Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices

IEC 60297-3-109:2015 specifies dimensions and physical properties of chassis and associated printed boards in order to provide mechanical and environmental integrity for embedded computing devices. They are used in various applications such as machine control, medical, transportation, aerospace and telecommunication, typically based on single board computers. For the easy definition of the suitable chassis and associated single board dimensions, this standard is based on a structural grid of 44,45 mm (1,75 in). Key words: Dimensions, Mechanical Structures, Chassis, Embedded Computing Devices

Structures mécaniques pour équipements électriques et électroniques -Dimensions des structures mécaniques de la série 482,6 mm (19 pouces) – Partie 3-109: Dimensions des châssis pour dispositifs informatiques intégrés

L'IEC 60297-3-109:2015 spécifie les dimensions et les propriétés physiques des châssis et des cartes imprimées associées, afin de garantir l'intégrité mécanique et environnementale des dispositifs informatiques intégrés. Ces derniers sont utilisés dans de nombreuses applications, notamment pour commander des machines dans les environnements de la santé, des transports, de l'aérospatial et des communications. Il s'agit généralement d'ordinateurs monocartes. Pour faciliter la définition des dimensions adaptées des châssis et cartes imprimées associées, la présente norme se base sur une grille structurelle de 44,45 mm (1,75 pouce). Mots-clés: Dimensions, Structures mécaniques, Châssis, Dispositifs informatiques intégrés

Mehanske konstrukcije za elektronsko opremo - Mere mehanskih konstrukcij serije 482,6 mm (19 palcev) - 3-109. del: Mere ohišij za vgrajeno računalniško opremo

Ta del standarda IEC 60297 določa mere in fizikalne lastnosti ohišij in z njimi povezanih tiskanih plošč, da se zagotovi mehanska in okoljska neoporečnost za vgrajene računalniške naprave. Uporabljajo se za različne namene, npr. nadzor strojev, medicinske namene, prevoz, vesoljske namene in telekomunikacije, kjer se običajno uporabljajo računalniki z eno matično ploščo.
Za enostavno opredelitev ustreznega ohišja in mer z njim povezane matične plošče ta standard temelji na strukturni mreži 44,45 mm (1,75 palca).

General Information

Status
Published
Publication Date
11-Feb-2016
Current Stage
6060 - Document made available
Due Date
12-Feb-2016
Completion Date
12-Feb-2016

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SLOVENSKI STANDARD
SIST EN 60297-3-109:2016
01-april-2016
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Mechanical structures for electronic equipment - dimensions of mechanical structures of

the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded
computing
Ta slovenski standard je istoveten z: EN 60297-3-109:2016
ICS:
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
SIST EN 60297-3-109:2016 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60297-3-109:2016
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SIST EN 60297-3-109:2016
EUROPEAN STANDARD EN 60297-3-109
NORME EUROPÉENNE
EUROPÄISCHE NORM
February 2016
ICS 31.240
English Version
Mechanical structures for electrical and electronic equipment -
Dimensions of mechanical structures of the 482,6 mm (19 in)
series - Part 3-109: Dimensions of chassis for embedded
computing devices
(IEC 60297-3-109:2015)

Structures mécaniques pour équipements électriques et Mechanische Bauweisen für elektronische Einrichtungen -

électroniques - Dimensions des structures mécaniques de Maße der 482,6-mm-(19-in-)Bauweise -

la série 482,6 mm (19 pouces) - Partie 3-109: Dimensions Teil 3-109: Maße von Einschüben für eingebettete

des châssis pour dispositifs informatiques intégrés Datenverarbeitung
(IEC 60297-3-109:2015) (IEC 60297-3-109:2015)

This European Standard was approved by CENELEC on 2015-12-28. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels

© 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN 60297-3-109:2016 E
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SIST EN 60297-3-109:2016
EN 60297-3-109:2016
European foreword

The text of document 48D/598/FDIS, future edition 1 of IEC 60297-3-109, prepared by

SC 48D “Mechanical structures for electrical and electronic equipment” of IEC/TC 48 “Electrical

connectors and mechanical structures for electrical and electronic equipment" was submitted to the

IEC-CENELEC parallel vote and approved by CENELEC as EN 60297-3-109:2016.
The following dates are fixed:
• latest date by which the document has to be (dop) 2016-09-28
implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2018-12-28
• latest date by which the national
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such

patent rights.
Endorsement notice

The text of the International Standard IEC 60297-3-109:2015 was approved by CENELEC as a

