IEC TR 62899-550-1:2022
(Main)Printed electronics - Part 550-1 : Quality assessment - Framework document on durability testing - Mechanical and thermal testing
Printed electronics - Part 550-1 : Quality assessment - Framework document on durability testing - Mechanical and thermal testing
IEC TR 62899-550-1:2022(E), which is a Technical Report, provides a framework for evaluating the mechanical and thermal durability of printed and/or flexible electronics components and products. This includes the bending test, torsion test, stretching test, steady heat test as well as the thermal cycle test. These are typical conditions that are easily encountered in daily life for printed and/or flexible electronics components and products.
This document gives guidance for use for technical committees in the preparation of consistent standards relating to the quality assessment of printed and/or flexible electronics components and products. Consistent standards for durability testing will help users, including businesses, developers, vendors, and end users to select suitable methods for durability testing and make consistent test procedures for printed electronics.
General Information
Standards Content (Sample)
IEC TR 62899-550-1 ®
Edition 1.0 2022-10
TECHNICAL
REPORT
Printed electronics –
Part 550-1: Quality assessment – Framework document on durability testing –
Mechanical and thermal testing
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IEC TR 62899-550-1 ®
Edition 1.0 2022-10
TECHNICAL
REPORT
Printed electronics –
Part 550-1: Quality assessment – Framework document on durability testing –
Mechanical and thermal testing
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 19.060; 31.020 ISBN 978-2-8322-5893-4
– 2 – IEC TR 62899-550-1:2022 © IEC 2022
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Default items applicable to the test methods . 7
4.1 Selection of test methods . 7
4.2 Performance measurement . 7
5 Mechanical test methods . 7
5.1 Bending test . 7
5.1.1 General . 7
5.1.2 Test apparatus . 7
5.2 Torsion test . 9
5.2.1 General . 9
5.2.2 Test apparatus . 9
5.3 Stretching test . 10
5.3.1 General . 10
5.3.2 Test apparatus . 10
6 Thermal test methods . 10
6.1 Thermal cycle test . 10
6.1.1 General . 10
6.1.2 Tolerances . 11
6.1.3 Conditioning . 11
6.1.4 Temperature cycle . 11
6.2 Steady heat test . 11
6.2.1 General . 11
6.2.2 Tolerances . 11
6.2.3 Conditioning . 11
6.2.4 Heating . 12
Bibliography . 13
Figure 1 – Bending apparatuses of IEC 62899-201 . 8
Figure 2 – Bending apparatus of IEC 62899-501-1 . 8
Figure 3 – Bending apparatus of IEC 62899-502-1 . 9
Figure 4 – Torsion apparatus of IEC 62899-502-1 . 9
Figure 5 – Stretching apparatus of IEC 62899-502-1 . 10
Figure 6 – Temperature cycle of IEC 62899-505 . 11
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED ELECTRONICS –
Part 550-1: Quality assessment – Framework document on
durability testing – Mechanical and thermal testing
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC TR 62899-550-1 has been prepared by IEC technical committee 119: Printed Electronics.
It is a Technical Report.
The text of this Technical Report is based on the following documents:
Draft Report on voting
119/384/DTR 119/388/RVDTR
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this Technical Report is English.
– 4 – IEC TR 62899-550-1:2022 © IEC 2022
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 62899 series, published under the general title Printed electronics,
can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
INTRODUCTION
The purpose of this document is to describe a framework for evaluating the mechanical and
thermal durability of printed and/or flexible electronics components and products.
Durability testing helps to improve the product and create greater revenue through customer
satisfaction and retention, since it provides the means to identify and ensure a robust product.
Therefore, the standardization and sharing of a consistent method for durability test is an
effective way to facilitate the commoditization and raise the confidence and performance bar of
the relevant industry.
IEC TC 119 has previously published several documents relating to the durability of flexible
electronics components and products. Examples include IEC 62899-201, IEC 62899-501-1,
IEC 62899-502-1, and IEC 62899-505. Although they cover a variety of flexible components
and products, there are many similarities in methods and procedures for durability testing. More
documents will continue to be published in this way. Hence, a general framework is necessary
to ensure solid consistency in the test methods and procedures of printed and/or flexible
electronics. Specifying the consistent methods for durability testing will help users, including
businesses, developers, vendors, and end users, to select a suitable method for durability test
and make consistent test procedures for printed electronics.
Among various durability tests, mechanical and thermal tests are the most common for printed
and/or flexible electronics components and products, since these devices are capable of
undergoing deformation under various mechanical and environmental conditions. The functional
properties will be unaffected by the serious mechanical and environmental changes. Thus, this
document, which is the first framework document for durability testing, addresses mechanical
and thermal durability tests. Further, the types of testing and test method will be continuously
updated and extended to push the growth of the printed electronics industry.
For consistency of the framework, the IEC 62899 series is preferentially referred to for
mechanical and therma
...
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