IEC 61709:2017/COR1:2019
(Corrigendum)Corrigendum 1 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
Corrigendum 1 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
Corrigendum 1 - Composants électriques - Fiabilité - Conditions de référence pour les taux de défaillance et modèles de contraintes pour la conversion
General Information
Relations
Standards Content (Sample)
IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
____________
IEC 61709 IEC 61709
Edition 3.0 2017-02 Édition 3.0 2017-02
ELECTRIC COMPONENTS – RELIABILITY – COMPOSANTS ÉLECTRIQUES – FIABILITÉ –
REFERENCE CONDITIONS FOR FAILURE RATES CONDITIONS DE RÉFÉRENCE POUR LES TAUX
AND STRESS MODELS FOR CONVERSION – DE DÉFAILLANCE ET MODÈLES DE
CONTRAINTES POUR LA CONVERSION –
CO RRI G E NDUM 1
Corrections only apply to the French version.
Les corrections ne s'appliquent qu'à la version française.
Annexe B
B.4 Puissance dissipée d'un circu
...
This May Also Interest You
IEC 61163-2:2020 provides guidance on RSS techniques and procedures for electrical, electronic, and mechanical components. This document is procedural in nature and is not, and cannot be, exhaustive with respect to component technologies due to the rapid rate of developments in the component industry. This document is:
a) intended for component manufacturers as a guideline;
b) intended for component users as a guideline to negotiate with component manufacturers on RSS requirements;
c) intended to allow the planning of an RSS process in house to meet reliability requirements or to allow the re-qualification of components for specific, upgraded, environments;
d) intended as a guideline to sub-contractors who provide RSS as a service.
This document is not intended to provide test plans for specific components or for delivery of certificates of conformance for batches of components. The use of bi-modal Weibull analysis to select and optimize an RSS process without having to estimate the reliability and life time of all items is described. This second edition cancels and replaces the first edition published in 1998. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) this version of the document is a complete rewrite and restructure from the previous version.
- Standard60 pagesEnglish and French languagesale 15% off
IEC 61709:2017 is also available as IEC 61709:2017 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61709:2017 gives guidance on the use of failure rate data for reliability prediction of electric components used in equipment. The method presented in this document uses the concept of reference conditions which are the typical values of stresses that are observed by components in the majority of applications. Reference conditions are useful since they provide a known standard basis from which failure rates can be modified to account for differences in environment from the environments taken as reference conditions. Each user can use the reference conditions defined in this document or use their own. When failure rates stated at reference conditions are used it allows realistic reliability predictions to be made in the early design phase. The stress models described herein are generic and can be used as a basis for conversion of failure rate data given at these reference conditions to actual operating conditions when needed and this simplifies the prediction approach. Conversion of failure rate data is only possible within the specified functional limits of the components. This document also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this document then additional information on the specified conditions can be dispensed with. This document does not provide base failure rates for components – rather it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition. The prediction methodology described in this document assumes that the parts are being used within its useful life. The methods in this document have a general application but are specifically applied to a selection of component types as defined in Clauses 6 to 20 and I.2. This third edition cancels and replaces the second edition, published in 2011. This edition constitutes a technical revision. This third edition is a merger of IEC 61709:2011 and IEC TR 62380:2004.
This edition includes the following significant technical changes with respect to the previous edition: addition of 4.5 Components choice, 4.6 Reliability growth during the deployment phase of new equipment, 4.7 How to use this document, and of Clause 19 Printed circuit boards (PCB) and Clause 20 Hybrid circuits with respect to IEC TR 62380; addition of failure modes of components in Annex A; modification of Annex B, Thermal model for semiconductors, adopted and revised from IEC TR 62380; modification of Annex D, Considerations on mission profile; modification of Annex E, Useful life models, adopted and revised from IEC TR 62380; revision of Annex F (former B.2.6.4), Physics of failure; addition of Annex G (former Annex C), Considerations for the design of a data base on failure rates, complemented with parts of IEC 60319; addition of Annex H, Potential sources of failure rate data and methods of selection; addition of Annex J, Presentation of component reliability data, based on IEC 60319.
The contents of the corrigendum of October 2019 have been included in this copy.