European Standard without any modification.
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SIST EN 60297-3-109:2016
EN 60297-3-109:2016
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are

indispensable for its application. For dated references, only the edition cited applies. For undated

references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:

www.cenelec.eu
Publication Year Title EN/HD Year
IEC 60297-3-100 - Mechanical structures for electronic EN 60297-3-100 -
equipment - Dimensions of mechanical
structures of the 482,6 mm (19 in) series -
Part 3-100: Basic dimensions of front
panels, subracks, chassis, racks and
cabinets
IEC 60529 - Degrees of protection provided by EN 60529 -
enclosures (IP Code)
IEC 61587-1 - Mechanical structures for electronic EN 61587-1 -
equipment - Tests for IEC 60917
and IEC 60297 series -
Part 1: Environmental requirements, test
set-up and safety aspects for cabinets,
racks, subracks and chassis under indoor
conditions
IEC 61587-3 - Mechanical structures for electronic EN 61587-3 -
equipment - Tests for IEC 60917
and IEC 60297 -
Part 3: Electromagnetic shielding
performance tests for cabinets and
subracks
IEC 61587-5 - Mechanical structures for electronic EN 61587-5 -
equipment - Tests for IEC 60917
and IEC 60297 -
Part 5: Seismic tests for chassis, subracks,
and plug-in units
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SIST EN 60297-3-109:2016
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SIST EN 60297-3-109:2016
IEC 60297-3-109
Edition 1.0 2015-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical structures for electrical and electronic equipment – Dimensions of
mechanical structures of the 482,6 mm (19 in) series –
Part 3-109: Dimensions of chassis for embedded computing devices
Structures mécaniques pour équipements électriques et électroniques –
Dimensions des structures mécaniques de la série 482,6 mm (19 pouces) –
Partie 3-109: Dimensions des châssis pour dispositifs informatiques intégrés
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.240 ISBN 978-2-8322-3007-7

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN 60297-3-109:2016
– 2 – IEC 60297-3-109:2015 © IEC 2015
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms and definitions ...................................................................................................... 7

4 Arrangement overview ..................................................................................................... 7

5 Chassis dimensions ......................................................................................................... 8

Annex A (normative) Printed board dimensions .................................................................... 11

A.1 Illustrative figure ................................................................................................... 11

A.2 Maximum printed board dimensions ...................................................................... 11

Annex B (normative) Printed board dimensions in conjunction with fan cooling .................... 13

B.1 Illustrative figure ................................................................................................... 13

B.2 Maximum printed board dimensions in conjunction with fan cooling ...................... 13

Annex C (normative) Chassis mounting options ................................................................... 16

C.1 Type A: Example for 19” cabinet mounting option ................................................. 16

C.2 Type B: Example for 19” cabinet mounting option ................................................. 16

C.3 Type C: Chassis mounting example ...................................................................... 17

C.4 Type D: Chassis mounting option .......................................................................... 17

Annex D (normative) Environmental tests ............................................................................ 19

D.1 Static and dynamic load test ................................................................................. 19

D.2 Seismic test .......................................................................................................... 19

D.3 Electromagnetic shielding performance test .......................................................... 19

D.4 Degrees of protection ............................................................................................ 19

Annex E (informative) Extended chassis dimensions ............................................................ 20

E.1 General ................................................................................................................. 20

E.2 Illustrative figure ................................................................................................... 20

E.3 Extended chassis dimensions ............................................................................... 20

Figure 1 – Three dimensional grid for chassis and associated printed boards ......................... 6

Figure 2 – Chassis arrangement of an embedded application ................................................. 8

Figure 3 – Chassis front dimensions ....................................................................................... 8

Figure 4 – Chassis depth dimensions ...................................................................................... 8

Figure A.1 – Chassis with printed board ................................................................................ 11

Figure A.2 – Printed board dimensions ................................................................................. 11

Figure B.1 – Chassis with fan cooling ................................................................................... 13

Figure B.2 – Printed board dimensions in conjunction with fan cooling, example (fan

depth = 28,0 mm) .................................................................................................................. 14

Figure C.1 – Type A: Chassis mounting in a 19” cabinet ....................................................... 16

Figure C.2 – Type B: Chassis mounting in a 19” cabinet ....................................................... 17

Figure C.3 – Type C: Vertical flange mounting ...................................................................... 17

Figure C.4 – Type D: Horizontal flange mounting .................................................................. 18

Figure E.1 – Extended chassis example ................................................................................ 20

Figure E.2 – Extended chassis – front dimensions ................................................................ 20

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SIST EN 60297-3-109:2016
IEC 60297-3-109:2015 © IEC 2015 – 3 –

Figure E.3 – Extended chassis – depth dimensions............................................................... 21

Table 1 – Chassis height dimensions ...................................................................................... 9

Table 2 – Chassis width dimensions ....................................................................................... 9

Table 3 – Chassis depth dimensions ..................................................................................... 10

Table A.1 – Printed board width dimensions ......................................................................... 12

Table A.2 – Printed board depth dimensions ......................................................................... 12

Table B.1 – Printed board width dimensions in conjunction with fan cooling, example

(fan depth=28,0 mm) ............................................................................................................. 15

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SIST EN 60297-3-109:2016
– 4 – IEC 60297-3-109:2015 © IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STRUCTURES FOR ELECTRICAL AND
ELECTRONIC EQUIPMENT – DIMENSIONS OF MECHANICAL
STRUCTURES OF THE 482,6 mm (19 in) SERIES –
Part 3-109: Dimensions of chassis for embedded computing devices
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation

...

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