EN 62137-4:2014

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment. IEC 62137-4 includes the following significant technical changes with respect to IEC 62137:2004: - test conditions for use of lead-free solder are included; - test conditions for lead-free solders are added; - accelerations of the temperature cycling test for solder joints are added.

Montageverfahren für elektronische Baugruppen - Teil 4: Oberflächenmontierbare Bauteilgehäuse mit Flächenmatrix - (Lebens-)Dauerprüfungen für Lötverbindungen

Technique d'assemblage des composants électroniques - Partie 4: Méthodes d'essais d'endurance des joints brasés des composants pour montage en surface à boîtiers de type matriciel

L'IEC 62137-4:2014 spécifie la méthode d'essai des joints brasés des boîtiers de type matriciel montés sur la carte de câblage imprimé, visant à évaluer la durabilité des joints brasés par rapport aux contraintes thermiques et mécaniques. La présente partie de l'IEC 62137 s'applique aux dispositifs à semiconducteurs pour montage en surface avec boîtiers de type matriciel (FBGA, BGA, FLGA et LGA) incluant les boîtiers de type à bornes périphériques (SON et QFN) qui sont destinés à être utilisés dans des matériels électriques ou électroniques industriels ou grand public. L'IEC 62137-4 inclut les modifications techniques majeures suivantes par rapport à l'IEC 62137:2004: - les conditions d'essai pour l'utilisation d'une soudure sans plomb ont été incluses; - les conditions d'essai pour des soudures sans plomb ont été ajoutées; - les accélérations de l'essai de cycle de température pour des joints brasés ont été ajoutées.

Tehnologija elektronskega sestavljanja - 4. del: Metode za preskušanje vzdržljivosti kositrnih spojev elementov za površinsko montažo z okrovi z matričnimi priključki v ravnini

Ta del standarda IEC 62137 določa metode za preskušanje kositrnih spojev elementov za površinsko montažo z okrovi z matričnimi priključki v ravnini, ki so montirani na ploščo tiskanega vezja, za oceno vzdržljivosti kositrnih spojev pri toplotno-mehanskih obremenitvah. Ta del standarda IEC 62137 velja za polprevodniške elemente za površinsko montažo z okrovi z matričnimi priključki v ravnini (FBGA, BGA, FLGA in LGA), vključno s perifernimi priključki
(SON in QFN), ki so namenjeni uporabi v električni in elektronski industrijski in zabavni elektroniki.
Dejavnik pospešenega slabšanja kositrnih spojev priključkov pri preskusu kroženja temperature zaradi toplotne obremenitve pri montaži je opisan v dodatku A. Dodatek H ponuja nekaj razlag v povezavi z različnimi tipi mehanskih obremenitev pri montaži. Preskusna metoda, določena s tem standardom, ni namenjena oceni polprevodniških elementov.
OPOMBA 1 Pogoji pri montaži, materiali za spajkanje itd. pomembno vplivajo na rezultat preskusa, določenega s tem standardom. Zato preskus, opisan s tem standardom, ni mišljen kot preskus, ki je namenjen zagotavljanju zmožnosti montaže paketov.
OPOMBA 2 Ta preskusna metoda ni nujna, če kositrni spoji niso izpostavljeni obremenitvi (mehanski ali drugi) pri uporabi na terenu in obdelavi po montaži.

General Information

• Status: Published
• Publication Date: 11-Dec-2014
• Withdrawal Date: 12-Nov-2017
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 12-Dec-2014
• Completion Date: 12-Dec-2014
• Ref Project: SIST EN 62137-4:2015 - Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

Relations

• Replaces: EN 62137:2004 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
• Effective Date: 29-Jan-2023
• Corrected By: EN 62137-4:2014/AC:2015 - Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
• Effective Date: 27-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62137-4:2015
01-september-2015
1DGRPHãþD
SIST EN 62137:2005
7HKQRORJLMDHOHNWURQVNHJDVHVWDYOMDQMDGHO0HWRGH]DSUHVNXãDQMH
Y]GUåOMLYRVWLNRVLWUQLKVSRMHYHOHPHQWRY]DSRYUãLQVNRPRQWDåR]RNURYL]
PDWULþQLPLSULNOMXþNLYUDYQLQL
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area
array type package surface mount devices
Montageverfahren für elektronische Baugruppen - Teil 4: Oberflächenmontierbare
Bauteilgehäuse mit Flächenmatrix - (Lebens)dauerprüfungen für Lötverbindungen
Technique d'assemblage des composants électroniques - Partie 4: Méthodes d'essais
d'endurance des joints brasés des composants pour montage en surface à boîtiers de
type matriciel
Ta slovenski standard je istoveten z: EN 62137-4:2014
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 62137-4:2015 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62137-4:2015

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SIST EN 62137-4:2015


EUROPEAN STANDARD EN 62137-4

NORME EUROPÉENNE

EUROPÄISCHE NORM
December 2014
ICS 31.190

English Version
Electronics assembly technology -
Part 4: Endurance test methods for solder joint of area array type
package surface mount devices
(IEC 62137-4:2014)
Technique d'assemblage des composants électroniques - Montageverfahren für elektronische Baugruppen -
Partie 4: Méthodes d'essais d'endurance des joints brasés Teil 4: Oberflächenmontierbare Bauteilgehäuse mit
des composants pour montage en surface à boîtiers de Flächenmatrix - (Lebens-)Dauerprüfungen für
type matriciel Lötverbindungen
(CEI 62137-4:2014) (IEC 62137-4:2014)
This European Standard was approved by CENELEC on 2014-11-13. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 62137-4:2014 E

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SIST EN 62137-4:2015
EN 62137-4:2014 - 2 -
Foreword
The text of document 91/1188/FDIS, future edition 1 of IEC 62137-4, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 62137-4:2014.

The following dates are fixed:
(dop) 2015-08-13
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2017-11-13
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 62137-4:2014 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-1:1988+A1:1992 NOTE Harmonized as EN 60068-1:1994 (not modified).
IEC 60068-2-2 NOTE Harmonized as EN 60068-2-2.
IEC 60068-2-6 NOTE Harmonized as EN 60068-2-6.
IEC 60068-2-21:2006 NOTE Harmonized as EN 60068-2-21:2006 (not modified).
IEC 60068-2-27 NOTE Harmonized as EN 60068-2-27.
IEC 60068-2-44:1995 NOTE Harmonized as EN 60068-2-44:1995 (not modified).
IEC 60068-2-58:2004 NOTE Harmonized as EN 60068-2-58:2004 (not modified).
1)
IEC 60068-2-78:2001 NOTE Harmonized as
...