IEC 61163-2:2020
(Main)Reliability stress screening - Part 2: Components
Reliability stress screening - Part 2: Components
IEC 61163-2:2020 provides guidance on RSS techniques and procedures for electrical, electronic, and mechanical components. This document is procedural in nature and is not, and cannot be, exhaustive with respect to component technologies due to the rapid rate of developments in the component industry. This document is:
a) intended for component manufacturers as a guideline;
b) intended for component users as a guideline to negotiate with component manufacturers on RSS requirements;
c) intended to allow the planning of an RSS process in house to meet reliability requirements or to allow the re-qualification of components for specific, upgraded, environments;
d) intended as a guideline to sub-contractors who provide RSS as a service.
This document is not intended to provide test plans for specific components or for delivery of certificates of conformance for batches of components. The use of bi-modal Weibull analysis to select and optimize an RSS process without having to estimate the reliability and life time of all items is described. This second edition cancels and replaces the first edition published in 1998. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) this version of the document is a complete rewrite and restructure from the previous version.
Déverminage sous contraintes - Partie 2: Composants
IEC 61163-2:2020 fournit des recommandations relatives aux techniques et procédures de RSS pour composants électriques, électroniques et mécaniques. Le présent document est de nature procédurale. En raison de l'évolution rapide de l'industrie des composants, elle n'est pas, ni ne peut être, exhaustive au regard de la technologie des composants. Le présent document est prévu pour:
a) les fabricants de composants, en tant que ligne directrice;
b) les utilisateurs de composants, en tant que ligne directrice pour la négociation relative aux exigences de RSS avec les fabricants de composants;
c) permettre la planification d'un processus de RSS interne, destiné à satisfaire aux exigences de fiabilité, ou pour admettre la requalification des composants pour des environnements spécifiques mis à niveau;
d) les sous-traitants qui proposent le RSS comme un service, en tant que ligne directrice.
Le présent document n'a pas pour but de fournir des plans d'essai pour soumettre des composants spécifiques à l'essai ni de délivrer des certificats de conformité pour des lots de composants. L'usage d'une analyse bimodale de Weibull visant à choisir et optimiser un processus de RSS, sans avoir à évaluer la fiabilité ni la durée de vie de toutes les entités, fait l'objet d'une description. Cette deuxième édition annule et remplace la première édition parue en 1998. Cette édition constitue une révision technique. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) cette version du document a fait l'objet d'une refonte intégrale et a été réorganisée par rapport à la version précédente.
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IEC 61163-2 ®
Edition 2.0 2020-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Reliability stress screening –
Part 2: Components
Déverminage sous contraintes –
Partie 2: Composants
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IEC 61163-2 ®
Edition 2.0 2020-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Reliability stress screening –
Part 2: Components
Déverminage sous contraintes –
Partie 2: Composants
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 03.120.01; 31.020 ISBN 978-2-8322-7910-6
– 2 – IEC 61163-2:2020 © IEC 2020
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Description of reliability stress screening (RSS) . 8
5 Types of RSS . 10
5.1 General . 10
5.2 Constant stress screening . 10
5.3 Step stress screening . 10
5.4 Highly accelerated stress screening (HASS) . 10
6 Managing RSS . 11
6.1 Planning . 11
6.2 Termination of RSS . 12
7 Design of RSS . 12
7.1 General . 12
7.2 Physics of failure . 12
7.3 Common screening procedures . 13
7.4 Characteristics of a well-designed screening procedure . 14
7.5 Screening evaluation . 14
7.6 Selection of samples . 14
7.7 Setting the duration of RSS . 15
8 Managing an RSS programme . 15
8.1 Resources . 15
8.2 Monitoring during RSS . 16
9 Analysis for RSS . 16
9.1 General . 16
9.2 Cost benefit analysis . 16
9.3 Identifying early failures . 16
9.4 Analysis of the outputs of RSS . 17
Annex A (informative) Data analysis . 18
A.1 Symbols . 18
A.2 Weibull analysis . 18
A.3 Design of a reliability stress screening . 19
Annex B (informative) Examples of applications of reliability stress screening
processes . 23
B.1 General . 23
B.2 Transformers . 23
B.3 Connectors . 25
Bibliography . 28
Figure A.1 – Estimation of η and β . 18
Figure A.2 – Nomograph of the cumulative binomial distribution (Larson) . 20
Figure A.3 – Example of a Weibull plot . 21
Figure B.1 – Weibull plot of the bump screening . 25
Figure B.2 – Weibull plot of the pull test . 27
Table 1 – Common screening types and typical defect types precipitated by RSS . 13
Table A.1 – RSS test results . 21
Table A.2 – Screening results for weak populations . 22
– 4 – IEC 61163-2:2020 © IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
RELIABILITY STRESS SCREENING –
Part 2: Components
FOREWORD
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