2014-08-18: endorsement of IEC 60747-5-5:2007/A1 under 3-month UAP

  • Amendment
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This part of IEC 60747 gives the terminology, essential ratings, characteristics, safety test as well as the measuring method for photocouplers (or optocouplers). NOTE The word 'optocoupler' can also be used instead of 'photocoupler'. This standard replaces the clauses for photocouplers (or optocouplers) described in IEC 60747-5-1, IEC 60747-5-2 and IEC 60747-5-3, including their amendments. The contents for phototransistors and photothyristors in IEC 60747-5-1, IEC 60747-5-2 and IEC 60747-5-3, including their amendments, will be considered obsolete as of the effective date of publication of this standard. NOTE Photocouplers that are certified to the previous version of the photocoupler standard, namely IEC 60747-5-1/2/3, are to be considered in compliance with the requirements and provisions of IEC 60747-5-5.

  • Standard
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Gives the product specific standards, requirements and test methods for isolated power semiconductor devices. These requirements are added to those given in other parts of EN 60747, EN 60748 and EN 60749 for the corresponding non-isolated power devices.

  • Standard
    53 pages
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EN following parallel vote

  • Amendment
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Describes the measuring methods applicable to the optoelectronic devices which are not intended to be used in the fibre optic systems or subsystems.

  • Standard
    34 pages
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Gives the essential ratings and characteristics of the following categories or subcategories of optoelectronic devices which are not intended to be used in the field of fibre optic systems or subsystems: Semiconductor photoemitters, semiconductor photoelectric detectors, semiconductor photosensitive devices, and semiconductor devices utilizing the optical radiation for internal operation.

  • Standard
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D114/033: Withdrawn

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  • Standard
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  • Standard
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  • Standard
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  • Standard
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  • Standard
    13 pages
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Deals with the terminology relating to the semiconductor optoelectronic devices.

  • Standard
    33 pages
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This document applies to discrete pressure contact power semiconductor devices namely rectifier diodes, transistors, thyristors and their derivatives. The requirements also cover encapsulated assemblies. The document does not apply to stacks or assemblies made with these encapsulated components.

  • Standard
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