Soft solder alloys - Chemical compositions and forms (ISO 9453:2006)

This International Standard specifies the requirements for  chemical composition for the following families of soft solder  alloys:-tin-lead, with and without antimony, bismuth, cadmium,  copper, and silver;-tin-antimony;-tin-bismuth;-tin-copper, with  and without silver;-tin-indium, with and without silver and  bismuth;-tin-silver, with and without copper and bismuth;-tin- zinc, with and without bismuth. It also includes an indication of  the forms generally available.

Weichlote - Chemische Zusammensetzung und Lieferformen (ISO 9453:2006)

Diese Internationale Norm legt die Anforderungen für die chemische Zusammensetzung der folgenden Gruppen von Weichloten fest:
-   Zinn-Blei, mit und ohne Antimon, Bismut, Cadmium, Kupfer und Silber;
-   Zinn-Antimon;
-   Zinn-Bismut;
-   Zinn-Kupfer, mit und ohne Silber;
-   Zinn-Indium, mit und ohne Silber und Bismut;
-   Zinn-Silber, mit und ohne Kupfer und Bismut;
-   Zinn-Zink, mit und ohne Bismut.
Angaben für allgemein erhältliche Lieferformen sind ebenfalls erfasst.

Alliages de brasage tendre - Compositions chimiques et formes (ISO 9453:2006)

L'ISO 9453:2006 spécifie les exigences concernant les compositions chimiques pour les familles suivantes de produits de brasage tendre:
étain-plomb, avec ou sans antimoine, bismuth, cadmium, cuivre et argent;
étain-antimoine;
étain-bismuth;
étain-cuivre, avec ou sans argent;
étain-indium, avec ou sans argent et bismuth;
étain-argent, avec ou sans cuivre et bismuth;
étain-zinc, avec ou sans bismuth.
Des indications relatives aux formes couramment disponibles sont également incluses dans l'ISO 9453:2006.

Mehke spajke – Kemijske sestave in oblike (ISO 9453:2006)

General Information

Status
Withdrawn
Publication Date
28-Feb-2007
Withdrawal Date
13-Aug-2014
Technical Committee
Current Stage
9900 - Withdrawal (Adopted Project)
Start Date
14-Aug-2014
Due Date
06-Sep-2014
Completion Date
14-Aug-2014

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Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN ISO 9453:2007
01-marec-2007
1DGRPHãþD
SIST EN 29453:1998
Mehke spajke – Kemijske sestave in oblike (ISO 9453:2006)
Soft solder alloys - Chemical compositions and forms (ISO 9453:2006)
Weichlote - Chemische Zusammensetzung und Lieferformen (ISO 9453:2006)
Alliages de brasage tendre - Compositions chimiques et formes (ISO 9453:2006)
Ta slovenski standard je istoveten z: EN ISO 9453:2006
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
SIST EN ISO 9453:2007 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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EUROPEAN STANDARD
EN ISO 9453
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2006
ICS 25.160.50 Supersedes EN 29453:1993
English Version
Soft solder alloys - Chemical compositions and forms (ISO
9453:2006)
Alliages de brasage tendre - Compositions chimiques et Weichlote - Chemische Zusammensetzung und
formes (ISO 9453:2006) Lieferformen (ISO 9453:2006)
This European Standard was approved by CEN on 22 September 2006.
CEN members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national
standards may be obtained on application to the Central Secretariat or to any CEN member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN member into its own language and notified to the Central Secretariat has the same status as the official
versions.
CEN members are the national standards bodies of Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France,
Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania,
Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom.
EUROPEAN COMMITTEE FOR STANDARDIZATION
COMITÉ EUROPÉEN DE NORMALISATION
EUROPÄISCHES KOMITEE FÜR NORMUNG
Management Centre: rue de Stassart, 36  B-1050 Brussels
© 2006 CEN All rights of exploitation in any form and by any means reserved Ref. No. EN ISO 9453:2006: E
worldwide for CEN national Members.

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EN ISO 9453:2006 (E)





Foreword


This document (EN ISO 9453:2006) has been prepared by Technical Committee ISO/TC 44
"Welding and allied processes" in collaboration with Technical Committee CEN/TC 121
"Welding", the secretariat of which is held by DIN.

This European Standard shall be given the status of a national standard, either by publication of
an identical text or by endorsement, at the latest by April 2007, and conflicting national
standards shall be withdrawn at the latest by April 2007.

This document supersedes EN 29453:1993.

According to the CEN/CENELEC Internal Regulations, the national standards organizations of
the following countries are bound to implement this European Standard: Austria, Belgium,
Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary,
Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom.


Endorsement notice

The text of ISO 9453:2006 has been approved by CEN as EN ISO 9453:2006 without any
modifications.

