EN 60749-21:2011

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

IEC 60749-21:2011 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification.
NOTE 1 This test method is in general accord with IEC 60068, but due to specific requirements of semiconductors, the following text is applied.
NOTE 2 This test method does not assess the effect of thermal stresses which may occur during the soldering process. Reference should be made IEC 60749-15 or IEC 60749-20.
This standard cancels and replaces the first edition published in 2004 and constitutes a technical revision. The significant change is the inclusion of Pb (lead)-free backward compatibility.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit

Dispositifs à semiconducteur - Méthodes d'essai mécaniques et climatiques - Partie 21: Brasabilité

La CEI 60749-21:2011 établit une procédure normalisée pour déterminer la brasabilité des sorties des boîtiers de dispositifs qui sont destinées à être fixées sur une autre surface en utilisant de la brasure étain-plomb (SnPb) ou sans-plomb pour réaliser cette fixation. Cette méthode d'essai décrit une procédure pour les essais de brasabilité par 'immersion puis examen visuel' des dispositifs à montage en surface (CMS) par trous traversants, axial et en surface, ainsi qu'une procédure optionnelle d'essai de brasabilité pour des CMS pour montage en surface sur carte afin de permettre la simulation du processus de brasage devant être utilisé dans l'application du dispositif. La méthode d'essai fournit également des conditions optionnelles pour le vieillissement. Cet essai est considéré comme destructif sauf indication contraire dans la spécification applicable.
NOTE 1 Cette méthode d'essai est en accord général avec la CEI 60068, mais c'est le texte ci-dessous qui s'applique compte tenu des exigences spécifiques que présentent les semiconducteurs.
NOTE 2 Cette méthode d'essai ne prend pas en compte l'effet des contraintes thermiques qui peuvent se produire pendant la procédure de brasage. Il convient de faire référence à la CEI 60749-15 ou à la CEI 60749-20.
La présente norme annule et remplace la première édition publiée en 2004 et constitue une révision technique. La modification importante qui a été apportée est l'ajout de la compatibilité descendante de la brasure sans plomb (Pb).

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 21. del: Spajkljivost

Ta del IEC 60749 vzpostavlja standardni postopek za določanje spajkljivosti končnikov paketa elementov, ki se združujejo na drugo površino z uporabo kositrovo-svinčene (SnPb) ali nesvinčene (brez Pb) spajke za pritrditev. Ta preskusna metoda zagotavlja postopek za preskušanje spajkljivosti s »potapljanjem in opazovanjem« skozi luknje, osno in površinsko nameščenih elementov (SMD) ter izbirni postopek za preskus spajkljivosti s priklopom na ploščo za SMD, ki omogoča simulacijo spajkalnega postopka pri uporabi elementov. Preskusna metoda podaja tudi optimalne pogoje za staranje. Ta preskus velja za porušitvenega, razen če je v ustrezni specifikaciji navedeno drugače.

General Information

• Status: Published
• Publication Date: 18-Aug-2011
• Withdrawal Date: 11-May-2014
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 19-Aug-2011
• Completion Date: 19-Aug-2011
• Ref Project: SIST EN 60749-21:2011 - Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

Relations

• Replaces: EN 60749-21:2005 - Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60749-21:2011
01-oktober-2011
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 21. del:
Spajkljivost
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
21: Brasabilité
Ta slovenski standard je istoveten z: EN 60749-21:2011
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60749-21:2011 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60749-21:2011

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SIST EN 60749-21:2011

EUROPEAN STANDARD
EN 60749-21
NORME EUROPÉENNE
August 2011
EUROPÄISCHE NORM

ICS 31.080.01 Supersedes EN 60749-21:2005


English version


Semiconductor devices -
Mechanical and climatic test methods -
Part 21: Solderability
(IEC 60749-21:2011)


Dispositifs à semiconducteur - Halbleiterbauelemente -
Méthodes d'essai mécaniques et Mechanische und klimatische
climatiques - Prüfverfahren -
Partie 21: Brasabilité Teil 21: Lötbarkeit
(CEI 60749-21:2011) (IEC 60749-21:2011)





This European Standard was approved by CENELEC on 2011-05-12. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

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Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-21:2011 E

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SIST EN 60749-21:2011
EN 60749-21:2011 - 2 -

Foreword
The text of document 47/2082/FDIS, future edition 2 of IEC 60749-21, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-21 on 2011-05-12.
This European Standard supersedes EN 60749-21:2005.
EN 60749-21:2011 cancels and replaces EN 60749-21:2005 and constitutes a technical revision. The
significant change is the inclusion of Pb (lead)–free backward compatibility.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2012-02-12
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2014-05-12
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-21:2011 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068 series NOTE  Harmonized in EN 60068 series.
IEC 60068-2-69:2007 NOTE  Harmonized as EN 60068-2-69:2007 (not modified).
IEC 60749 series NOTE  Harmonized in EN 60749 series.
IEC 60749-15:2003 NOTE  Harmonized as EN 60749-15:2003 (not modified).
IEC 60749-20:2008 NOTE  Harmonized as EN 60749-20:2009 (not modified).
__________

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SIST EN 60749-21:2011
- 3 - EN 60749-21:2011
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cite
...