SIST EN 100012:2002
(Main)Basic Specification: X-ray inspection of electronic components
Basic Specification: X-ray inspection of electronic components
Supersedes CECC 00 012:1985
Grundspezifikation: Röntgenprüfung von Bauelementen der Elektronik
Spécification de base: Contrôle aux rayons X des composants électroniques
Basic specification: X-ray inspection of electronic components
General Information
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Basic specification: X-ray inspection of electronic componentsGrundspezifikation: Röntgenprüfung von Bauelementen der ElektronikSpécification de base: Contrôle aux rayons X des composants électroniquesBasic Specification: X-ray inspection of electronic components31.020Elektronske
...
This May Also Interest You
Although it has always existed to some extent, obsolescence of electronic components, and particularly integrated circuits, has become increasingly intense over the last few years. Indeed, with the existing technological boom, the commercial life of a component has become very short compared with the life of industrial equipment such as those encountered in the aeronautical field, the railway industry or the energy sector. The many solutions enabling obsolescence to be resolved are now identified. However, selecting one of these solutions must be preceded by a case by case technical and economic feasibility study, depending on whether storage is envisaged for field service or production. Remedial storage as soon as components are no longer marketed. Preventive storage anticipating declaration of obsolescence. Taking into account the expected life of some installations, sometimes covering several decades, the qualification times, and the unavailability costs, which can also be very high, the solution to be adopted to resolve obsolescence must often be rapidly implemented. This is why the solution retained in most cases consists in systematically storing components which are in the process of becoming obsolescent. The technical risks of this solution are, a priori, fairly low. However, it requires the perfect mastery of the implemented process, and especially of the storage environment, although this mastery becomes critical when it comes to long term storage. All handling, protection, storage and test operations should be performed in accordance with the technology requirements of the component.
- Technical specification30 pagesEnglish languagesale 10% offe-Library read for×1 day
This European Standard specifies a marking of electrical and electronic equipment in accordance with Article 11(2) of Directive 2002/96/EC (WEEE); that applies to electrical and electronic equipment falling under Annex IA of Directive 2002/96/EC, provided the equipment concerned is not part of another type of equipment that does not fall within the scope of this Directive. Annex IB of Directive 2002/96/EC contains an indicative list of the products, which fall under the categories set out in Annex IA of this Directive; that serves to clearly identify the producer of the equipment and that the equipment has been put on the market after 13 August 2005. The definition of a technical carrier medium for identifying the producer, such as a barcode, electronic data medium or microchip, is not covered by this standard.
- Standard8 pagesEnglish languagesale 10% offe-Library read for×1 day
Is applicable to bulk case packaging capable of containing surface mounting components. The bulk case is designed for transport and storage of components and the supply of components directly or by an appropriate feeder to the placement machine. The bulk case is attached to the automatic handling machine by means of a coupling interface
- Standard17 pagesEnglish languagesale 10% offe-Library read for×1 day
IEC 60286-2:2022 applies to the tape packaging of components with two or more unidirectional leads for use in electronic equipment. It provides dimensions and tolerances necessary to tape components with unidirectional leads. In general, the tape is applied to the component leads.
It covers requirements for taping techniques used with equipment for automatic handling, pre-forming of leads, insertion and other operations and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes.
This edition includes the following significant technical changes with respect to the previous edition:
a) complete revision of structure;
b) consolidation of essential parameters and requirements in Clause 4.
- Standard37 pagesEnglish languagesale 10% offe-Library read for×1 day
- Draft33 pagesEnglish languagesale 10% offe-Library read for×1 day
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.
This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
- Standard58 pagesEnglish languagesale 10% offe-Library read for×1 day
- Draft54 pagesEnglish languagesale 10% offe-Library read for×1 day
This part of IEC 60050 gives the general terminology used in environmental standardization
for electrical and electronic products and systems. It has the status of a horizontal standard in
accordance with IEC Guide 108, Guidelines for ensuring the coherency of IEC publications –
Application of horizontal standards.
This terminology is consistent with the terminology developed in the other specialized parts of
the IEV.
This horizontal standard is primarily intended for use by technical committees in the
preparation of standards in accordance with the principles laid down in IEC Guide 108.
One of the responsibilities of a technical committee is, wherever applicable, to make use of
horizontal standards in the preparation of its publications. The content of this horizontal
standard will not apply unless specifically referred to or included in the relevant publications.
- Standard61 pagesEnglish and French languagesale 10% offe-Library read for×1 day
This document specifies a marking
— of electrical and electronic equipment (EEE) with a view to minimizing the disposal of waste EEE (WEEE)
as unsorted waste and to facilitating its separate collection.
NOTE 1 This is in accordance with Article 14(4) of Directive 2012/19/EU (WEEE, recast)
— that serves to clearly identify the producer of the equipment and
— that the equipment has been put on the market after 13 August 2005.
NOTE 2 This is in accordance with Articles 12(3) and 15(2) of Directive 2012/19/EU (WEEE, recast)
— that applies to categories of electrical and electronic equipment subject to WEEE collection, treatment,
recovery and environmentally sound disposal as defined by European and national regulations, provided
the equipment concerned is not part of another type of equipment that does not fall within the scope of
above mentioned regulations.
