SIST EN IEC 61967-8:2023
(Main)Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method (IEC 61967-8:2023)
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method (IEC 61967-8:2023)
SIST EN IEC 61967-8:2023 is available as IEC 61967-8:2023 which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61967-8:2023 defines a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline. The IC being evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement. This edition includes the following significant technical changes with respect to the previous edition:
a) frequency range of 150 kHz to 3 GHz was deleted from the scope;
b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements are fulfilled.
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 8: Messung der abgestrahlten Aussendungen - IC-Streifenleiterverfahren (IEC 61967-8:2023)
Circuits intégrés - Mesure des émissions électromagnétiques - Partie 8: Mesure des émissions rayonnées - Méthode de la ligne TEM à plaques (stripline) pour CI (IEC 61967-8:2023)
IEC 61967-8:2023 est disponible sous forme de IEC 61967-8:2023 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L’IEC 61967-8:2023 définit une méthode de mesure des émissions électromagnétiques rayonnées d’un circuit intégré (CI) à l’aide d’une ligne TEM à plaques (stripline) pour circuit intégré. Le CI à évaluer est monté sur une carte d’essai CEM (carte à circuit imprimé) entre le conducteur actif et le plan de masse du dispositif de la stripline pour CI. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) la plage de fréquences de 150 kHz à 3 GHz a été retirée du domaine d’application;
b) la fréquence utile supérieure est étendue à 6 GHz ou plus dans la mesure où les exigences définies sont remplies.
Integrirana vezja - Meritve elektromagnetnega sevanja - 8. del: Merjenje sevanega oddajanja - Metoda z IC na tračnem valovodu (IEC 61967-8:2023)
SIST EN IEC 61967-8:2023 je na voljo kot standard IEC 61967-8:2023, ki vsebuje mednarodni standard in njegovo različico z revizijami, ki prikazujejo vse spremembe tehnične vsebine v primerjavi s prejšnjo izdajo. Standard IEC 61967-8:2023 določa metodo za merjenje elektromagnetnega sevanega oddajanja iz integriranega vezja (IC) z uporabo tračnega valovoda. Integrirano vezje, ki se vrednoti, je nameščeno na plošči tiskanega vezja (PCB) za preskus elektromagnetne združljivosti (EMC) med aktivnim vodnikom in ozemljitveno ploščo v ureditvi tračnega valovoda. Ta izdaja v primerjavi s prejšnjo vključuje naslednje pomembne tehnične spremembe:
a) iz področja uporabe je bilo izbrisano frekvenčno območje med 150 kHz in 3 GHz;
b) razširitev zgornje uporabne frekvence na 6 GHz ali več, če so izpolnjene opredeljene zahteve.
General Information
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Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN IEC 61967-8:2023
01-september-2023
Integrirana vezja - Meritve elektromagnetnega sevanja - 8. del: Merjenje sevanega
oddajanja - Metoda z IC na tračnem valovodu (IEC 61967-8:2023)
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement
of radiated emissions - IC stripline method (IEC 61967-8:2023)
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 8:
Messung der abgestrahlten Aussendungen - IC-Streifenleiterverfahren (IEC 61967-
8:2023)
Circuits intégrés - Mesure des émissions électromagnétiques - Partie 8: Mesure des
émissions rayonnées - Méthode de la ligne TEM à plaques (stripline) pour CI (IEC 61967
-8:2023)
Ta slovenski standard je istoveten z: EN IEC 61967-8:2023
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST EN IEC 61967-8:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN IEC 61967-8:2023
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SIST EN IEC 61967-8:2023
EUROPEAN STANDARD EN IEC 61967-8
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2023
ICS 31.200 Supersedes EN 61967-8:2011
English Version
Integrated circuits - Measurement of electromagnetic emissions -
Part 8: Measurement of radiated emissions - IC stripline method
(IEC 61967-8:2023)
Circuits intégrés - Mesure des émissions Integrierte Schaltungen - Messung von
électromagnétiques - Partie 8: Mesure des émissions elektromagnetischen Aussendungen - Teil 8: Messung der
rayonnées - Méthode de la ligne TEM à plaques (stripline) abgestrahlten Aussendungen - IC-Streifenleiterverfahren
pour circuit intégré (IEC 61967-8:2023)
(IEC 61967-8:2023)
This European Standard was approved by CENELEC on 2023-06-07. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61967-8:2023 E
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SIST EN IEC 61967-8:2023
EN IEC 61967-8:2023 (E)
European foreword
The text of document 47A/1152/FDIS, future edition 2 of IEC 61967-8, prepared by SC 47A
"Integrated circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 61967-8:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-03-07
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-06-07
document have to be withdrawn
This document supersedes EN 61967-8:2011 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
This document has been prepared under a Standardization Request given to CENELEC by the
European Commission and the European Free Trade Association.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61967-8:2023 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 61967-2 NOTE Approved as EN 61967-2
2
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...
SLOVENSKI STANDARD
oSIST prEN IEC 61967-8:2022
01-oktober-2022
Integrirana vezja - Meritve elektromagnetnega sevanja - 8. del: Merjenje sevanega
oddajanja - Metoda z IC na tračnem valovodu
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement
of radiated emissions - IC stripline method
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 8:
Messung der abgestrahlten Aussendungen - IC-Streifenleiterverfahren
Circuits intégrés - Mesure des émissions électromagnétiques - Partie 8: Mesure des
émissions rayonnées - Méthode de la ligne TEM à plaques (stripline) pour CI
Ta slovenski standard je istoveten z: prEN IEC 61967-8:2022
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
oSIST prEN IEC 61967-8:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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oSIST prEN IEC 61967-8:2022
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oSIST prEN IEC 61967-8:2022
47A/1141/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61967-8 ED2
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2022-07-29 2022-10-21
SUPERSEDES DOCUMENTS:
47A/1136/CD, 47A/1139A/CC
IEC SC 47A : INTEGRATED CIRCUITS
SECRETARIAT: SECRETARY:
Japan Mr Yoshinori FUKUBA
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they
are aware and to provide supporting documentation.
TITLE:
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated
emissions - IC stripline method
PROPOSED STABILITY DATE: 2028
NOTE FROM TC/SC OFFICERS:
The comments for 47A/1136/CD were reviewed in SC 47A WG 9 meeting which was held in 2022-05-30 and all
technical issues were resolved and addressed in 47A/1139A/CC, so the project will move forward as CDV.
Copyright © 2022 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.
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oSIST prEN IEC 61967-8:2022
61967-8/Ed2/CDV IEC (E) – 2 – 47A/1141/CDV
1 CONTENTS
2 FOREWORD . 4
3 1 Scope . 6
4 2 Normative references . 6
5 3 Terms and definitions . 6
6 3.1 Transverse electromagnetic (TEM) mode . 6
7 TEM waveguide . 6
3.2
8 3.3 IC stripline . 6
9 3.4 Two-port TEM waveguide . 7
10 3.5 Characteristic impedance . 7
11 3.6 Primary (field) component . 7
12 4 General . 7
13 5 Test conditions . 7
14 5.1 General . 7
15 Supply voltage.
...
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