SIST EN 100012:2002

Basic Specification: X-ray inspection of electronic components

Supersedes CECC 00 012:1985

Grundspezifikation: Röntgenprüfung von Bauelementen der Elektronik

Spécification de base: Contrôle aux rayons X des composants électroniques

Basic specification: X-ray inspection of electronic components

General Information

• Status: Published
• Publication Date: 31-Aug-2002
• ICS: 31.020 - Electronic components in general
• Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Sep-2002
• Due Date: 01-Sep-2002
• Completion Date: 01-Sep-2002
• Ref Project: EN 100012:1995 - Basic Specification: X-ray inspection of electronic components

Overview

EN 100012:1995 - Basic Specification: X‑ray inspection of electronic components is a European Committee for Electrotechnical Standardization (CLC) basic specification that defines general requirements for performing X‑ray (radiographic) inspection on electronic components. It supersedes CECC 00 012:1985 and is catalogued in the ICS under 31.020 (Electronic components in general). The standard establishes a common framework for non‑destructive X‑ray examination used across manufacturing, test laboratories and quality assurance processes.

Key topics and requirements

While the document is a basic specification rather than a detailed method standard, it addresses core technical topics needed to implement reliable X‑ray inspection:

• Scope and objectives - defines the purpose of X‑ray inspection for component integrity, assembly verification and failure analysis.
• Inspection principles - outlines radiographic inspection concepts relevant to electronic components and assemblies.
• Equipment and image quality - requirements for X‑ray systems, detectors, image capture and factors affecting image resolution and contrast.
• Procedure and test setup - guidance on sample preparation, positioning, magnification and inspection views to reveal internal features.
• Operator competence and training - expectations for qualified personnel to interpret radiographic images and report findings.
• Calibration and traceability - requirements for maintaining equipment calibration, reference artifacts and documented procedures.
• Documentation and reporting - formats for inspection records, defect classification and traceable reporting.
• Safety and regulatory considerations - high‑level requirements for radiation safety and compliance with applicable national regulations.

Note: EN 100012:1995 provides a baseline specification; specific inspection parameters, acceptance criteria and advanced imaging methods are typically referenced from complementary technical standards or company procedures.

Applications

EN 100012:1995 is useful for organizations that need a standardized baseline for X‑ray inspection of electronic components, including:

• Component manufacturers - incoming/outgoing inspection and process control.
• Electronics assemblers - inspection of solder joints, BGAs, CSPs and hidden interconnects.
• Test & failure‑analysis labs - non‑destructive internal examination for root cause analysis.
• Quality and compliance teams - establishing traceable inspection programs and supplier audits.
• R&D teams - prototype verification and internal structure assessment.

Keywords: EN 100012:1995, X‑ray inspection, electronic components, radiographic inspection, non‑destructive testing, NDT, solder joint inspection, component inspection.

Related standards

For practical implementation, EN 100012:1995 is typically used alongside other technical and safety standards such as IEC/EN documents on radiation safety, relevant IPC standards for soldering and assembly inspection, and company‑specific acceptance criteria and test methods.

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Basic specification: X-ray inspection of electronic componentsGrundspezifikation: Röntgenprüfung von Bauelementen der ElektronikSpécification de base: Contrôle aux rayons X des composants électroniquesBasic Specification: X-ray inspection of electronic components31.020Elektronske
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