SIST EN 61189-2-719:2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)

This part of IEC 61189 specifies a test method of relative permittivity and loss tangent of
printed board and assembly materials, expected to be determined 2 to 10 of relative
permittivity and 0,001 to 0,050 of loss tangent at 500 MHz to 10 GHz.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-719: Prüfverfahren für Materialien von Verbindungsstrukturen - Relative Permittivität und Verlustfaktor (500 MHz bis 10 GHz)

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-719: Méthodes d'essai pour les cartes imprimées et les matériaux d'assemblage - Permittivité relative et tangente de perte (500 MHz à 10 GHz)

L'IEC 61189-2-719:2016 spécifie une méthode d'essai de la permittivité relative et de la tangente de perte des cartes imprimées et des matériaux d'assemblage, les valeurs prévues étant comprises entre 2 et 10 pour la permittivité relative et entre 0,001 et 0,050 pour la tangente de perte entre 500 MHz et 10 GHz.

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-719. del: Preskusne metode za tiskana vezja in montažni material - Relativna permitivnost in tangenta izgub (500 MHz do 10 GHz)

Ta del standarda IEC 61189 določa preskusno metodo za relativno permitivnost in tangento izgub tiskanih vezij in montažnega materiala, s pričakovano vrednostjo 2 do 10 za relativno permitivnost in 0,001 do 0,050 za tangento izgub pri 500 MHz do 10 GHz.

General Information

• Status: Published
• Publication Date: 20-Mar-2017
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 06-Mar-2017
• Due Date: 11-May-2017
• Completion Date: 21-Mar-2017
• Ref Project: EN 61189-2-719:2016 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61189-2-719:2017
01-april-2017
3UHVNXVQHPHWRGH]DHOHNWULþQHPDWHULDOHWLVNDQDYH]MDLQGUXJHSRYH]RYDOQH
VWUXNWXUHLQVHVWDYHGHO3UHVNXVQHPHWRGH]DWLVNDQDYH]MDLQPRQWDåQL
PDWHULDO5HODWLYQDSHUPLWLYQRVWLQWDQJHQWDL]JXE0+]GR*+]
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-719: Test methods for printed board and assembly materials -
Relative permittivity and loss tangent (500MHz to 10GHz)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 2-719: Méthodes d'essai pour les
cartes imprimées et les matériaux d'assemblage - Permittivité relative et tangente de
perte (500 MHz à 10 GHz)
Ta slovenski standard je istoveten z: EN 61189-2-719:2016
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61189-2-719:2017 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

SIST EN 61189-2-719:2017

---------------------- Page: 2 ----------------------

SIST EN 61189-2-719:2017


EUROPEAN STANDARD EN 61189-2-719

NORME EUROPÉENNE

EUROPÄISCHE NORM
October 2016
ICS 31.180

English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies -
Part 2-719: Test methods for materials for interconnection
structures - Relative permittivity and loss tangent (500 MHz to 10
GHz)
(IEC 61189-2-719:2016)
Méthode d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen -
ensembles - Partie 2-719: Méthodes d'essai des matériaux Teil 2-719: Prüfverfahren für Materialien von
pour structures d'interconnexion - Permittivité relative et Verbindungsstrukturen - Relative Permittivität und
tangente de perte (500 MHz à 10 GHz) Verlustfaktor (500 MHz bis 10 GHz)
(IEC 61189-2-719:2016) (IEC 61189-2-719:2016)
This European Standard was approved by CENELEC on 2016-08-16. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 61189-2-719:2016 E

---------------------- Page: 3 ----------------------

SIST EN 61189-2-719:2017
EN 61189-2-719:2016
European foreword
The text of document 91/1366/FDIS, future edition 1 of IEC 61189-2-719, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 61189-2-719:2016.

The following dates are fixed:
(dop) 2017-05-16
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2019-08-16
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 61189-2-719:2016 was approved by CENELEC as a
European Standard without any modification.
2

---------------------- Page: 4 ----------------------

SIST EN 61189-2-719:2017
EN 61189-2-719:2016
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu

Publication Year Title EN/HD Year

IEC 60194 -  Printed board design, manufacture and - -
assembly - Terms and definitions

3

---------------------- Page: 5 ----------------------

SIST EN 61189-2-719:2017

---------------------- Page: 6 ----------------------

SIST EN 61189-2-719:2017




IEC 61189-2-719

®


Edition 2.0 2016-07




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –

Part 2-719: Test methods for materials for interconnection structures – Relative


permittivity and loss tangent (500 MHz to 10 GHz)



Méthode d'essai pour les matériaux électriques, les cartes imprimées et autres


structures d'interconnexion et ensembles –

Partie 2-719: Méthodes d'essai des matériaux pour structures d'interconnexion –

Permittivité relative et tangente de perte (500 MHz à 10 GHz)










INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.180 ISBN 978-2-8322-3520-1



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 7 ----------------------

SIST EN 61189-2-719:2017
– 2 – IEC 61189-2-719:2016 © IEC 2016
CONTENTS
FOREWORD. 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test methods. 6
4.1 Test specimens . 6
4.1.1 General . 6
4.1.2 Size . 6
4.1.3 Thickness of dielectric . 6
4.1.4 Thickness of copper foil . 6
4.2 Test set . 7
4.3 Test fixture . 9
4.4 Test equipment . 11
4.5 Procedure . 11
4.5.1 Measurements . 11
4.5.2 Calculations . 12
5 Report . 14
6 Additional information . 14
6.1 Accuracy . 14
6.2 Additional information concerning fixtures and results . 14
Annex A (informative) Example of test fixture and test results . 15
A.1 Dimension example of a test fixture . 15
A.2 Example of test results . 19

Figure 1 – One side of board A . 7
Figure 2 – Another side of board A . 7
Figure 3 – Cross section between X1 and X2 of board A . 8
Figure 4 – Cross section between Y1 and Y2 of board A . 8
Figure 5 – One side of board B . 8
Figure 6 – Another side of board B . 9
Figure 7 – Cross-section between X1 and X2 of board B . 9
Figure 8 – Cross section between Y1 and Y2 of board B . 9
Figure 9 – Top view of test fixture . 10
Figure 10 – Horizontal cross section of test fixture with test set . 10
Figure 11 – Side view of test fixture . 10
Figure 12 – Vertical cross-section of test fixture with test set . 11
Figure 13 – Example of VNA raw data . 12
Figure 14 – Envelopes of raw data from VNA measurement . 14
Figure A.1 – Parts of test fixture . 17
Figure A.2 – Construction of parts . 18
Figure A.3 – Part for connector attachment . 18
Figure A.4 – Attachment with connector . 19
Figure A.5 – An example of measured ε data, PTFE CCL . 19
r

---------------------- Page: 8 ----------------------

SIST EN 61189-2-719:2017
IEC 61189-2-719:2016 © IEC 2016 – 3 –
Figure A.6 – An example of measured tanδ data, PTFE CCL . 20

---------------------- Page: 9 ----------------------

SIST EN 61189-2-719:2017
– 4 – IEC 61189-2-719:2016 © IEC 2016
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-719: Test methods for materials for interconnection structures –
Relative permittivity and loss tangent (500 MHz to 10 GHz)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Pu
...