EN IEC 62878-1:2019
(Main)Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components. The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
Montageverfahren für eingebettete Bauteile - Teil 1: Fachgrundspezifikation für Trägermaterial mit eingebetteten Bauteilen
Techniques d’assemblage avec appareil(s) integre(s) - Partie 1: Spécification générique pour substrats avec appareil(s) intégré(s)
L'IEC 62878-1:2019 spécifie les exigences et méthodes d’essai génériques relatives aux substrats avec appareils intégrés. Les méthodes fondamentales d'essai pour les matériaux de substrats des cartes imprimées et pour les substrats eux-mêmes sont spécifiées dans l'IEC 61189-3. La présente partie de l'IEC 62878 est applicable aux substrats avec appareils intégrés fabriqués à partir de matériaux organiques de base, y compris par exemple les appareils actifs ou passifs, les composants discrets formés lors du processus de fabrication des cartes imprimées électroniques, ainsi que les composants de feuilles minces. La série IEC 62878 ne s'applique ni à la couche de redistribution (RDL – redistribution layer), ni aux modules électroniques définis dans l’IEC 62421.
Tehnologija sestavov z vdelanimi elementi - 1. del: Osnovna specifikacija za substrate z vdelanimi elementi
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-junij-2021
Tehnologija sestavov z vdelanimi elementi - 1. del: Osnovna specifikacija za
substrate z vdelanimi elementi
Device embedding assembly technology - Part 1: Generic specification for device
embedded substrates
Ta slovenski standard je istoveten z: EN IEC 62878-1:2019
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 62878-1
NORME EUROPÉENNE
EUROPÄISCHE NORM
December 2019
ICS 31.180; 31.190
English Version
Device embedding assembly technology - Part 1: Generic
specification for device embedded substrates
(IEC 62878-1:2019)
Techniques d’assemblage avec appareil(s) integre(s) - Montageverfahren für eingebettete Bauteile - Teil 1:
Partie 1: Spécification générique pour substrats avec Fachgrundspezifikation für Trägermaterial mit eingebetteten
appareil(s) intégré(s) Bauteilen
(IEC 62878-1:2019) (IEC 62878-1:2019)
This European Standard was approved by CENELEC on 2019-11-18. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62878-1:2019 E
European foreword
The text of document 91/1597/FDIS, future edition 1 of IEC 62878-1, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 62878-1:2019.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2020-08-18
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2022-11-18
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 62878-1:2019 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-1:2013 NOTE Harmonized as EN 60068-1:2014 (not modified)
IEC 60068-2-45 NOTE Harmonized as EN 60068-2-45
IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58
IEC/TR 61340-5-2 NOTE Harmonized as CLC/TR 61340-5-2
IEC 62421 NOTE Harmonized as EN 62421
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-1 - Environmental testing - Part 2-1: Tests - EN 60068-2-1 -
Test A: Cold
IEC 60068-2-2 - Environmental testing - Part 2-2: Tests - EN 60068-2-2 -
Test B: Dry heat
IEC 60068-2-6 - Environmental testing - Part 2-6: Tests - EN 60068-2-6 -
Test Fc: Vibration (sinusoidal)
IEC 60068-2-14 - Environmental testing - Part 2-14: Tests - EN 60068-2-14 -
Test N: Change of temperature
IEC 60068-2-21 - Environmental testing - Part 2-21: Tests - EN 60068-2-21 -
Test U: Robustness of terminations and
integral mounting devices
IEC 60068-2-27 - Environmental testing - Part 2-27: Tests - EN 60068-2-27 -
Test Ea and guidance: Shock
IEC 60068-2-69 - Environmental testing – Part 2-69: Tests – EN 60068-2-69 -
