EN 61967-1:2002

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions

Provides general information and definitions on measurement of conducted and radiated electromagnetic disturbances from integrated circuits. Also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. A test method comparison table is included to assist in selecting the appropriate measurement method(s). Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under controlled conditions, yields information about the potential for RF disturbances in an application of the integrated circuit.

Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen im Frequenzbereich von 150 kHz bis 1 GHz - Teil 1: Allgemeine Bedingungen und Definitionen

Circuits intégrés - Mesure des émissions électromagnétiques, 150 kHz à 1 GHz - Partie 1: Conditions générales et définitions

Fournit des informations générales et des définitions sur la mesure des perturbations électromagnétiques conduites et rayonnées des circuits intégrés. Décrit également les conditions de mesure, les appareils et le montage d'essai, ainsi que les procédures d'essai et le contenu des rapports d'essai. Un tableau de comparaison des méthodes d'essai permet de choisir la ou les méthodes de mesure appropriées. La mesure de la tension et du courant des perturbations RF conduites ou rayonnées, provenant d'un circuit intégré dans des conditions déterminées, fournit des informations sur les perturbations RF potentielles dans une application du circuit intégré.

Integrirana vezja – Meritve elektromagnetnega sevanja, od 150 kHz do 1 GHz – 1. del: Splošni pogoji in definicije (IEC 61967-1:2002)

General Information

• Status: Withdrawn
• Publication Date: 04-Jun-2002
• Withdrawal Date: 30-Apr-2005
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: CLC/SR 47A - Integrated circuits
• Drafting Committee: IEC/SC 47A - IEC_SC_47A
• Parallel Committee: IEC/SC 47A - IEC_SC_47A
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 16-Jan-2022
• Completion Date: 16-Jan-2022
• Ref Project: SIST EN 61967-1:2005 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz -- Part 1: General conditions and definitions

Relations

• Replaced By: EN IEC 61967-1:2019 - Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions
• Effective Date: 19-Feb-2019

Standards Content (Sample)

SLOVENSKI SIST EN 61967-1:2005

STANDARD
december 2005
Integrirana vezja – Meritve elektromagnetnega sevanja, od 150 kHz do 1 GHz –
1. del: Splošni pogoji in definicije (IEC 61967-1:2002)
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz
– Part 1: General conditions and definitions (IEC 61967-1:2002)
ICS 31.200 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 61967-1
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2002
ICS 31.200
English version
Integrated circuits -
Measurement of electromagnetic emissions,
150 kHz to 1 GHz
Part 1: General conditions and definitions
(IEC 61967-1:2002)
Circuits intégrés - Integrierte Schaltungen -
Mesure des émissions électromagnétiques, Messung von elektromagnetischen
150 kHz à 1 GHz Aussendungen im Frequenzbereich
Partie 1: Conditions générales et définitions von 150 kHz bis 1 GHz
(CEI 61967-1:2002) Teil 1: Allgemeine Bedingungen
und Definitionen
(IEC 61967-1:2002)
This European Standard was approved by CENELEC on 2002-05-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands,
Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61967-1:2002 E
Foreword
The text of document 47A/632/FDIS, future edition 1 of IEC 61967-1, prepared by SC 47A, Integrated
circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and
was approved by CENELEC as EN 61967-1 on 2002-05-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-02-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-05-01
Annexes designated "normative" are part of the body of the standard.
Annexes designated "informative" are given for information only.
In this standard, annex ZA is normative and annexes A, B and C are informative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61967:2002 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61000-4-3 NOTE Harmonized as EN 61000-4-3:1996 (modified).
IEC 61000-4-6 NOTE Harmonized as EN 61000-4-6:1996 (not modified).
IEC 61967-4 NOTE Harmonized as EN 61967-4:2002 (not modified).
__________
- 3 - EN 61967-1:2002
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60050-161 - International Electrotechnical --
Vocabulary (IEV)
Chapter 161: Electromagnetic
compatibility
CISPR 16-1 1999 Specification for radio disturbance and--
immunity measuring apparatus and
methods
Part 1: Radio disturbance and immunity
measuring apparatus
CISPR 25 1995 Limits and methods of measurement of--
radio disturbance characteristics for the
protection of receivers used on board
vehicles
ANSI C63.2 1996 American standard for electromagnetic--
noise and field strength instrumentation,
10 Hz to 40 GHz - Specifications

1)
Undated reference.
NORME CEI
INTERNATIONALE IEC
61967-1
INTERNATIONAL
Première édition
STANDARD
First edition
2002-03
Circuits intégrés –
Mesure des émissions électro-
magnétiques, 150 kHz à 1 GHz –
Partie 1:
Conditions générales et définitions
Integrated circuits –
Measurement of electromagnetic
emissions, 150 kHz to 1 GHz
Part 1:
General conditions and definitions
© IEC 2002 Droits de reproduction réservés ⎯ Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail]  Web: www.iec.ch
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Pour prix, voir catalogue en vigueur
For price, see current catalogue

61967-1 © IEC:2002 – 3 –
CONTENTS
FOREWORD.7
1 Scope.11
2 Normative references .11
3 Definitions .13
4 Test conditions .19
4.1 General .19
4.2 Ambient conditions .21
4.2.1 Ambient temperature .21
4.2.2 Ambient RF field strength .21
4.2.3 Other ambient conditions.21
4.2.4 IC stability over time.21
5 Test equipment.21
5.1 General .21
5.2 Shielding .21
5.3 RF measuring instrument .21
5.3.1 Measuring receiver .23
5.3.2 Spectrum analyser.23
5.3.3 Other RBW for narrowband disturbances .23
5.3.4 Disturbance type, detector type and sweep speed .23
5.3.5 Video bandwidth .25
5.3.6 Verification of calibration for the RF measuring instrument .25
5.4 Frequency range .25
5.5 Pre-amplifier or attenuator.25
5.6 System gain .25
5.7 Other components .25
6 Test set-up .25
6.1 General .25
6.2 Test circuit board .27
6.3 IC pin loading .27
6.4 Power supply requirements – Test board power supply .27
6.5 IC specific considerations.29
6.5.1 IC supply voltage.29
6.5.2 IC decoupling .29
6.5.3 Activity of IC .29
6.5.4 Guidelines regarding IC operation .29
7 Test procedure .29
7.1 Ambient check.29
7.2 Operational check .29
7.3 Specific procedures.31

61967-1 © IEC:2002 – 5 –
8 Test report.31
8.1 General .31
8.2 Ambient.31
8.3 Description of device.31
8.4 Description of set-up .31
8.5 Description of software.31
8.6 Data presentation.31
8.6.1 Graphical presentation .31
8.6.2 Software for data capture .31
8.6.3 Data processing .31
8.7 RF emission limits .31
8.8 Interpretation of results .33
8.8.1 Comparison between IC(s) using the same test method.33
8.8.2 Comparison between different test methods .33
8.8.3 Correlation to module test methods .33
9 General basic test board specification .33
9.1 Board description – mechanical.33
9.2 Board description – electrical characteristics .33
9.3 Ground planes.35
9.4 Pins.35
9.4.1 DIL packages .35
9.4.2 SOP, PLCC, QFP packages.35
9.4.3 PGA, BGA packages .35
9.5 Via type.35
9.6 Via distance .37
9.7 Additional components .37
9.7.1 Supply decoupling .37
9.7.2 I/O load .37
Annex A (informative) Test method comparison .41
Annex B (informative) Flow chart of an example counter test code .43
Annex
...