EN 62137:2004

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. Tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits used mainly for industrial and consumer use equipment.

Umwelt- und Dauerprüfung - Prüfverfahren für in Oberflächenmontagetechnik bestückte Leiterplatten mit Area-Array-Bauelementen der Bauformen FBGA, BGA, FLGA, LGA, SON und QFN

Essais d'environnement et d'endurance - Méthodes d'essai pour les cartes à montage en surface de boîtiers de type matriciel FBGA, BGA, FLGA, LGA, SON et QFN

Specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. Tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits used mainly for industrial and consumer use equipment.

Okoljsko in vzdržljivostno preskušanje – Preskusne metode za površinsko vgrajene plošče z ohišji s ploskovnimi nizi tipa FBGA, BGA, FLGA, LGA, SON in QFN

General Information

• Status: Withdrawn
• Publication Date: 04-Aug-2004
• Withdrawal Date: 30-Jun-2007
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 13-Nov-2017
• Completion Date: 13-Nov-2017
• Ref Project: SIST EN 62137:2005 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Relations

• Replaced By: EN 62137-4:2014 - Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST EN 62137:2005

STANDARD
september 2005
Okoljsko in vzdržljivostno preskušanje – Preskusne metode za površinsko
vgrajene plošče z ohišji s ploskovnimi nizi tipa FBGA, BGA, FLGA, LGA, SON
in QFN
Environmental and endurance testing – Test methods for surface-mount boards of
area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
ICS 19.040; 31.190 Referenčna številka
SIST EN 62137:2005(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 62137
NORME EUROPÉENNE
EUROPÄISCHE NORM August 2004

ICS 31.190


English version


Environmental and endurance testing -
Test methods for surface-mount boards of area array type packages
FBGA, BGA, FLGA, LGA, SON and QFN
(IEC 62137:2004)


Essai d'environnement et d'endurance - Umwelt- und Dauerprüfung -
Méthodes d'essai des cartes montées Prüfverfahren für in
en surface à boîtiers de type Oberflächenmontagetechnik bestückte
FBGA, BGA, FLGA, LGA, SON et QFN Leiterplatten mit Area-Array-
(CEI 62137:2004) Bauelementen der Bauformen
FBGA, BGA, FLGA, LGA, SON und QFN
(IEC 62137:2004)





This European Standard was approved by CENELEC on 2004-07-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 62137:2004 E

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EN 62137:2004 - 2 -
Foreword
The text of document 91/444/FDIS, future edition 1 of IEC 62137, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62137 on 2004-07-01.
The following dates were fixed:

– latest date by which the EN has to be implemented

at national level by publication of an identical
(dop) 2005-04-01
national standard or by endorsement

– latest date by which the national standards conflicting
(dow) 2007-07-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62137:2004 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2-44 NOTE Harmonized as EN 60068-2-44:1995 (not modified).
IEC 60749-1 NOTE Harmonized as EN 60749-1:2003 (not modified).
IEC 60749-20 NOTE Harmonized as EN 60749-20:2003 (not modified).
IEC 61189-3 NOTE Harmonized as EN 61189-3:1997 (not modified).
IEC 61760-1 NOTE Harmonized as EN 61760-1:1998 (not modified).
__________

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- 3 - EN 62137:2004
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60068-1 1988 Environmental testing EN 60068-1 1994
Part 1: General and guidance

IEC 60191-6-2 2001 Mechanical standardization of EN 60191-6-2 2002
semiconductor devices
Part 6-2: General rules for the preparation
of outline drawings of surface mounted
semiconductor device packages - Design
guide for 1,50 mm, 1,27 mm and 1,00 mm
pitch ball and column te
...