EN 61190-1-2:2007

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage

Matériaux de fixation pour les assemblages électroniques - Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de haute qualité dans les assemblages de composants électroniques

La CEI 61190-1-2:2007 spécifie les exigences d'ordre général relatives à la caractérisation et au contrôle des pâtes à braser utilisées pour obtenir des interconnexions de haute qualité dans l'assemblage de composants électroniques. La présente norme sert de document de contrôle de la qualité et n'a pas pour objet de s'intéresser directement à la performance du matériau au cours du procédé de fabrication. Les modifications principales par rapport à la première édition concernent une définition de l'alliage à braser sans plomb et une explication des normes relatives à l'essai de bille de soudure.

Povezovalni materiali za elektronske sestave - 1-2. del: Zahteve za spajkalne paste za visoko kakovostne povezave v elektronskih sestavih (IEC 61190-1-2:2007)

General Information

• Status: Withdrawn
• Publication Date: 27-Jun-2007
• Withdrawal Date: 30-Apr-2010
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 26-Mar-2017
• Completion Date: 26-Mar-2017
• Ref Project: SIST EN 61190-1-2:2007 - Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Relations

• Replaces: EN 61190-1-2:2002 - Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
• Effective Date: 29-Jan-2023
• Replaced By: EN 61190-1-2:2014 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-oktober-2007
1DGRPHãþD
SIST EN 61190-1-2:2003
Povezovalni materiali za elektronske sestave - 1-2. del: Zahteve za spajkalne paste
za visoko kakovostne povezave v elektronskih sestavih (IEC 61190-1-2:2007)
Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering
pastes for high-quality interconnects in electronics assembly
Verbindungsmaterialien für Baugruppen der Elektronik -- Teil 1-2: Anforderungen an
Lotpaste für hochwertige Verbindungen in der Elektronikmontage
Matériaux de fixation pour les assemblages électroniques -- Partie 1-2: Exigences
relatives aux crèmes de brasage pour les interconnexions de haute qualité dans les
assemblages de composants électroniques
Ta slovenski standard je istoveten z: EN 61190-1-2:2007
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 61190-1-2
NORME EUROPÉENNE
June 2007
EUROPÄISCHE NORM
ICS 31.190 Supersedes EN 61190-1-2:2002

English version
Attachment materials for electronic assembly -
Part 1-2: Requirements for soldering pastes
for high-quality interconnects in electronics assembly
(IEC 61190-1-2:2007)
Matériaux de fixation  Verbindungsmaterialien
pour les assemblages électroniques - für Baugruppen der Elektronik -
Partie 1-2: Exigences relatives Teil 1-2: Anforderungen an Lotpaste
aux crèmes de brasage für hochwertige Verbindungen
pour les interconnexions de haute qualité in der Elektronikmontage
dans les assemblages de composants (IEC 61190-1-2:2007)
électroniques
(CEI 61190-1-2:2007)
This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-2:2007 E
Foreword
The text of document 91/646/FDIS, future edition 2 of IEC 61190-1-2, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61190-1-2 on 2007-05-01.
This European Standard supersedes EN 61190-1-2:2002.
The main changes with regard to EN 61190-1-2:2002 concern a definition of lead-free solder alloy and an
explanation of solder ball test standards.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-02-01
national standard or by endorsement
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-05-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61190-1-2:2007 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 61190-1-2:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

1) 2)
IEC 60194 - Printed board design, manufacture and EN 60194 2006
assembly - Terms and definitions

1) 2)
IEC 61189-5 - Test methods for electrical materials, EN 61189-5 2006
interconnection structures and assemblies -
Part 5: Test methods for printed board
assemblies
1) 2)
IEC 61189-6 - Test methods for electrical materials, EN 61189-6 2006
interconnection structures and assemblies -
Part 6: Test methods for materials used in
manufacturing electronic assemblies

1) 2)
IEC 61190-1-1 - Attachment materials for electronic EN 61190-1-1 2002
assembly -
Part 1-1: Requirements for soldering fluxes
for high-quality interconnections in electronics
assembly
1) 2)
IEC 61190-1-3 - Attachment materials for electronic EN 61190-1-3 2007
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications

1) 2)
IEC 61191-1 - Printed board assemblies - EN 61191-1 1998
Part 1: Generic specification - Requirements
for soldered electrical and electronic
assemblies using surface mount and related
assembly technologies
1) 2)
IEC 61191-2 - Printed board assemblies - EN 61191-2 1998
Part 2: Sectional specification - Requirements
for surface mount soldered assemblies

1) 2)
IEC 61191-3 - Printed board assemblies - EN 61191-3 1998
Part 3: Sectional specification - Requirements
for through-hole mount soldered assemblies

1) 2)
IEC 61191-4 - Printed board assemblies - EN 61191-4 1998
Part 4: Sectional specification - Requirements
for terminal soldered assemblies

1)
Undated reference.
2)
Valid edition at date of issue.

Publication Year Title EN/HD Year
1) 2)
ISO 9000 - Quality management systems - EN ISO 9000 2005
Fundamentals and vocabulary
1) 2)
ISO 9001 - Quality management systems - EN ISO 9001 2000
Requirements
1) 2)
ISO 9453 - Soft solder alloys - Chemical compositions EN ISO 9453 2006
and forms
1) 2)
ISO 9454-2 - Soft soldering fluxes - Classification and EN ISO 9454-2 2000
requirements -
Part 2: Performance requirements

1) 3) 2)
ISO 10012-1 - Quality assurance requirements for EN 30012-1 1993
measuring equipment -
Part 1: Metrological confirmation system for
measuring equipment
3)
EN 30012-1:1993 is superseded by EN ISO 10012:2003, which is based on ISO 10012:2003.

INTERNATIONAL IEC
STANDARD 61190-1-2
Second edition
2007-04
Attachment materials for electronic assembly –
Part 1-2:
Requirements for soldering pastes
for high-quality interconnects
in electronics assembly
PRICE CODE
Commission Electrotechnique Internationale R
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 61190-1-2 © IEC:2007(E)
CONTENTS
FOREWORD.3
INTRODUCTION.5

1 Scope.6
2 Normative references .6
3 Terms and definitions .7
4 Standardized description for products.7
5 Test methods .7
6 Requirements .8
6.1 Conflict.8
6.2 Alloy composition .8
6.3 Flux characterization and inspection.8
6.4 Solder powder particle size .9
6.5 Metal per cent .10
6.6 Viscosity.10
6.7 Slump and smear test.10
6.8 Solder ball test .12
6.9 Tack test .12
6.10 Wetting.12
6.11 Labelling .13
7 Quality assurance provisions .14
7.1 Responsibility for inspection .14
7.2 Classification for inspections .15
7.3 Inspection report form .15
7.4 Qualification inspection .15
7.5 Quality conformance .16
8 Preparation for delivery .16
9 Additional information – Performance and shelf-life extension inspections.16

Annex A (normative) Test report on solder paste .18

Figure 1 – Slump test stencil thickness, 0,20 mm.11
Figure 2 – Slump test stencil thickness, 0,10 mm.12
Figure 3 – Solder ball test standards.14

Table 1 – Standardized solder paste description.7
Table 2 – Standard solder powders.9
Table 3 – Test methods for particle size distribution .10
Table 4 – Solder paste qualification inspection .16
Table 5 – User inspection for solder paste prior to use .17
Table A.1 – Solder paste inspection report form.18

61190-1-2 © IEC:2007(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1-2: Requirements for soldering pastes
for high-quality interconnects in electronics assembly

FOREWORD
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international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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agreement between the two organizations.
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consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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