2

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INTERNATIONAL ISO
STANDARD 9453
Second edition
2006-10-01


Soft solder alloys — Chemical
compositions and forms
Alliages de brasage tendre — Compositions chimiques et formes





Reference number
ISO 9453:2006(E)
©
ISO 2006

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ISO 9453:2006(E)
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ii © ISO 2006 – All rights reserved

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ISO 9453:2006(E)
Contents Page
Foreword. iv
Introduction . v
1 Scope .1
2 Normative references .1
3 Terms and definitions .1
4 Chemical composition .2
5 Forms of delivery.2
6 Sampling and analysis .2
7 Marking, labelling and packaging .2
Annex A (informative) Comparison between alloy numbers in ISO 9453 and short names and
chemical compositions according to IEC 61190-1-3.8
Bibliography .10

© ISO 2006 – All rights reserved iii

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ISO 9453:2006(E)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards bodies
(ISO member bodies). The work of preparing International Standards is normally carried out through ISO
technical committees. Each member body interested in a subject for which a technical committee has been
established has the right to be represented on that committee. International organizations, governmental and
non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely with the
International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization.
International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2.
The main task of technical committees is to prepare International Standards. Draft International Standards
adopted by the technical committees are circulated to the member bodies for voting. Publication as an
International Standard requires approval by at least 75 % of the member bodies casting a vote.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. ISO shall not be held responsible for identifying any or all such patent rights.
ISO 9453 was prepared by Technical Committee ISO/TC 44, Welding and allied processes, Subcommittee
SC 12, Soldering materials.
This second edition cancels and replaces the first edition (ISO 9453:1990), which has been technically revised.
Requests for official interpretations of any aspect of this International Standard should be directed to the
Secretariat of ISO/TC 44/SC 12 via your national standards body. A complete listing of these bodies can be
found at http://www.iso.org.

iv © ISO 2006 – All rights reserved

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ISO 9453:2006(E)
Introduction
The International Organization for Standardization (ISO) draws attention to the fact that it is claimed that
compliance with this document may involve the use of a patent concerning soft solder alloy compositions
given in Table 3.
ISO takes no position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured ISO that he/she is willing to negotiate licences under reasonable
and non-discriminatory terms and conditions with applicants throughout the world. In this respect, the
statement of the holder of this patent right is registered with ISO. Information may be obtained from:
Cookson Electronics Assembly Materials Group
600 Route 440, Jersey City, NJ 07304, USA
Iowa State University Research Foundation, Inc.
310 Lab of Mechanics
Ames, Iowa 50011-2131, U.S.A.
Matsushita Electric Industrial Co., Ltd.
Matsushita IMP Building 20F 1-3-7, Shiromi, Chouh-ku, Osaka, 540-6319, Japan
Mitsui Mining & Smelting Co., Ltd.
Gate City Ohsaki-West Tower 19th Fl. 1-11-1 Osaki, Shinagawa-ku, Tokyo, 141-8584, Japan
Murata Manufacturing Co., Ltd.
Nagaokakyo-shi, Kyoto, 617, Japan
Senju Metal Industry Co., Ltd.
Senju Hashido-cho 23, Adachi-ku, Tokyo, 120-8555, Japan
Attention is drawn to the possibility that some of the elements of this document (in particular the alloy
compositions) may be the subject of patent rights other than those identified above. ISO shall not be held
responsible for identifying any or all such patent rights.
h
Any alloys which are currently believed to be subject to any restriction on use are denoted with footnote in
Table 3.
Patent rights vary between the countries of manufacture, sale, use and final destination; suppliers or users
remain responsible for establishing the exact legal position relevant to their own situation.
© ISO 2006 – All rights reserved v

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INTERNATIONAL STANDARD ISO 9453:2006(E)

Soft solder alloys — Chemical compositions and forms
1 Scope
This International Standard specifies the requirements for chemical composition for the following families of
soft solder alloys:
⎯ tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
⎯ tin-antimony;
⎯ tin-bismuth;
⎯ tin-copper, with and without silver;
⎯ tin-indium, with and without silver and bismuth;
⎯ tin-silver, with and without copper and bismuth;
⎯ tin-zinc, with and without bismuth.
It also includes an indication of the forms generally available.
2 Normative references
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
ISO 3677, Filler metal for soft soldering, brazing and braze welding — Designation
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
soft solder
metallic filler material used to join metallic parts, which has a melting temperature (liquidus) lower than that of
the parts to be joined, usually lower than 450 °C, and which wets the parent metals
3.2
unit of product
unit used to define the requirements for marking soft solders, and which varies with the form of the solder
See Table 1.
© ISO 2006 – All rights reserved 1

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ISO 9453:2006(E)
Table 1 — Variations of unit of product with form of solder
Form of solder Unit of product
Ingot, bar, slab, stick or rod Single ingot, bar, slab, stick or rod
Wire or ribbon Single coil or reel
Wrought preforms and rings, spheres, pellets or powder Individual packaged quantity
Powder in pastes or creams Individual packaged quantity

3.3
batch
collection of one or more units of product, made in a single production operation
4 Chemical composition
The chemical composition of the soft solder, sampled and analysed in accordance with Clause 6, shall be as
given for the appropriate material in Table 2 or Table 3.
5 Forms of delivery
Soft solders conforming to this International Standard shall be supplied in one of the following forms: ingot,
slab, stick, bar, rod, wire, pellets, preforms, spheres, ribbons, powder, or pastes and creams containing
powder.
Solders supplied in the form of rod, wire or preforms may be supplied with or without an integral flux, subject
to agreement between the supplier and the purchaser.
NO
...

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