NOTE 3 This is in accordance with Article 2 and Annexes I – IV of Directive 2012/19/EU (WEEE, recast) [1]
The definition of a technical carrier medium for machine based identifying the producer, such as a barcode,
electronic data medium or microchip, is not covered by this document.
- Standard10 pagesEnglish languagesale 10% offe-Library read for×1 day
- Draft10 pagesEnglish languagesale 10% offe-Library read for×1 day
This International Standard defines common charging interoperability guidelines for power sources (external power supplies (EPS) and other Sources) used with computing and consumer electronics devices that implement the IEC 62680-1-3: USB Type-C®1 Cable and Connector Specification.
This document defines normative requirements for an EPS to ensure interoperability, in particular it specifies the data communicated from a power source to a device (Figure 1) and certain safety elements of the EPS, cable, and device. While the requirements focus of this document is on the EPS (External Power Supply) and the behavior at its USB Type-C connector interface, it is also important to comprehend cable assembly and device capabilities and behaviors in order to assure end-to-end charging interoperability. The scope does not apply to all design aspects of an EPS. An EPS compliant with this standard is also expected to follow other applicable global standards and regulatory compliance requirements for aspects such as product safety, EMC and energy efficiency.
[Figure 1]
This International Standard provides recommendations for the behavior of a device when used with a power source compliant with this document. This International Standard specifies the minimum hardware specification for an EPS implementing IEC 62680-1-3: USB Type-C. This document also specifies the data objects used by a charging system utilizing IEC 62680-1-2: USB Power Delivery Specification to understand the identity, design and performance characteristics, and operating status of an external power supply. IEC 62680-1-2 and IEC 62680-1-3 focus on power delivery applications ranging to 100W for a variety of computing and consumer electronic devices including notebook computers, tablets, smartphones, small form-factor desktops, monitor displays and other related multimedia devices.
Future updates to IEC 62680-1-2 and IEC 62680-1-3 specifications will extend to enable power delivery applications that require more than 100W while remaining within the technical limitations of the USB Type-C cable and connector solution.
This document relies on established mechanical and electrical specifications, and communication protocols specified by IEC 62680-1-2 and IEC 62680-1-3. These specifications support methods for establishing the best performing interoperability between untested combinations of EPS and devices with the aim of improving consumer satisfaction.
Information describing the USB charging interoperability model, overview of USB Type-C and USB Power Delivery specifications, and factors for charging performance are also provided to support implementation of this standard.
- Standard40 pagesEnglish languagesale 10% offe-Library read for×1 day
- Draft36 pagesEnglish languagesale 10% offe-Library read for×1 day
This part of IEC 62321 provides strategies of sampling along with the mechanical preparation
of samples from electrotechnical products. These samples can be used for analytical testing to
determine the levels of certain substances as described in the test methods in other parts of
the IEC 62321 series. Restrictions for substances will vary between geographic regions and
can be updated on a regular basis. This document describes a generic process for obtaining
and preparing samples prior to the determination of any substance of concern.
This document does not provide:
– full guidance on each and every product that could be classified as electrotechnical product.
Since there is a huge variety of electrotechnical parts, with various structures and
compositions, along with the continuous innovations in the industry, it is unrealistic to
attempt to provide procedures for the disjointment of every type of part;
– guidance regarding other routes to gather additional information on certain substances in a
product, although the information collected has relevance to the sampling strategies in this
document;
– safe disassembly and mechanical disjointment instructions related to electrotechnical
products (e.g. mercury-containing switches) and the recycling industry (e.g. how to handle
CRTs or the safe removal of batteries). See IEC 62554 [1] 1 for the disjointment and
mechanical sample preparation of mercury-containing fluorescent lamps;
– sampling procedures for packaging and packaging materials;
– analytical procedures to measure the levels of certain substances. This is covered by other
standards (e.g. other parts of the IEC 62321 series), which are referred to as "test
standards" in this document;
– guidelines for assessment of compliance.
This document has the status of a horizontal standard in accordance with IEC Guide 108 [2].
- Standard54 pagesEnglish languagesale 10% offe-Library read for×1 day
- 07-Dec-2021
- 29.020
- 31.020
- 71.040.50
- 2011/65/EU
- ITIV
This part of IEC 62321 specifies the screening analysis of polybrominated biphenyls (PBBs), polybrominated diphenyl ethers (PBDEs), di-isobutyl phthalate (DIBP), di-n-butyl phthalate (DBP), benzylbutyl phthalate (BBP), di-(2-ethylhexyl) phthalate (DEHP), di-n-octyl phthalate (DNOP), di-isononyl phthalate (DINP), and di-isodecyl phthalate (DIDP) in polymers of electrotechnical products using the analytical technique of gas chromatography-mass spectrometry using a pyrolyser/thermal desorption accessory (Py/TD-GC-MS). This test method has been evaluated through the analysis of PP (polypropylene), PS (polystyrene), and PVC (polyvinyl chloride) materials containing deca-BDE between 100 mg/kg and 1 000 mg/kg and individual phthalates between 100 mg/kg to 4 000 mg/kg as depicted in Annex J. Use of the methods described in this document for other polymer types, PBBs (mono-deca), PBDEs (mono-deca) and phthalates or concentration ranges other than those specified above has not been specifically evaluated. This document has the status of a horizontal standard in accordance with IEC Guide 108 [1]1.
- Standard45 pagesEnglish languagesale 10% offe-Library read for×1 day
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.