IEC TR 60068-3-12:2014
(Main)Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
IEC TR 60068-3-12:2014 presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components). Study A addresses requirements needed in the production of high-reliability electronic control units (ECU), as for example in automotive electronics. These requirements include measurement and production tolerances. Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes. This edition includes the following significant technical changes with respect to the previous edition:
- the content has been adapted to the state-of-the-art of reflow-oven technology and termination finishes;
- minor language adjustments were performed.
Essais d'environnement - Partie 3-12: Documentation d'accompagnement et guide - Méthode d'évaluation d'un profil de température possible de brasage sans plomb par refusion
L'IEC TR 60068-3-12:2014 présente deux approches pour établir un profil de température possible pour un processus de brasage sans plomb par refusion utilisant de la pâte à braser au SnAgCu. Ce processus recouvre une grande diversité de produits électroniques, incluant une large gamme de dimensions de boîtier (par exemple, des composants électroniques actifs moulés, des composants passifs et des composants électromécaniques). L'étude A traite les exigences nécessaires pour la fabrication d'unités de commande électroniques (ECU, Electronic Control Unit) de haute fiabilité, par exemple pour l'électronique automobile. Ces exigences contiennent les tolérances de mesure et de fabrication. L'étude B présente les produits électroniques grand public et inclut les caractéristiques des fours de refusion, la conception des cartes et les dimensions des boîtiers.
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IEC TR 60068-3-12 ®
Edition 2.0 2014-10
TECHNICAL
REPORT
RAPPORT
TECHNIQUE
Environmental testing –
Part 3-12: Supporting documentation and guidance – Method to evaluate a
possible lead-free solder reflow temperature profile
Essais d'environnement –
Partie 3-12: Documentation d'accompagnement et guide – Méthode d'évaluation
d'un profil de température possible de brasage sans plomb par refusion
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
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International Standards for all electrical, electronic and related technologies.
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committee,…). It also gives information on projects, replaced clause of IEC publications issued since 2002. Some entries
and withdrawn publications. have been collected from earlier publications of IEC TC 37,
77, 86 and CISPR.
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IEC TR 60068-3-12 ®
Edition 2.0 2014-10
TECHNICAL
REPORT
RAPPORT
TECHNIQUE
Environmental testing –
Part 3-12: Supporting documentation and guidance – Method to evaluate a
possible lead-free solder reflow temperature profile
Essais d'environnement –
Partie 3-12: Documentation d'accompagnement et guide – Méthode d'évaluation
d'un profil de température possible de brasage sans plomb par refusion
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX Q
ICS 19.040 ISBN 978-2-8322-1888-4
– 2 – IEC TR 60068-3-12:2014 IEC 2014
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Basics . 5
3 Boards under investigation . 6
3.1 Test board approach . 6
3.2 Production board approach . 6
4 Temperature tolerances . 7
4.1 Temperature tolerances in Study A . 7
4.2 Temperature tolerance and board size influence in Study B . 8
5 Peak form and width . 9
5.1 Peak form and width in Study A . 9
5.2 Reflow oven investigation in Study B . 9
6 Classification . 10
6.1 Device classification in Study A . 10
6.2 Board classification in Study B . 12
7 Consideration for a lead-free reflow temperature profile. 13
7.1 Determined lead-free reflow temperature profile in Study A . 13
7.2 Lead-free reflow temperature profile approach in Study B . 14
8 Conclusion . 15
Bibliography . 16
Figure 1 – Curve shape for a peak temperature of at least 20 s at 230 °C and 1 s at
233 °C . 6
Figure 2 – Position of the assembled devices and temperature dependence on the
device position . 7
Figure 3 – Lower and upper temperature tolerances of the reflow solder profile . 8
Figure 4 – Temperature tolerance and board size influence . 8
Figure 5 – Hat type peak profile with 40 s at T − 5 K = 255 °C for the small devices
max
and the PCB . 9
Figure 6 – ∆T by different reflow oven capabilities . 10
Figure 7 – Representative test board measurements . 11
Figure 8 – Example of the small board (camcorder) . 13
Figure 9 – Example of the mid-size board (personal computer (PC)) . 13
Figure 10 – Lead-free reflow temperature profile for device qualification . 14
Table 1 – Measured temperatures of devices and values including lower and upper
tolerances . 11
Table 2 – Possible temperature classification of surface mount devices . 12
Table 3 – Proposed requirements for a lead-free reflow profile . 14
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ENVIRONMENTAL TESTING –
Part 3-12: Supporting documentation and guidance –
Method to evaluate a possible lead-free solder
reflow temperature profile
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Pub
...
IEC TR 60068-3-12 ®
Edition 2.0 2014-10
TECHNICAL
REPORT
RAPPORT
TECHNIQUE
Environmental testing –
Part 3-12: Supporting documentation and guidance – Method to evaluate a
possible lead-free solder reflow temperature profile
Essais d'environnement –
Partie 3-12: Documentation d'accompagnement et guide – Méthode d'évaluation
d'un profil de température possible de brasage sans plomb par refusion
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.
Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé Fax: +41 22 919 03 00
CH-1211 Geneva 20 info@iec.ch
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing more than 30 000 terms and
Technical Specifications, Technical Reports and other definitions in English and French, with equivalent terms in 14
documents. Available for PC, Mac OS, Android Tablets and additional languages. Also known as the International
iPad. Electrotechnical Vocabulary (IEV) online.
IEC publications search - www.iec.ch/searchpub IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a More than 55 000 electrotechnical terminology entries in
variety of criteria (reference number, text, technical English and French extracted from the Terms and Definitions
committee,…). It also gives information on projects, replaced clause of IEC publications issued since 2002. Some entries
and withdrawn publications. have been collected from earlier publications of IEC TC 37,
77, 86 and CISPR.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: csc@iec.ch.
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.
A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.
Catalogue IEC - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
Application autonome pour consulter tous les renseignements
Le premier dictionnaire en ligne de termes électroniques et
bibliographiques sur les Normes internationales,
électriques. Il contient plus de 30 000 termes et définitions en
Spécifications techniques, Rapports techniques et autres
anglais et en français, ainsi que les termes équivalents dans
documents de l'IEC. Disponible pour PC, Mac OS, tablettes
14 langues additionnelles. Egalement appelé Vocabulaire
Android et iPad.
Electrotechnique International (IEV) en ligne.
Recherche de publications IEC - www.iec.ch/searchpub
Glossaire IEC - std.iec.ch/glossary
Plus de 55 000 entrées terminologiques électrotechniques, en
La recherche avancée permet de trouver des publications IEC
en utilisant différents critères (numéro de référence, texte, anglais et en français, extraites des articles Termes et
comité d’études,…). Elle donne aussi des informations sur les Définitions des publications IEC parues depuis 2002. Plus
projets et les publications remplacées ou retirées. certaines entrées antérieures extraites des publications des
CE 37, 77, 86 et CISPR de l'IEC.
IEC Just Published - webstore.iec.ch/justpublished
Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications IEC. Just
Published détaille les nouvelles publications parues. Si vous désirez nous donner des commentaires sur cette
Disponible en ligne et aussi une fois par mois par email. publication ou si vous avez des questions contactez-nous:
csc@iec.ch.
IEC TR 60068-3-12 ®
Edition 2.0 2014-10
TECHNICAL
REPORT
RAPPORT
TECHNIQUE
Environmental testing –
Part 3-12: Supporting documentation and guidance – Method to evaluate a
possible lead-free solder reflow temperature profile
Essais d'environnement –
Partie 3-12: Documentation d'accompagnement et guide – Méthode d'évaluation
d'un profil de température possible de brasage sans plomb par refusion
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX Q
ICS 19.040 ISBN 978-2-8322-1888-4
– 2 – IEC TR 60068-3-12:2014 IEC 2014
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Basics . 5
3 Boards under investigation . 6
3.1 Test board approach . 6
3.2 Production board approach . 6
4 Temperature tolerances . 7
4.1 Temperature tolerances in Study A . 7
4.2 Temperature tolerance and board size influence in Study B . 8
5 Peak form and width . 9
5.1 Peak form and width in Study A . 9
5.2 Reflow oven investigation in Study B . 9
6 Classification . 10
6.1 Device classification in Study A . 10
6.2 Board classification in Study B . 12
7 Consideration for a lead-free reflow temperature profile. 13
7.1 Determined lead-free reflow temperature profile in Study A . 13
7.2 Lead-free reflow temperature profile approach in Study B . 14
8 Conclusion . 15
Bibliography . 16
Figure 1 – Curve shape for a peak temperature of at least 20 s at 230 °C and 1 s at
233 °C . 6
Figure 2 – Position of the assembled devices and temperature dependence on the
device position . 7
Figure 3 – Lower and upper temperature tolerances of the reflow solder profile . 8
Figure 4 – Temperature tolerance and board size influence . 8
Figure 5 – Hat type peak profile with 40 s at T − 5 K = 255 °C for the small devices
max
and the PCB . 9
Figure 6 – ∆T by different reflow oven capabilities . 10
Figure 7 – Representative test board measurements . 11
Figure 8 – Example of the small board (camcorder) . 13
Figure 9 – Example of the mid-size board (personal computer (PC)) . 13
Figure 10 – Lead-free reflow temperature profile for device qualification . 14
Table 1 – Measured temperatures of devices and values including lower and upper
tolerances . 11
Table 2 – Possible temperature classification of surface mount devices . 12
Table 3 – Proposed requirements for a lead-free reflow profile . 14
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ENVIRONMENTAL TESTING –
Part 3-12: Supporting documentation and guidance –
Method to evaluate a possible lead-free solder
reflow temperature profile
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights
...
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