Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1 : General requirements and specifications (IEC 63244-1:2021)

Halbleiterbauelemente – Halbleiterbauelemente für die drahtlose Leistungsübertragung und Ladung – Teil 1: Allgemeine Anforderungen und Festlegungen (IEC 63244-1:2021)

Dispositifs à semiconducteurs – Dispositifs à semiconducteurs pour le transfert de puissance et la charge sans fil – Partie 1: Exigences et spécifications générales (IEC 63244-1:2021)

Polprevodniški elementi - Polprevodniški elementi za brezžični prenos moči in napajanje - 1. del: Splošne zahteve in specifikacije (IEC 63244-1:2021)

General Information

Status
Published
Publication Date
15-Nov-2021
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
03-Nov-2021
Due Date
08-Jan-2022
Completion Date
16-Nov-2021

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SLOVENSKI STANDARD
SIST EN IEC 63244-1:2021
01-december-2021
Polprevodniški elementi - Polprevodniški elementi za brezžični prenos moči in
napajanje - 1. del: Splošne zahteve in specifikacije (IEC 63244-1:2021)
Semiconductor devices - Semiconductor devices for wireless power transfer and
charging - Part 1 : General requirements and specifications (IEC 63244-1:2021)

Halbleiterbauelemente – Halbleiterbauelemente für die drahtlose Leistungsübertragung

und Ladung – Teil 1: Allgemeine Anforderungen und Festlegungen (IEC 63244-1:2021)

Dispositifs à semiconducteurs – Dispositifs à semiconducteurs pour le transfert de

puissance et la charge sans fil – Partie 1: Exigences et spécifications générales (IEC

63244-1:2021)
Ta slovenski standard je istoveten z: EN IEC 63244-1:2021
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 63244-1:2021 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 63244-1:2021
---------------------- Page: 2 ----------------------
SIST EN IEC 63244-1:2021
EUROPEAN STANDARD EN IEC 63244-1
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2021
ICS 31.080.99
English Version
Semiconductor devices - Semiconductor devices for wireless
power transfer and charging - Part 1: General requirements and
specifications
(IEC 63244-1:2021)

Dispositifs à semiconducteurs - Dispositifs à Halbleiterbauelemente - Halbleiterbauelemente für die

semiconducteurs pour le transfert de puissance et la charge drahtlose Leistungsübertragung und Ladung - Teil 1:

sans fil - Partie 1: Exigences et spécifications générales Allgemeine Anforderungen und Festlegungen

(IEC 63244-1:2021) (IEC 63244-1:2021)

This European Standard was approved by CENELEC on 2021-10-19. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 63244-1:2021 E
---------------------- Page: 3 ----------------------
SIST EN IEC 63244-1:2021
EN IEC 63244-1:2021 (E)
European foreword

The text of document 47/2706/FDIS, future edition 1 of IEC 63244-1, prepared by IEC/TC 47

“Semiconductor devices” was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN IEC 63244-1:2021.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2022–07–19

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2024–10–19

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Any feedback and questions on this document should be directed to the users’ national committee. A

complete listing of these bodies can be found on the CENELEC website.
Endorsement notice

The text of the International Standard IEC 63244-1:2021 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards

indicated:
IEC 60747-16-1 NOTE Harmonized as EN 60747-16-1
IEC 63028 NOTE Harmonized as EN 63028
---------------------- Page: 4 ----------------------
SIST EN IEC 63244-1:2021
EN IEC 63244-1:2021 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the

relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available

here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-1 - Environmental testing - Part 2–1: Tests - EN 60068-2-1 -
Test A: Cold
IEC 60068-2-2 - Environmental testing - Part 2–2: Tests - EN 60068-2-2 -
Test B: Dry heat
IEC 60068-2-14 - Environmental testing - Part 2–14: Tests - EN 60068-2-14 -
Test N: Change of temperature
IEC 60068-2-30 - Environmental testing - Part 2–30: Tests - EN 60068-2-30 -
Test Db: Damp heat, cyclic (12 h + 12 h
cycle)
IEC 60529 - Degrees of protection provided by - -
enclosures (IP Code)
IEC 60749-10 - Semiconductor devices - Mechanical and EN 60749-10 -
climatic test methods - Part 10: Mechanical
shock
IEC 61967-2 - Integrated circuits - Measurement of EN 61967-2 -
electromagnetic emissions, 150 kHz to
1 GHz - Part 2: Measurement of radiated
emissions - TEM cell and wideband TEM
cell method
IEC 61967-4 - Integrated circuits - Measurement of EN IEC 61967-4 -
electromagnetic emissions - Part 4:
Measurement of conducted emissions –
1 Ω /150 Ω direct coupling method
IEC 61967-8 - Integrated circuits - Measurement of EN 61967-8 -
electromagnetic emissions - Part 8:
Measurement of radiated emissions - IC
stripline method
IEC 62132-2 - Integrated circuits - Measurement of EN 62132-2 -
electromagnetic immunity - Part 2:
Measurement of radiated immunity - TEM
cell and wideband TEM cell method
---------------------- Page: 5 ----------------------
SIST EN IEC 63244-1:2021
EN IEC 63244-1:2021 (E)
IEC 62132-4 - Integrated circuits - Measurement of EN 62132-4 -
electromagnetic immunity 150 kHz to 1 GHz
- Part 4: Direct RF power injection method
IEC 62132-8 - Integrated circuits - Measurement of EN 62132-8 -
electromagnetic immunity - Part 8:
Measurement of radiated immunity - IC
stripline method
IEC 62262 - Degrees of protection provided by EN 62262 -
enclosures for electrical equipment against
external mechanical impacts (IK code)
IEC 62969-2 2018 Semiconductor devices - Semiconductor EN IEC 62969-2 2018
interface for automotive vehicles - Part 2:
Efficiency evaluation methods of wireless
power transmission using resonance for
automotive vehicles sensors
IEC CISPR 11 - Industrial, scientific and medical equipment EN 55011 -
- Radio-frequency disturbance
characteristics - Limits and methods of
measurement
---------------------- Page: 6 ----------------------
SIST EN IEC 63244-1:2021
IEC 63244-1
Edition 1.0 2021-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Semiconductor devices for wireless power transfer
and charging –
Part 1: General requirements and specifications
Dispositifs à semiconducteurs – Dispositifs à semiconducteurs pour le transfert
de puissance et la charge sans fil –
Partie 1: Exigences et spécifications générales
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-1023-2

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN IEC 63244-1:2021
– 2 – IEC 63244-1:2021 © IEC 2021
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms, definitions and symbols........................................................................................ 8

3.1 Terms and definitions .............................................................................................. 8

3.1.1 General terminology ........................................................................................ 8

3.1.2 Terminology for near-field based wireless power transfer ................................ 9

3.1.3 Terminology for far-field based wireless power transfer ................................. 10

3.2 Symbols and abbreviated terms ............................................................................ 11

4 Classification ................................................................................................................. 12

5 Test items for reliability ................................................................................................. 14

5.1 General ................................................................................................................. 14

5.2 IP rating ................................................................................................................ 14

5.3 Temperature test .................................................................................................. 15

5.4 Humidity test ......................................................................................................... 15

5.5 Mechanical impact and vibration test .................................................................... 15

5.6 EMC test ............................................................................................................... 15

5.6.1 General ......................................................................................................... 15

5.6.2 Electromagnetic immunity .............................................................................. 15

5.6.3 Electromagnetic emission .............................................................................. 15

6 Performance evaluation items ........................................................................................ 16

6.1 Efficiency .............................................................................................................. 16

6.1.1 General ......................................................................................................... 16

6.1.2 Block diagram for efficiency analysis ............................................................. 16

6.1.3 Component-level efficiency ............................................................................ 17

6.1.4 Module-level efficiency .................................................................................. 20

6.1.5 System-level power transfer efficiency ........................................................... 22

6.2 Evaluation components in PTx and PRx ................................................................ 23

6.2.1 General ......................................................................................................... 23

6.2.2 Rectifier and ripple smoothing circuit ............................................................. 23

6.2.3 DC to DC converter ....................................................................................... 26

6.2.4 Inverter .......................................................................................................... 27

6.2.5 Variable gain amplifier (VGA) ........................................................................ 29

Annex A (informative) Field regions for electromagnetically short antenna ........................... 32

Bibliography .......................................................................................................................... 33

Figure 1 – Classification of WET technologies ...................................................................... 13

Figure 2 – Example of reliability test conditions and items .................................................... 14

Figure 3 – Block diagram for efficiency analysis of MF WPT system ..................................... 16

Figure 4 – Block diagram for efficiency analysis of EMW WPT system .................................. 16

Figure 5 – Measurement setup for AC to DC converting efficiency or rectifying

efficiency .............................................................................................................................. 18

Figure 6 – Measurement setup for DC to DC converting efficiency ........................................ 19

Figure 7 – Measurement setup for DC to AC converting efficiency ........................................ 20

---------------------- Page: 8 ----------------------
SIST EN IEC 63244-1:2021
IEC 63244-1:2021 © IEC 2021 – 3 –
Figure 8 – Measurement setup for coupling efficiency between transmitting and

receiving coils ....................................................................................................................... 21

