IEC 62321-2:2013

Determination of certain substances in electrotechnical products - Part 2: Disassembly, disjointment and mechanical sample preparation

IEC 62321-2:2013 provides strategies of sampling along with the mechanical preparation of samples from electrotechnical products, electronic assemblies and electronic components. These samples can be used for analytical testing to determine the levels of certain substances as described in the test methods in other parts of IEC 62321. Restrictions for substances will vary between geographic regions and from time to time. This Standard describes a generic process for obtaining and preparing samples prior to the determination of any substance which are under concern.
IEC 62321-2:2013 has the status of a horizontal standard in accordance with IEC Guide 108.

Détermination de certaines substances dans les produits électrotechniques - Partie 2: Démontage, désassemblage et préparation mécanique de l'échantillon

L'IEC 62321-2:2013 fournit des stratégies d'échantillonnage ainsi que la préparation mécanique d'échantillons de produits électrotechniques, ensembles électroniques et composants électroniques. Ces échantillons peuvent être utilisés pour un essai analytique visant à déterminer les niveaux de certaines substances, comme décrit dans les méthodes d'essai des autres parties de l'IEC 62321. Les restrictions concernant les substances varient selon les régions géographiques et de temps à autres. La présente norme décrit un processus général permettant d'obtenir et de préparer des échantillons avant de déterminer toute substance posant problème.
L'IEC 62321-2:2013 a le statut de norme horizontale conformément au Guide IEC 108.

General Information

• Status: Published
• Publication Date: 24-Jun-2013
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 13.020.01 - Environment and environmental protection in general
• ICS: 43.040.10 - Electrical and electronic equipment
• ICS: 47.020.60 - Electrical equipment of ships and of marine structures
• Technical Committee: TC 111 - Environmental standardization for electrical and electronic products and systems
• Drafting Committee: WG 3 - TC 111/WG 3
• Current Stage: DELPUB - Deleted Publication
• Start Date: 30-Aug-2019
• Completion Date: 30-Aug-2021

Relations

• Replaces: IEC PAS 62596:2009 - Electrotechnical products - Determination of restricted substances - Sampling procedure - Guidelines
• Effective Date: 05-Sep-2023
• Revised: IEC 62321-2:2021 - Determination of certain substances in electrotechnical products - Part 2: Disassembly, disjointment and mechanical sample preparation
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 62321-2 ®
Edition 1.0 2013-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
HORIZONTAL STANDARD
NORME HORIZONTALE
Determination of certain substances in electrotechnical products –
Part 2: Disassembly, disjointment and mechanical sample preparation

Détermination de certaines substances dans les produits électrotechniques –
Partie 2: Démontage, désassemblage et préparation mécanique de l'échantillon

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IEC 62321-2 ®
Edition 1.0 2013-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
HORIZONTAL STANDARD
NORME HORIZONTALE
Determination of certain substances in electrotechnical products –

Part 2: Disassembly, disjointment and mechanical sample preparation

Détermination de certaines substances dans les produits électrotechniques –

Partie 2: Démontage, désassemblage et préparation mécanique de l'échantillon

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 13.020; 43.040.10 ISBN 978-2-83220-837-3

– 2 – 62321-2 © IEC:2013
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviations . 8
3.1 Terms and definitions . 8
3.2 Abbreviations . 8
4 Introduction to sampling . 9
4.1 Introductory remark . 9
4.2 Requirements and concerns for substances of concern . 9
4.3 Complexity of electrotechnical products and related challenges. 9
4.4 Strategies for sampling . 10
5 Sampling . 13
5.1 Introductory remark . 13
5.2 Complete product . 14
5.3 Partial disassembly . 14
5.4 Complete disassembly . 14
5.5 Partial disjointment . 14
5.6 Complete disjointment . 15
5.7 Considerations of sampling and disjointment . 15
5.7.1 Introductory remark . 15
5.7.2 Sample size required . 15
5.7.3 Sample size versus detection limit . 17
5.7.4 Composite testing of disjointable samples . 17
5.7.5 Non-uniform “homogeneous materials” . 18
5.7.6 Determination of sampling position of homogeneous materials . 19
6 Conclusions and recommendations for sampling . 19
7 Mechanical sample preparation . 20
7.1 Overview . 20
7.1.1 Field of application . 20
7.1.2 Quality assurance . 20
7.2 Apparatus, equipment and materials. 21
7.3 Procedure . 21
7.3.1 Manual cutting . 21
7.3.2 Coarse grinding/milling . 22
7.3.3 Homogenizing. 22
7.3.4 Fine grinding/milling . 22
7.3.5 Very fine grinding of polymers and organic materials . 22
Annex A (informative) Examples of procedures for sampling and disjointment . 23
Annex B (informative) Probability of the presence of certain substances . 32
Annex C (informative) Composite testing and sampling . 35
Annex D (informative) Tools used in sampling. 38
Annex E (informative) Examples of mobile phone disassembly and component
disjointment . 39
Bibliography . 50

62321-2 © IEC:2013 – 3 –
Figure 1 – Generic iterative procedure for sampling . 11
Figure 2 – Cross-section of a 900 µm wide lead oxide-based resistor (SMD) . 19
Figure A.1 – Methodology for sampling and disjointment . 24
Figure A.2 – Sampling of DVD player . 25
Figure A.3 – Sampling of CRT . 26
Figure A.4 – Sampling of LCD TV . 27
Figure A.5 – Sampling of PDA/phone . 28
Figure A.6 – Sampling of desk fan . 29
Figure A.7 – Sampling of components – Thick film resistor . 30
Figure A.8 – Sampling of components – SMD potentiometer . 31
Figure D.1 – Hot gas gun for removing the electronic components . 38
Figure D.2 – Vacuum pin to remove the target electronic devices . 38
Figure E.1 – Mobile phone type A with battery charger and camera lens cap . 39
Figure E.2 – Mobile phone type A with battery and back cover removed . 40
Figure E.3 – Partial disassembly of a mobile phone (type B) into its major components . 41
Figure E.4 – Complete disassembly of the key pad . 42
Figure E.5 – Complete disassembly of the bottom housing . 42
Figure E.6 – Complete disassembly of the other housing/frame . 43
Figure E.7 – Components of the TFT display of the mobile phoneafter partial
disjointment . 43
Figure E.8 – Components of the main PWB of the mobile phone after partial
disjointment . 44
Figure E.9 – Disjointment of lead frame component . 46
Figure E.10 – BGA package prior to disjointment . 47
Figure E.11 – BGA package disjointed by the hand removal procedure . 47
Figure E.12 – Solder ball material collected from BGA using a hand removal procedure . 48
Figure E.13 – BGA solder ball removal using the ball shear procedure . 48

Table 1 – Minimum number of lead frame samples required for analytical testing . 16
Table 2 – Levels of a certain substance in a composite sample . 18
Table B.1 – Probability of the presence of certain substances in materials and

components used in electrotechnical products (1 of 3) . 32
Table C.1 – Calculated maximum concentration for a composite sample based on
detection limit .
...