EN 61190-1-2:2014

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) modification of the solder powder size in Table 2; b) addition of the information of 'Reflow condition and profile' in Annex B; c) addition of a new Annex C.

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage

Matériaux de fixation pour les assemblages électroniques - Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de haute qualité dans les assemblages de composants électroniques

IEC 61190-1-2:2014-02(en-fr) spécifie les exigences d'ordre général relatives à la caractérisation et à l'essai des pâtes à braser utilisées pour obtenir des interconnexions électroniques de haute qualité dans l'assemblage de composants électroniques. La présente norme sert de document de contrôle de la qualité et n'a pas pour objet de s'intéresser directement à la performance du matériau au cours du procédé de fabrication. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) modification des dimensions granulométriques de la poudre à braser dans le Tableau 2; b) ajout d'informations relatives à la 'Condition et profil de refusion' en Annexe B; c) ajout d'une nouvelle Annexe C.

Povezovalni materiali za elektronske sestave - 1-2. del: Zahteve za spajkalne paste za visokokakovostne povezave v elektronskih sestavih (IEC 61190-1-2:2014)

Standard EN IEC 61190-1-2 določa splošne zahteve za določanje značilnosti in preskušanje spajkalnih past za visokokakovostne elektronske povezave v elektronskih sestavih. Ta standard se uporablja kot dokument za nadzor kakovosti in ni namenjen neposredni navezavi na zmogljivost materiala pri procesu izdelave. Informacije, povezane s karakterizacijo talil, nadzorom kakovosti in dokumentacijo o naročilu za talila za spajkanje in talila, ki vsebujejo materiale, so navedene v standardu IEC 61190-1-1.

General Information

• Status: Published
• Publication Date: 22-May-2014
• Withdrawal Date: 25-Mar-2017
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 23-May-2014
• Completion Date: 23-May-2014
• Ref Project: SIST EN 61190-1-2:2014 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Relations

• Replaces: EN 61190-1-2:2007 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2014
1DGRPHãþD
SIST EN 61190-1-2:2007
Povezovalni materiali za elektronske sestave - 1-2. del: Zahteve za spajkalne paste
za visokokakovostne povezave v elektronskih sestavih (IEC 61190-1-2:2014)
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering
pastes for high-quality interconnects in electronics assembly
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an
Lotpaste für hochwertige Verbindungen in der Elektronikmontage
Matériaux de fixation pour les assemblages électroniques - Partie 1-2: Exigences
relatives aux pâtes à braser pour les interconnexions de haute qualité dans les
assemblages de composants électroniques
Ta slovenski standard je istoveten z: EN 61190-1-2:2014
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 61190-1-2

NORME EUROPÉENNE
EUROPÄISCHE NORM
May 2014
ICS 31.190 Supersedes EN 61190-1-2:2007
English Version
Attachment materials for electronic assembly - Part 1-2:
Requirements for soldering pastes for high-quality interconnects
in electronics assembly
(IEC 61190-1-2:2014)
Matériaux de fixation pour les assemblages électroniques - Verbindungsmaterialien für Baugruppen der Elektronik - Teil
Partie 1-2: Exigences relatives aux pâtes à braser pour les 1-2: Anforderungen an Lotpaste für hochwertige
interconnexions de haute qualité dans les assemblages de Verbindungen in der Elektronikmontage
composants électroniques (IEC 61190-1-2:2014)
(CEI 61190-1-2:2014)
This European Standard was approved by CENELEC on 2014-03-26. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 61190-1-2:2014 E
Foreword
The text of document 91/1154A/FDIS, future edition 3 of IEC 61190-1-2, prepared by IEC/TC 91
"Electronics assembly technology " was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61190-1-2:2014.
The following dates are fixed:
(dop) 2014-12-26
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2017-03-26
• latest date by which the national
standards conflicting with the
document have to be withdrawn
This document supersedes EN 61190-1-2:2007.

2:2007:
a) modification of the solder powder size in Table 2;
b) addition of the information of “Reflow condition and profile” in Annex B;
c) addition of a new Annex C.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 61190-1-2:2014 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61189-5:2006 NOTE Harmonised as EN 61189-5:2006 (not modified).
IEC 61189-6:2006 NOTE Harmonised as EN 61189-6:2006 (not modified).

- 3 - EN 61190-1-2:2014
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60194 - Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions

IEC 61189-5-3 - Test methods for electrical materials, EN 61189-5-3 -
interconnection structures and assemblies -
Part 5-3: Test methods for printed board
assemblies: Soldering paste
IEC 61190-1-1 - Attachment materials for electronic - -
assemblies -
Part 1-1: Requirements for soldering fluxes

IEC 61190-1-3 - Attachment materials for electronic assembly - EN 61190-1-3 -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications

ISO 9454-2 - Soft soldering fluxes - Classification and EN ISO 9454-2 -
requirements -
Part 2: Performance requirements

IEC 61190-1-2 ®
Edition 3.0 2014-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Attachment materials for electronic assembly –

Part 1-2: Requirements for soldering pastes for high-quality interconnects in

electronics assembly
Matériaux de fixation pour les assemblages électroniques –

Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de

haute qualité dans les assemblages de composants électroniques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX T
ICS 31.190 ISBN 978-2-83221-423-7

– 2 – 61190-1-2  IEC:2014
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Standardized description for products . 8
5 Test methods . 8
6 Requirements . 9
6.1 General . 9
6.2 Conflict . 9
6.3 Alloy composition . 9
6.4 Flux characterization and inspection . 9
6.4.1 General . 9
6.4.2 Shelf life . 10
6.5 Solder powder particle size . 10
6.5.1 Powder size determination . 10
6.5.2 Powder size . 10
6.5.3 Solder powder particle shape. 11
Metal per cent . 11
6.6
6.7 Viscosity . 11
6.7.1 General . 11
6.7.2 Methods of determining viscosity . 11
6.8 Slump and smear test . 12
6.8.1 General . 12
6.8.2 Test with 0,2 mm thick stencil . 12
6.8.3 Test with 0,1 mm thick stencil . 12
6.9 Solder ball test . 13
6.9.1 General . 13
6.9.2 Type 1-4 powder . 13
6.9.3 Type 5-7 powder . 13
Tack test . 14
6.10
6.11 Wetting . 14
6.12 Labelling . 14
7 Quality assurance provisions . 15
7.1 Responsibility for inspection . 15
7.1.1 General . 15
7.1.2 Responsibility for compliance . 16
7.1.3 Test equipment and inspection facilities . 16
7.1.4 Inspection conditions . 16
7.2 Classification for inspections . 16
7.3 Inspection report form . 16
7.4 Qualification inspection . 16
7.4.1 General . 16
7.4.2 Sample size . 17
7.4.3 Inspection routine . 17
7.5 Quality conformance . 17

61190-1-2  IEC:2014 – 3 –
7.5.1 General . 17
7.5.2 Sampling plan . 17
7.5.3 Rejected lots . 17
8 Preparation for delivery . 17
9 Additional information – Performance and shelf life extension inspections . 18
Annex A (normative) Test report on solder paste . 19
Annex B (informative) Reflow condition and profile . 20
Annex C (informative) Typical comparison of particle size distributions between laser
diffraction method and screen method . 21
Bibliography . 22

Figure 1 – Slump test stencil thickness, 0,20 mm . 12
Figure 2 – Slump test stencil thickness, 0,10 mm . 13
Figure 3 – Solder ball test standards . 15
Figure C.1 – Typical comparison between laser diffraction and sieving . 21

Table
...