ASTM F542-02
(Test Method)Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
SCOPE
1.1 This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.
1.2 This test method provides a means to measure the peak exothermic temperature of an encapsulating compound.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 8.
Note 1—There is no equivalent IEC standard.
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An American National Standard
Designation:F542–02
Standard Test Method for
Exothermic Temperature of Encapsulating Compounds for
1
Electronic and Microelectronic Encapsulation
This standard is issued under the fixed designation F 542; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope 4. Summary of Test Method
1.1 This test method provides results that are related to the 4.1 Athermocouple is used to measure the highest tempera-
maximum temperature reached in a specific volume by a ture at the geometric center of a volume of encapsulating
reacting liquid encapsulating compound, and the time from compound in order to characterize the heat generated by the
initial mixing to the time when this peak exothermic tempera- chemical exothermic reaction.
ture is reached.
5. Significance and Use
1.2 This test method provides a means to measure the peak
exothermic temperature of an encapsulating compound. 5.1 Heat generated by a reacting liquid encapsulating com-
pound may cause damage to heat-sensitive electronic compo-
1.3 This standard does not purport to address all of the
safety concerns, if any, associated with its use. It is the nents. Degradation of the encapsulating compound may also
occur at high temperatures. Proper selection of an encapsulate
responsibility of the user of this standard to establish appro-
priate safety and health practices and determine the applica- must include knowledge of its exothermic temperature to
preclude damage to components.
bility of regulatory limitations prior to use. For specific hazard
statements see Section 8. 5.2 Since the exothermic temperature of a reacting encap-
sulating compound varies with the volume and geometry of
NOTE 1—There is no equivalent IEC standard.
material, it is essential that the volume and geometry be
specified in any determination. By selection of an appropriate
2. Referenced Documents
volume and geometry, the exothermic temperature may be
2.1 ASTM Standards:
measured in sufficiently precise and reproducible form for
2
D 1711 Terminology Relating to Electrical Insulation
application evaluation, quality control, and encapsulating com-
D 5423 Specification for Forced-Convection Laboratory
pound characterization.
3
Ovens for Evaluation of Electrical Insulation
5.3 Materials may be compared by testing equal volumes of
each material using the same geometry. Two different volumes
3. Terminology
of the same material in similar geometries may be tested to
3.1 Definitions: For definitions of terms used in this test
determine the effect of volume on the exothermic temperature.
method, refer to Terminology D 1711.
3.2 Definition of Term Specific to This Standard:
6. Interferences
3.2.1 encapsulating compound, n—a resin system used to
6.1 Under normal electronic system encapsulation, the heat
encase electronic components.
sink of the components would reduce the maximum heat
3.2.1.1 Discussion—These resins are generally used to pro-
generated in the encapsulating compound. Since the volume
vide protection from the operating environment and mechani-
and geometry of the electronic system, plus the heat sink of the
cal damage.
components, affect the exothermic temperature of the encap-
sulating compound, it is recommended that actual hardware be
tested in cases in which temperature-sensitive electronics are
1
This test method is under the jurisdiction of ASTM Committee D09 on
utilized.
Electrical and Electronic Insulating Materials, and is the direct responsibility of
Subcommittee D 09.01 on Electrical Insulating Varnishes, Powders and Encapsu-
7. Apparatus
lating Compounds.
Current edition approved Sept. 10, 2002. Published October 2002. Originally
7.1 Specimen Containers for specific test volumes, as fol-
published as F 542 – 77 T. Last previous edition F 542 – 98.
2
lows:
Annual Book of ASTM Standards, Vol 10.01.
3
Annual Book of ASTM Standards, Vol 10.02. 7.1.1 For 50-mL test, borosilicate glass beaker, Griffin,
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F542–02
7.1.2 For 125-mL test, “No. 202 3 204” standard canning 11. Procedure
industry 130 mL can, 54.0 mm in diameter by 57.1 mm in
11.1 Select one or more volumes suitable to the end use.
height,
Test three specimens for each volume selected.
7.1.3 For 150-mL test, borosilicate glass beaker, Griffin,
11.2 Position a thermocouple into the approximate geomet-
low-form,
ric center of each specimen container by means of the glass
7.1.4 For 200-mL test, “No. 202 3 314” standard can
...
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