Figure 9 – Measurement setup for power transfer efficiency between power

transmitting and receiving antennas ...................................................................................... 22

Figure 10 – Semiconductor components in PTx and PRx ...................................................... 23

Figure 11 – Half-wave rectifier and input/output waveform .................................................... 25

Figure 12 – Full-wave rectifier and input/output waveform ..................................................... 26

Figure 13 – Diode- bridge rectifier and RC smoothing circuits ............................................... 26

Figure 14 – Example of step down converter (Buck converter) and step up converter

(Boost converter) .................................................................................................................. 27

Figure 15 – Example of equivalent circuit and square AC output signal ................................. 28

Figure 16 – Block diagram of VGA ........................................................................................ 29

Figure 17 – 3 dB bandwidth .................................................................................................. 30

Figure 18 – P1dB, MDS and dynamic input range of a variable gain amplifier ....................... 30

Figure A.1 – Field regions for electromagnetically short antenna .......................................... 32

Table 1 – Letter symbols and abbreviated terms ................................................................... 12

Table 2 – Example of blank specifications: classification of wireless power transfer

methods and distance according to products and power consumption ................................... 13

Table 3 – Example of blank specifications of a rectifier diode................................................ 24

Table 4 – Example of blank specifications of a step- down DC-to-DC converter .................... 27

Table 5 – Example of blank specifications of an inverter used for MF WPT ........................... 28

---------------------- Page: 9 ----------------------
SIST EN IEC 63244-1:2021
– 4 – IEC 63244-1:2021 © IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR DEVICES FOR WIRELESS
POWER TRANSFER AND CHARGING –
Part 1: General requirements and specifications
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their

preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

may participate in this preparatory work. International, governmental and non-governmental organizations liaising

with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence between

any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

IEC 63244-1 has been prepared by IEC technical committee 47: Semiconductor devices. It is

an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2706/FDIS 47/2723/RVD

Full information on the voting for its approval can be found in the report on voting indicated in

the above table.
The language used for the development of this International Standard is English.
---------------------- Page: 10 ----------------------
SIST EN IEC 63244-1:2021
IEC 63244-1:2021 © IEC 2021 – 5 –

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available

at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are

described in greater detail at www.iec.ch/standardsdev/publications.

A list of all the parts in the IEC 63244 series, published under the general title Semiconductor

devices – Semiconductor devices for wireless power transfer and charging, can be found on

the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct understanding

of its contents. Users should therefore print this document using a colour printer.

---------------------- Page: 11 ----------------------
SIST EN IEC 63244-1:2021
– 6 – IEC 63244-1:2021 © IEC 2021
INTRODUCTION
The IEC 63244 series is planned to comprise the following parts:

• IEC 63244-1: Semiconductor devices – Semiconductor devices for wireless power transfer

and charging – Part 1: General requirements and specifications

• IEC 63244-2: Semiconductor devices – Semiconductor devices for wireless power transfer

and charging – Part 2: Far-field based wireless power transfer – Electromagnetic-wave

based wireless power transfer

• IEC 63244-3-1: Semiconductor devices – Semiconductor devices for wireless power transfer

and charging – Part 3-1: Near-field based wireless power transfer – Magnetic-field based

wireless power transfer

• IEC 63244-3-2: Semiconductor devices – Semiconductor devices for wireless power transfer

and charging – Part 3-2: Near-field based wireless power transfer – Electric-field based

wireless power transfer

The standardization bodies for wireless power transfer and charging technologies is as follow:

1) Wireless power consortium (WPC): Wireless power consortium covers MF WPT technology

such as inductive WPT and magnetic resonance WPT. WPC has Qi certification process to

ensure the safety and quality.

2) AirFuel alliance: AirFuel alliance covers NF WPT technology such as resonant mode of

magnetic-field based wireless power transfer. And also, AirFuel alliance is working on FF

WPT technology such as electromagnetic-wave based wireless power transfer. AirFuel

alliance has Rezence certification process for resonant mode of MF WPT to ensure the

safety and quality. AirFuel alliance was formed by the merge of Alliance for Wireless Power

(A4WP) and Power Matters Alliance (PMA) in 2015.
---------------------- Page: 12 ----------------------
SIST EN IEC 63244-1:2021
IEC 63244-1:2021 © IEC 2021 – 7 –
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR DEVICES FOR WIRELESS
POWER TRANSFER AND CHARGING –
Part 1: General requirements and specifications
1 Scope

This part of IEC 63244 provides general requirements and specifications of the semiconductor

devices for the performance and reliability evaluations of wireless power transfer and charging

systems. For the performance evaluations, this part covers various characterization parameters

and symbols, general system diagrams, and test setups and test conditions.