Keywords: failure rate data, reliability prediction of electric components
- Standard373 pagesEnglish languagesale 15% off
- Standard250 pagesEnglish and French languagesale 15% off
IEC 61709:2011 gives guidance on how failure rate data can be employed for reliability prediction of electric components in equipment. Reference conditions are numerical values of stresses that are typically observed by components in the majority of applications. Reference conditions are useful since they are the basis of the calculation of failure rate under any conditions by the application of stress models that take into account the actual operating conditions. This standard also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. This edition includes the following significant technical changes with respect to the previous edition:
- the addition of a number of component types and the updating of models for a large number of component types;
- the addition of annexes on reliability prediction, sources of failure rate data and component classification information.
- Standard181 pagesEnglish and French languagesale 15% off
Provides guidance on reliability stress screening techniques and procedures for electronic components. Is intended for use of a) component manufacturers as a guideline, b) component users as a guideline to negotiate with component manufacturers on stress screening requirements or plan a stress screening process in house due to reliability requirements, c) subcontractors who provide stress screening as a service.
- Standard69 pagesEnglish and French languagesale 15% off
Gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared. The reference conditions adopted are typical of the majority of applications of components in equipment (e.g. telecommunication use, data processing). In this standard it is assumed that the failure rate used under reference conditions is specific to the component i.e. it includes the effect of complexity, technology of the casing, dependence on manufacturers and the manufacturing process, etc.
- Standard83 pagesEnglish and French languagesale 15% off
IEC 62668-1: 2024 Amendment 1
- Standard22 pagesEnglish and French languagesale 15% off
IEC 62668-1:2019 defines requirements for avoiding the use of counterfeit, recycled and fraudulent components used in the aerospace, defence and high performance (ADHP) industries. It also defines requirements for ADHP industries to maintain their intellectual property (IP) for all of their products and services. The risks associated with purchasing components outside of franchised distributor networks are considered in IEC 62668-2. Although developed for the avionics industry, this document can be applied by other high performance and high reliability industries at their discretion.
This first edition cancels and replaces the third edition of IEC TS 62668-1 published in 2016. This edition includes the following significant technical changes with respect to the previous edition:
a) added a reference to AS/EN/JISQ 9100 and AS/EN/JISQ 9110 which contain anti-counterfeit requirements
b) added reference to USA DFAR rule 252.246.7008 and to UK Defence Standard 05-135;
c) added reference to more GAO, OECD and ICC reports
d) updated weblinks and other references;
e) added new Annex E with figures describing how anti-counterfeit documents can be used in supply chains;
f) added a reference to the new IECQ OD 3702 traceability audit;
g) added new definition for re-manufactured components with a warning that these are not recommended.
- Standard176 pagesEnglish languagesale 15% off
- Standard183 pagesEnglish and French languagesale 15% off
IEC TR 62500:2024 which is a Technical Report, considers the targets assigned to highly severe stress tests for operating margins research and robustness improvement of avionics equipment, their basic principles, their scope of application and their implementation process. It is primarily intended for avionics programme managers, electronic equipment project managers, designers, test managers, and dependability team.
This document provides guidance which can apply to all avionics programmes and is of primary interest to the original equipment manufacturers (OEMs) in charge of designing, developing and producing equipment built for these programmes, for obtaining early equipment maturity.
This document can be used in conjunction with IEC 62429, IEC 62506, or both, with regard to dependability aspects related to equipment consisting of hardware with embedded software.
- Technical report37 pagesEnglish languagesale 15% off
IEC 63203-402-2:2024 specifies test methods for measuring and evaluating the performance, reliability, and accuracy of the step counting feature in any wearable device that can count steps (e.g. activity and fitness trackers, smart bands, smart shoes, and smart insoles).
These standard test methods exclude the evaluation of data associated with travel distance or calorie consumption.
- Standard37 pagesEnglish and French languagesale 15% off
IEC 61360-7:2024 specifies the new data dictionary (domain) "IEC 61360-7 - General items" including its generic concepts. The IEC 61360-7 data dictionary provides concepts (dictionary elements, e.g. classes, properties) intended for cross-domain use.
This document has the status of a horizontal publication in accordance with IEC Guide 108.
The IEC 61360-7 data dictionary is published in IEC CDD and is available at https://cdd.iec.ch.
- Standard11 pagesEnglish languagesale 15% off
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.