EN 61189-3:2008

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major changes with regard to the previous edition concern the addition of 25 new test methods and the deletion of Annex B.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 3: Méthodes d'essai des structures d'interconnexion (cartes imprimées)

La CEI 61189-3:2007 constitue un recueil de méthodes d'essai représentant les méthodologies et les modes opératoires qui peuvent être appliqués pour soumettre à essais les matériaux utilisés pour fabriquer des structures d'interconnexion (cartes imprimées) et des ensembles. Les modifications techniques majeures par rapport à l'édition précédente concernent l'ajout de 25 nouveaux essais, comme suit: - 6 V: Méthodes d'essais visuels: 3V01, 3V02 et 3V03; - 7 D: Méthodes d'essais dimensionnels: 3D03; - 8 C: Méthodes d'essais chimiques: 3C02, 3C13 et 3C14; - 9 M: Méthodes d'essais mécaniques: 3M01, 3M03, 3M04, 3M07 et 3M09; - 10 E: Méthodes d'essais électriques: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 et 3E18; - 11 N: Méthodes d'essais d'environnement: 3N03, 3N07 et 3N12; - 12 X: Méthodes d'essais divers: 3X01.

Preskusne metode za električne materiale, tiskane plošče, povezovalne strukture in sestave - 3. del: Preskusne metode za povezovalne strukture (tiskanih plošč) (IEC 61189-3:2007)

General Information

• Status: Published
• Publication Date: 07-Jan-2008
• Withdrawal Date: 30-Nov-2010
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 08-Jan-2008
• Completion Date: 08-Jan-2008
• Ref Project: SIST EN 61189-3:2008 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)

Relations

• Replaces: EN 61189-3:1997 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
• Effective Date: 29-Jan-2023
• Replaces: EN 61189-3:1997/A1:1999 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61189-3:2008
01-junij-2008
1DGRPHãþD
SIST EN 61189-3:2001
SIST EN 61189-3:2001/A1:2001
3UHVNXVQHPHWRGH]DHOHNWULþQHPDWHULDOHWLVNDQHSORãþHSRYH]RYDOQHVWUXNWXUH
LQVHVWDYHGHO3UHVNXVQHPHWRGH]DSRYH]RYDOQHVWUXNWXUHWLVNDQLKSORãþ
,(&
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles -- Partie 3: Méthodes d'essai des structures
d'interconnexion (cartes imprimées)
Ta slovenski standard je istoveten z: EN 61189-3:2008
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61189-3:2008 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61189-3:2008

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SIST EN 61189-3:2008


EUROPEAN STANDARD
EN 61189-3

NORME EUROPÉENNE
January 2008
EUROPÄISCHE NORM

ICS 31.180 Supersedes EN 61189-3:1997 + A1:1999


English version


Test methods for electrical materials, printed boards
and other interconnection structures and assemblies -
Part 3: Test methods for interconnection structures (printed boards)
(IEC 61189-3:2007)


Méthodes d'essai pour les matériaux Prüfverfahren für Elektromaterialien,
électriques, les cartes imprimées Leiterplatten und andere Verbindungs-
et autres structures d'interconnexion strukturen und Baugruppen -
et ensembles - Teil 3: Prüfverfahren für Verbindungs-
Partie 3: Méthodes d'essai des structures strukturen (Leiterplatten)
d'interconnexion (cartes imprimées) (IEC 61189-3:2007)
(CEI 61189-3:2007)




This European Standard was approved by CENELEC on 2007-12-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2008 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61189-3:2008 E

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SIST EN 61189-3:2008
EN 61189-3:2008 – 2 –
Foreword
The text of document 91/698/FDIS, future edition 2 of IEC 61189-3, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61189-3 on 2007-12-01.
This European Standard supersedes EN 61189-3:1997 + A1:1999.
The major technical changes with regard to EN 61189-3:1997 + A1:1999 concern the addition of 25 new
tests, as follows:
– 6 V: Visual test methods: 3V01, 3V02 and 3V03;
– 7 D: Dimensional test methods: 3D03;
– 8 C: Chemical test methods: 3C02, 3C13 and 3C14;
– 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09;
– 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18;
– 11 N: Environmental test methods: 3N03, 3N07 and 3N12;
– 12 X: Miscellaneous test methods: 3X01.
EN 61189-3:2007 also includes the deletion of Annex B: Conversion table, as the referred documents
have been withdrawn. Should anyone wish to consult such information, they should refer to
EN 61189-3:1997.
The new general title of EN 61189 series is Test methods for electrical materials, printed boards and
other interconnection structures and assemblies. Titles of existing standards in this series will be updated
at the time of revision.
...