EN 60749-21:2005
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 21: Brasabilité
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
Polprevodniški elementi – Mehanske in klimatske preskusne metode – 21. del: Spajkljivost (IEC 60749-21:2004)
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Standards Content (Sample)
SLOVENSKI SIST EN 60749-21:2005
STANDARD
december 2005
Polprevodniški elementi – Mehanske in klimatske preskusne metode – 21.
del: Spajkljivost (IEC 60749-21:2004)
Semiconductor devices – Mechanical and climatic test methods – Part 21:
Solderability (IEC 60749-21:2004)
ICS 31.080.01 Referenčna številka
© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno
EUROPEAN STANDARD EN 60749-21
NORME EUROPÉENNE
EUROPÄISCHE NORM February 2005
ICS 31.080
English version
Semiconductor devices –
Mechanical and climatic test methods
Part 21: Solderability
(IEC 60749-21:2004)
Dispositifs à semiconducteurs – Halbleiterbauelemente –
Méthodes d'essais mécaniques et Mechanische und klimatische
climatiques Prüfverfahren
Partie 21: Brasabilité Teil 21: Lötbarkeit
(CEI 60749-21:2004) (IEC 60749-21:2004)
This European Standard was approved by CENELEC on 2004-12-07. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-21:2005 E
Foreword
The text of document 47/1741/FDIS, future edition 1 of IEC 60749-21, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-21 on 2004-12-07.
This mechanical and climatic test method, as it relates to solderability, is a complete rewrite of the test
contained in Subclause 2.1, Chapter 2 of EN 60749:1999.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-09-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2008-01-01
__________
Endorsement notice
The text of the International Standard IEC 60749-21:2004 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068 NOTE Harmonized in the EN 60068 series (not modified).
IEC 60749 NOTE Harmonized in the EN 60749 series (not modified).
IEC 60749-15 NOTE Harmonized as EN 60749-15:2003 (not modified).
IEC 60749-20 NOTE Harmonized as EN 60749-20:2003 (not modified).
__________
NORME CEI
INTERNATIONALE
IEC
60749-21
INTERNATIONAL
Première édition
STANDARD
First edition
2004-03
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques
et climatiques –
Partie 21:
Brasabilité
Semiconductor devices –
Mechanical and climatic test methods –
Part 21:
Solderability
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60749-21 IEC:2005 – 3 –
CONTENTS
FOREWORD.7
1 Scope.13
2 Test apparatus .13
2.1 Solder bath.13
2.2 Dipping device.13
2.3 Optical equipment .13
2.4 Steam ageing equipment.15
2.5 Lighting equipment .15
2.6 Materials .15
2.6.1 Flux .15
2.6.2 Solder .15
2.7 SMD reflow equipment .17
2.7.1 Stencil or screen .17
2.7.2 Rubber squeegee or metal spatula .17
2.7.3 Test substrate .17
2.7.4 Solder paste .19
2.7.5 Reflow equipment.19
2.7.6 Flux removal solvent.19
3 Procedure .21
3.1 Preconditioning .21
3.1.1 Preconditioning by steam ageing .21
3.1.2 Preconditioning by high temperature storage .23
3.2 Procedure for dip and look solderability testing .23
3.2.1 Solder dip conditions .23
3.2.2 Procedure.23
3.3 Procedure for simulated board mounting reflow solderability testing of SMDs.39
3.3.1 Test equipment set-up .39
3.3.2 Specimen preparation and surface condition .41
3.3.3 Visual inspection .43
4 Summary.43
Bibliography.45
Figure 1 – Areas to be inspected for gullwing packages.31
Figure 2 – Areas to be inspected for J-lead packages .33
Figure 3 – Areas to be inspected in rectangular components (SMD method) .35
Figure 4 – Areas to be inspected in SOIC and QFP packages (SMD method) .37
Figure 5 – Flat peak type reflow profile .41
60749-21 IEC:2005 – 5 –
Table 1 – Steam ageing conditions .21
Table 2 – Altitude versus steam temperature .21
Table 3 – Solder dip test conditions .23
Table 4 – Maximum limits of solder bath contaminant .29
60749-21 IEC:2005 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 21: Solderability
FOREWORD
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International Standard IEC 60749-21 has been prepared by IEC technical committee 47:
Semiconductor devices.
This standard cancels and replaces IEC/PAS 62173 published in 2000. This first edition
constitutes a technical revision.
This part of the IEC 60749 series completes the full revision of IEC 60749 (1996).
This bilingual version (2005-10) replaces the English version.
60749-21 IEC:2005 – 9 –
The text of this standard is based on the following documents:
FDIS Report on voting
47/1741/FDIS 47/1749/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 60749 consists of the following parts, under the general title Semiconductor devices –
Mechanical and climatic test methods:
Part 1: General
Part 2: Low air pressure
Part 3: External visual inspection
Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
Part 5: Steady-state temperature humidity bias life test
Part 6: Storage at high temperature
Part 7: Internal moisture content measurement and the analysis of other residual gases
Part 8: Sealing
Part 9: Permanence of marking
Part 10: Mechanical shock
Part 11: Rapid change of temperature – Two-fluid-bath method
Part 12: Vibration, variable frequency
Part 13: Salt atmosphere
Part 14: Robustness of terminations (lead integrity)
Part 15: Resista
...
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