This document also describes classifications of the wireless power transfer technologies.

2 Normative references

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies.

For undated references, the latest edition of the referenced document (including any

amendments) applies.
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat

IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature

IEC 60068-2-30, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic

(12 + 12 h cycle)
IEC 60529, Degrees of protection provided by enclosures (IP Code)

IEC 60749-10, Semiconductor devices – Mechanical and climatic test methods – Part 10:

Mechanical shock

IEC 61967-2, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to

1 GHz – Part 2: Measurement of radiated emissions – TEM cell and wideband TEM cell method

IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions – Part 4:

Measurement of conducted emissions – 1 Ω /150 Ω direct coupling method

IEC 61967-8, Integrated circuits – Measurement of electromagnetic emissions – Part 8:

Measurement of radiated emissions – IC stripline method

IEC 62132-2, Integrated circuits – Measurement of electromagnetic immunity – Part 2:

Measurement of radiated immunity – TEM cell and wideband TEM cell method

IEC 62132-4, Integrated circuits – Measurement of electromagnetic immunity 150 kHz to 1 GHz

– Part 4: Direct RF power injection method
---------------------- Page: 13 ----------------------
SIST EN IEC 63244-1:2021
– 8 – IEC 63244-1:2021 © IEC 2021

IEC 62132-8, Integrated circuits – Measurement of electromagnetic immunity – Part 8:

Measurement of radiated immunity – IC stripline method

IEC 62262, Degrees of protection provided by enclosures for electrical equipment against

external mechanical impacts (IK code)

IEC 62969-2:2018, Semiconductor devices – Semiconductor interface for automotive vehicles

– Part 2: Efficiency evaluation methods of wireless power transmission using resonance for

automotive vehicles sensors

IEC CISPR 11, Industrial, scientific and medical equipment – Radio-frequency disturbance

characteristics – Limits and methods of measurement
3 Terms, definitions and symbols
For the purposes of this document, the following terms and definitions apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp

NOTE The following terms and definitions are classified into general terminology, terminology for near-field based

wireless power transfer, and terminology for far-field based wireless power transfer.

3.1 Terms and definitions
3.1.1 General terminology
3.1.1.1
wireless energy transfer
WET

transfer of electrical, optical, acoustic and other type of energies from a source to an electrical

load via electric and/or magnetic fields, electromagnetic waves, acoustic waves, etc.

3.1.1.2
wireless power transfer
WPT

transfer of electrical energy from a power source to an electrical load via electric and/or

magnetic fields or electromagnetic waves

Note 1 to entry: The alternative term “wireless power transmission” is also often used in technical documents.

3.1.1.3
power receiver
PRx

device receiving electrical power from a transmitting device or transmitting devices

Note 1 to entry: The alternative term “power receiving unit (PRU)” is also often used in technical documents. And

also, “secondary device” is used in CISPR 11.
3.1.1.4
power transmitter
PTx
device sending electrical power to a receiving device or receiving devices

Note 1 to entry: The alternative term “power transmitting unit (PTU)” is also often used in technical documents. And

also, “primary device” is used in CISPR 11.
---------------------- Page: 14 ----------------------
SIST EN IEC 63244-1:2021
IEC 63244-1:2021 © IEC 2021 – 9 –
3.1.2 Terminology for near-field based wireless power transfer
3.1.2.1
power receiving coil

power receiving coiled inductor that is induced by a time-varying magnetic field from a power

transmitting coil(s)

Note 1 to entry: The alternative term “the secondary coil” is also often used in technical documents. And also, the

alternative term “receiving resonator coil” is also used in IEC 62969-2.
3.1.2.2
power transmitting coil

power transmitting coiled inductor that induces a voltage across a power receiving coil(s)

Note 1 to entry: The alternative term “the primary coil” is also often used in technical documents. And also, the

alternative term “transmitting resonator coil” is also used in IEC 62969-2.
3.1.2.3
near-field based wireless power transfer
NF WPT

wireless electrical power transfer from a power transmitter(s) to a power receiver(s) that is(are)

located within an induced magnetic or electric field
3.1.2.4
magnetic-field based wireless power transfer
MF WPT

wireless electrical power transfer from a power transmitter(s) to a power receiver(s) that is(are)

located within an induced magnetic field
3.1.2.5
non-resonant mode of magnetic-field based wireless power transfer
wireless electrical power transfer between power transmitting co
...

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