IEC 62137:2004/COR1:2005

Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

General Information

• Status: Replaced
• Publication Date: 26-Jan-2005
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: TC 91 - Electronics assembly technology
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 09-Oct-2014

Relations

• Replaced By: IEC 62137-4:2014 - Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
• Effective Date: 05-Sep-2023
• Corrects: IEC 62137:2004 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 62137
(First edition – 2004)
ENVIRONMENTAL AND ENDURANCE TESTING – TEST METHODS FOR SURFACE-MOUNT BOARDS OF

AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN

CORRIGENDUM 1
Page 5
2 Normative references
Delete:
IEC 61190-1-1, Attachment materials for electronic assemblies – Part 1-1: Requirements
for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-2, Attachment materials for electronic assemblies – Part 1-2: Requirements
for solder pastes for high-quality interconnections in electronics assembly
IEC 61190-1-3, Attachment materials for electronic assemblies – Part 1-3: Requirements
for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic
soldering applications
Page 16
A.2.4.4 Post-treatment (flux removal)
First sentence
Instead of:
“(propanol)”
read:
“(isopropanol)”.
Page 17
A.3.4.1 Soldering process, a) Pre-treatment
...