Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) modification of the solder powder size in Table 2; b) addition of the information of 'Reflow condition and profile' in Annex B; c) addition of a new Annex C.

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage

Matériaux de fixation pour les assemblages électroniques - Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de haute qualité dans les assemblages de composants électroniques

IEC 61190-1-2:2014-02(en-fr) spécifie les exigences d'ordre général relatives à la caractérisation et à l'essai des pâtes à braser utilisées pour obtenir des interconnexions électroniques de haute qualité dans l'assemblage de composants électroniques. La présente norme sert de document de contrôle de la qualité et n'a pas pour objet de s'intéresser directement à la performance du matériau au cours du procédé de fabrication. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) modification des dimensions granulométriques de la poudre à braser dans le Tableau 2; b) ajout d'informations relatives à la 'Condition et profil de refusion' en Annexe B; c) ajout d'une nouvelle Annexe C.

Povezovalni materiali za elektronske sestave - 1-2. del: Zahteve za spajkalne paste za visokokakovostne povezave v elektronskih sestavih (IEC 61190-1-2:2014)

Standard EN IEC 61190-1-2 določa splošne zahteve za določanje značilnosti in preskušanje spajkalnih past za visokokakovostne elektronske povezave v elektronskih sestavih. Ta standard se uporablja kot dokument za nadzor kakovosti in ni namenjen neposredni navezavi na zmogljivost materiala pri procesu izdelave. Informacije, povezane s karakterizacijo talil, nadzorom kakovosti in dokumentacijo o naročilu za talila za spajkanje in talila, ki vsebujejo materiale, so navedene v standardu IEC 61190-1-1.

General Information

Status
Published
Publication Date
22-May-2014
Withdrawal Date
25-Mar-2017
Current Stage
6060 - Document made available - Publishing
Start Date
23-May-2014
Completion Date
23-May-2014

Relations

Buy Standard

Standard
EN 61190-1-2:2014 - BARVE
English language
25 pages
sale 10% off
Preview
sale 10% off
Preview
e-Library read for
1 day

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61190-1-2:2014
01-september-2014
1DGRPHãþD
SIST EN 61190-1-2:2007
Povezovalni materiali za elektronske sestave - 1-2. del: Zahteve za spajkalne paste
za visokokakovostne povezave v elektronskih sestavih (IEC 61190-1-2:2014)
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering
pastes for high-quality interconnects in electronics assembly
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an
Lotpaste für hochwertige Verbindungen in der Elektronikmontage
Matériaux de fixation pour les assemblages électroniques - Partie 1-2: Exigences
relatives aux pâtes à braser pour les interconnexions de haute qualité dans les
assemblages de composants électroniques
Ta slovenski standard je istoveten z: EN 61190-1-2:2014
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61190-1-2:2014 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

SIST EN 61190-1-2:2014

---------------------- Page: 2 ----------------------

SIST EN 61190-1-2:2014


EUROPEAN STANDARD EN 61190-1-2

NORME EUROPÉENNE

EUROPÄISCHE NORM
May 2014
ICS 31.190 Supersedes EN 61190-1-2:2007
English Version
Attachment materials for electronic assembly - Part 1-2:
Requirements for soldering pastes for high-quality interconnects
in electronics assembly
(IEC 61190-1-2:2014)
Matériaux de fixation pour les assemblages électroniques - Verbindungsmaterialien für Baugruppen der Elektronik - Teil
Partie 1-2: Exigences relatives aux pâtes à braser pour les 1-2: Anforderungen an Lotpaste für hochwertige
interconnexions de haute qualité dans les assemblages de Verbindungen in der Elektronikmontage
composants électroniques (IEC 61190-1-2:2014)
(CEI 61190-1-2:2014)
This European Standard was approved by CENELEC on 2014-03-26. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 61190-1-2:2014 E

---------------------- Page: 3 ----------------------

SIST EN 61190-1-2:2014
EN 61190-1-2:2014 - 2 -
Foreword
The text of document 91/1154A/FDIS, future edition 3 of IEC 61190-1-2, prepared by IEC/TC 91
"Electronics assembly technology " was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61190-1-2:2014.

The following dates are fixed:
(dop) 2014-12-26
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement

(dow) 2017-03-26
• latest date by which the national
standards conflicting with the
document have to be withdrawn

This document supersedes EN 61190-1-2:2007.

EN 61190-1-2:2014 includes the following significant technical changes with respect to EN 61190-1-
2:2007:

a) modification of the solder powder size in Table 2;
b) addition of the information of “Reflow condition and profile” in Annex B;
c) addition of a new Annex C.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 61190-1-2:2014 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:

IEC 61189-5:2006 N
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.