IEC TS 62239-1:2015

Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan

IEC TS 62239-1:2015(E) defines the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that all technical requirements are accomplished. This document provides an aid in the aerospace certification process. Although developed for the avionics industry, this process may be applied by other industrial sectors. This new edition includes the following significant technical changes with respect to the previous one:
- rationalization of the number of requirements;
- consistency in the use of certain terms;
- addition of a requirements matrix;
- updates to various specifications;
- addition of certain test methods.

General Information

• Status: Replaced
• Publication Date: 12-Apr-2015
• ICS: 03.100.50 - Production. Production management
• ICS: 31.020 - Electronic components in general
• ICS: 49.060 - Aerospace electric equipment and systems
• Technical Committee: TC 107 - Process management for avionics
• Current Stage: DELPUB - Deleted Publication
• Start Date: 31-Aug-2017
• Completion Date: 24-Sep-2018

Relations

• Replaced By: IEC 62239-1:2018 - Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
• Effective Date: 05-Sep-2023
• Revises: IEC TS 62239-1:2012 - Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC TS 62239-1 ®
Edition 2.0 2015-04
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Management plan –
Part 1: Preparation and maintenance of an electronic components management
plan
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IEC TS 62239-1 ®
Edition 2.0 2015-04
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Management plan –

Part 1: Preparation and maintenance of an electronic components management

plan
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-2608-7

– 2 – IEC TS 62239-1:2015 © IEC 2015

CONTENTS
FOREWORD . 4

INTRODUCTION . 6

1 Scope . 7

2 Normative references . 7

3 Terms, definitions and abbreviations . 7

3.1 Terms and definitions . 8

3.2 Abbreviations . 12
4 Technical requirements . 13
4.1 General . 13
4.2 Component selection . 14
4.2.1 General. 14
4.2.2 Application conditions for use . 14
4.2.3 Availability and durability . 14
4.2.4 Additional performance . 14
4.2.5 Component identification . 14
4.3 Component application . 15
4.3.1 General. 15
4.3.2 Electromagnetic compatibility (EMC) . 15
4.3.3 Derating and stress analysis . 15
4.3.4 Thermal analysis . 16
4.3.5 Mechanical analysis . 17
4.3.6 Testing, testability, and maintainability . 17
4.3.7 Avionics radiation environment . 18
4.3.8 Management of lead-free termination finish and soldering . 18
4.3.9 Counterfeited, fraudulent and recycled component avoidance . 18
4.3.10 Moisture and corrosion . 19
4.3.11 Additional customer related application requirements . 19
4.4 Component qualification . 19
4.4.1 General. 19
4.4.2 Minimum component qualification requirements . 20
4.4.3 Original component manufacturer quality management . 20
4.4.4 Original component manufacturer process management approval . 20

4.4.5 Demonstration of component qualification . 20
4.4.6 Qualification of components from a supplier that is not qualified . 22
4.4.7 Distributor process management approval . 22
4.4.8 Subcontractor assembly facility quality and process management
approval . 23
4.5 Continuous component quality assurance . 23
4.5.1 General quality assurance requirements . 23
4.5.2 On-going component quality assurance . 23
4.5.3 Plan owner in-house continuous monitoring . 24
4.5.4 Component design and manufacturing process change monitoring . 24
4.6 Component dependability . 25
4.6.1 General. 25
4.6.2 Component availability and associated risk assessment . 25
4.6.3 Component obsolescence . 25

4.6.4 Proactive measures . 26

4.6.5 Component obsolescence awareness . 26

4.6.6 Reporting . 26

4.6.7 Semiconductor reliability and wear out . 26

4.6.8 Reliability assessment . 26

4.7 Component compatibility with the equipment manufacturing process . 27

4.8 Component data . 27

4.8.1 General. 27

4.8.2 Minimum component data requirements . 28

4.9 Configuration control . 28

4.9.1 General. 28
4.9.2 Alternative components. 29
4.9.3 Alternative sources . 29
4.9.4 Equipment change documentation . 29
4.9.5 Customer notifications and approvals . 29
4.9.6 Focal organization . 30
5 Plan administration requirements . 30
5.1 Plan organization . 30
5.2 Plan terms and definitions . 30
5.3 Plan focal point . 30
5.3.1 Primary interface . 30
5.3.2 Plan focal point responsibilities . 30
5.4 Plan references. 30
5.5 Plan applicability . 30
5.6 Plan implementation . 31
5.6.1 ECMP compliance . 31
5.6.2 Plan objectives . 31
5.6.3 Plan owner subcontracted activities . 31
5.7 Plan acceptance . 31
5.8 Plan maintenance . 31
Annex A (informative) Requirement matrix for IEC TS 62239-1 . 32
Annex B (informative) Typical qualification requirements and typical component
minimum qualification requirements . 53
Annex C (informative) Semiconductor reliability and wear out . 57
Annex D (informative) Guidelines for environmental protection techniques and for

comparison of components specifications . 58
Bibliography . 73

Figure 1 – Suspect components perimeter . 19

Table A.1 – Requirements matrix . 32
Table B.1 – Typical qualification requirements and typical component minimum
qualification requirements . 54
Table D.1 – Environmental protection techniques to be considered during the avionics
design process . 58
Table D.2 – Guidelines for the comparison of internationally available component
specifications – Microcircuits . 63

– 4 – IEC TS 62239-1:2015 © IEC 2015

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
PROCESS MANAGEMENT FOR AVIONICS –

MANAGEMENT PLAN –
Part 1: Preparation and maintenance of an

electronic components management plan

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the
...