Test Te/Tc: Solderability testing of
electronic components and printed boards
by the wetting balance (force
measurement) method
IEC 60068-2-78 - Environmental testing - Part 2-78: Tests - EN 60068-2-78 -
Test Cab: Damp heat, steady state
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 61340-5-1 - Electrostatics - Part 5-1: Protection of EN 61340-5-1 -
electronic devices from electrostatic
phenomena - General requirements
Publication Year Title EN/HD Year
IEC 61340-5-3 - Electrostatics - Part 5-3: Protection of EN 61340-5-3 -
electronic devices from electrostatic
phenomena - Properties and requirements
classification for packaging intended for
electrostatic discharge sensitive devices
IEC 61760-4 - Surface mounting technology - Part 4: EN 61760-4 -
Classification, packaging, labelling and
handling of moisture sensitive devices
IEC 62137-1-4 - Surface mounting technology - EN 62137-1-4 -
Environmental and endurance test
methods for surface mount solder joint -
Part 1-4: Cyclic bending test
IEC 62878-1-1 - Device embedded substrate - Part 1-1: EN 62878-1-1 -
Generic specification - Test methods
IEC/TR 62878-2-2 - Device embedded substrate - Part 2-2: - -
Guidelines - Electrical testing
IEC/TS 62878-2-1 - Device embedded substrate - Part 2-1: - -
Guidelines - General description of
technology
IEC/TS 62878-2-3 - Device embedded substrate - Part 2-3: - -
Guidelines - Design guide
IEC/TS 62878-2-4 - Device embedded substrate - Part 2-4: - -
Guidelines - Test element groups (TEG)
J-STD 033 - Handling, Packing, Shipping, and Use of - -
Moisture/Reflow and/or Process Sensitive
Components
IEC 62878-1 ®
Edition 1.0 2019-10
INTERNATIONAL
STANDARD
Device embedding assembly technology –
Part 1: Generic specification for device embedded substrates
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 31.190 ISBN 978-2-8322-7460-6
– 2 – IEC 62878-1:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Value chain . 8
4.1 System description. 8
4.1.1 Generic design variants . 8
4.1.2 Generic value chain . 8
4.2 Elements of the value chain . 9
4.2.1 General . 9
4.2.2 System manufacturer . 9
4.2.3 Components manufacturer . 9
4.2.4 Material manufacturer . 10
4.2.5 Submodule manufacturer . 10
4.2.6 Board manufacturer . 10
4.2.7 Assembly manufacturer . 10
4.3 Traceability . 10
5 Safety aspects of base material and components . 10
6 Design and structure of device embedded substrate . 11
6.1 Basic rules for layer description . 11
6.2 Design for embedding and testability . 11
6.3 Safety aspects of design . 11
7 Embedding technology . 11
7.1 Basic technologies for embedding . 11
7.2 Basic requirements to embedding technology . 11
7.2.1 Cleanliness of components, submodules and process . 11
7.2.2 ESD . 11
7.2.3 Moisture sensitivity . 11
7.2.4 Defects . 12
8 Tests and measuring methods . 12
8.1 Standard atmospheric conditions . 12
8.1.1 Standard atmospheric conditions for testing . 12
8.1.2 Referee conditions . 12
8.1.3 Reference conditions . 13
8.2 Electrical performance tests . 13
8.2.1 General . 13
8.2.2 Electrical test levels . 13
8.2.3 Protection of DES and test equipment . 13
8.2.4 Accuracy of measurement . 14
8.2.5 Test structures. 15
8.2.6 Mechanical performance tests . 15
8.2.7 Resistance to soldering heat . 15
8.2.8 Solderability. 16
8.2.9 Shock . 16
8.2.10 Vibration (sinusoidal) . 16
IEC 62878-1:2019 © IEC 2019 – 3 –
8.2.11 Resistance to solvents . 16
8.3 Climatic performance tests . 16
8.3.1 Dry heat . 16
8.3.2 Cold. 17
8.3.3 Damp heat, steady state . 17
8.3.4 Change of temperature . 17
9 Transportation, handling and packing material
...
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