" has been changed to "assembly documentation" throughout; - references to IEC standards have been corrected; - Clause 9 was completely rewritten; - Annex B was removed because there are already procedures for circuit board assemblies.

Elektronikaufbauten auf Leiterplatten - Teil 1: Fachgrundspezifikation - Anforderungen an gelötete elektrische und elektronische Baugruppen unter Verwendung der Oberflächenmontage und verwandter Montagetechniken

Ensembles de cartes imprimées - Partie 1: Spécification générique - Exigences relatives aux ensembles électriques et électroniques brasés utilisant les techniques de montage en surface et associées

NEW!IEC 61191-1:2018 est disponible sous forme de IEC 61191-1:2018 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L’IEC 61191-1:2018 établit les exigences relatives aux matériaux, méthodes et critères de vérification utilisés dans le cadre de la production d’interconnexions et d’ensembles brasés de qualité faisant appel à la technique de montage en surface ainsi qu’à des techniques d’assemblage associées. La présente partie de l’IEC 61191 comprend également des recommandations concernant la qualité des processus de fabrication. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - les exigences ont été mises à jour pour être conformes aux critères d’acceptation de l’IPC‑A-610F; - le terme "dessin d’assemblage" a été remplacé partout par "document d’assemblage"; - les références aux normes IEC ont été corrigées; - l’Article 9 a été entièrement réécrit; - l’Annexe B a été retirée car des procédures d’assemblages de cartes à circuits existent déjà.

Sestavi plošč tiskanih vezij - 1. del: Rodovna specifikacija - Zahteve za spajkane električne in elektronske sestave, ki uporabljajo tehnologije površinske montaže in sorodne tehnologije

Ta del standarda IEC 61191 določa zahteve za materiale, metode in kriterije za preverjanje za izdelavo kakovostnih spajkanih medsebojnih povezav in sestavov, ki uporabljajo tehnologije površinske montaže in sorodne tehnologije. Ta del standarda IEC 61191 vsebuje tudi priporočila za dobre postopke izdelave.

General Information

Status
Published
Publication Date
01-Nov-2018
Withdrawal Date
18-Oct-2021
Current Stage
6060 - Document made available - Publishing
Start Date
02-Nov-2018
Completion Date
02-Nov-2018

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SLOVENSKI STANDARD
SIST EN IEC 61191-1:2020
01-februar-2020
Nadomešča:
SIST EN 61191-1:2014
Sestavi plošč tiskanih vezij - 1. del: Rodovna specifikacija - Zahteve za spajkane
električne in elektronske sestave, ki uporabljajo tehnologije površinske montaže in
sorodne tehnologije
Printed board assemblies - Part 1: Generic specification - Requirements for soldered
electrical and electronic assemblies using surface mount and related assembly
technologies
Elektronikaufbauten auf Leiterplatten - Teil 1: Fachgrundspezifikation - Anforderungen an
gelötete elektrische und elektronische Baugruppen unter Verwendung der
Oberflächenmontage und verwandter Montagetechniken
Ensembles de cartes imprimées - Partie 1: Spécification générique - Exigences relatives
aux ensembles électriques et électroniques brasés utilisant les techniques de montage
en surface et associées
Ta slovenski standard je istoveten z: EN IEC 61191-1:2018
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN IEC 61191-1:2020 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61191-1:2020

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SIST EN IEC 61191-1:2020


EUROPEAN STANDARD EN IEC 61191-1

NORME EUROPÉENNE

EUROPÄISCHE NORM
November 2018
ICS 31.190; 31.240 Supersedes EN 61191-1:2013
English Version
Printed board assemblies - Part 1: Generic specification -
Requirements for soldered electrical and electronic assemblies
using surface mount and related assembly technologies
(IEC 61191-1:2018)
Ensembles de cartes imprimées - Partie 1: Spécification Elektronikaufbauten auf Leiterplatten - Teil 1:
générique - Exigences relatives aux ensembles électriques Fachgrundspezifikation - Anforderungen an gelötete
et électroniques brasés utilisant les techniques de montage elektrische und elektronische Baugruppen unter
en surface et associées Verwendung der Oberflächenmontage und verwandter
(IEC 61191-1:2018) Montagetechniken
(IEC 61191-1:2018)
This European Standard was approved by CENELEC on 2018-10-19. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 61191-1:2018 E

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SIST EN IEC 61191-1:2020
EN IEC 61191-1:2018 (E)
European foreword
The text of document 91/1481/CDV, future edition 3 of IEC 61191-1, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61191-1:2018.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2019-07-19
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2021-10-19
document have to be withdrawn

This document supersedes EN 61191-1:2013.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 61191-1:2018 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1
IEC
...

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